1 Hardware Overview
1-8 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
The system unit is composed of the following major components:
Processor
• Intel Mobile Pentium-M Processor
– Processor core speed: 1.73GHz/1.86GHz/2.0AGHz/2.13GHz/2.26GHz
– Processor bus speed: 533MHz
– Integrated L1 cache memory: 32KB instruction cache and 32KB write-back
data cache
– Integrated L2 cache memory: 2MB
– Integrated NDP
Memory
Two memory slots are provided. Expansion up to 2GB (2,048MB) is available.
Memory
• DDR2-SDRAM
• DDR400 or DDR533 memory
• 1.8 volt operation
• FBGA
Memory Module
• 240 pin, SO Dual In-line Memory Module (SO-DIMM)
• PC2-3200 or PC2-4200
• 256MB/512MB/1GB
– 256 MB 256Mb×8
– 512 MB 512Mb×8
– 1GB 512Mb×16
Firmware Hub (FWH)
• One STMicro M50FW080N is used.
• 8Mbits of flash memory are used.
PCI chipset
This gate array incorporates the following elements and functions.
• North Bridge (Intel GMCH, AlvisoPM)
– Dothan Processor System Bus Support
– System memory interface
– DRAM Controller: DDR333, DDR2-400/DDR2-533 Support, 2GB max
– X16 PCI Express Graphics Interface
– DMI (Direct Media Interface)
– 1257-ball, 40.0×40.0 mm, FC-BGA package