Dual Grounding Environment

Caution To be compatible with grounding environments requiring isolation between logic 0V and chassis ground, the fitted grounding bridge plate must be removed and individual connections made to logic 0V and chassis ground studs. The grounding bridge plate is located on the middle rear left edge of the unit between the motherboards. The grounding studs at the base of the chassis are M5 studs with appropriate nuts already installed.

Before installation for dual grounding systems, remove the link from the chassis to logic 0V. This exposes a 2-hole lug with tapped M5 threads (refer to FIGURE 3-3).

Caution The use of certain PCI cards causes the frame and logic grounds to be commoned. Refer to the documentation supplied with the PCI card.

To Connect the Ground Lead

1.Strip 9mm of insulation from each end of the grounding lead.

2.Insert the lead into the Thomas & Betts two-hole lug provided (part no. 52024-UB). Ensure that both the conductor and its insulation are gripped by the lug.

3.Position the lug and grounding lead assembly over the grounding studs.

Refer to FIGURE 3-3on page 3-50. Tighten the two M5 nuts over the locking washers provided.

4.Make the connection to the earthing bar at the end of the grounding lead. Ensure there is adequate strain relief for the cable.

Chapter 3 Electrical Supply Installation 49

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Sun Microsystems 1800 manual Dual Grounding Environment, To Connect the Ground Lead

1800 specifications

Sun Microsystems, founded in 1982, unveiled an array of innovative products over the years, among which the Sun-1 workstation and later the Sun-1800 series were significant contributions to the technology landscape. Designed specifically for engineering, graphics, and computing tasks, the Sun-1800 series emerged during a period when workstations were essential for high-performance computing applications.

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