Compaq manual Overview, 1. M-LVDS Devices Supported by the EVM

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Overview

1.1 Overview

The EVM comes with all the production devices in Table 1−1. The SN65MLVD201 and SN65MLVD207 are installed on the circuit board, and can easily be replaced with the other devices supplied. The M-LVDS devices evaluated with this EVM are in the SN75ALS180 and SN75176 footprint. Use of these industry standard footprints allows the designer to easily configure the parts into a simplex or half-duplex data bus. These are all TIA/EIA−899 M-LVDS standard compliant devices. While initially intended for half-duplex or multipoint applications, M-LVDS devices are not precluded from being used in a point-to-point or multidrop configuration. In these configurations there can be a distinct advantage to the additional current drive provided by an M-LVDS driver.

The M-LVDS devices shown in Table 1−1 all include output slew-rate limited drivers, thus the need for different nominal signaling rates. The M-LVDS standard recommends the transition time not exceed 0.5 of the unit interval (UI). The definition of transition time (tr and tf) in M-LVDS is the 10% to 90% levels shown in Figure 1−1. Using the maximum transition time for each of the drivers and the 0.5(tUI) rule results in the signaling rates shown in Table 1−1. This slew-rate control differentiates M-LVDS devices from LVDS (TIA/EIA−644A) compliant devices. The slower transition times available with M-LVDS help to reduce higher frequency components in the transmitted signal. This reduces EMI and allows longer stubs on the main transmission line. For this reason it is generally better to select a driver with a specified signaling rate no greater than is required in the system.

Figure 1−1. M-LVDS Unit Interval Definition

tr

tf

90%

50%

10%

UI

Table 1−1. M-LVDS Devices Supported by the EVM

Nominal

 

Receiver

Part

 

Signaling Rate

Footprints

Status

Type

Number

(Mbps)

 

 

 

 

 

 

 

 

 

 

 

100

SN75176

Type-1

SN65MLVD200AD

Production

 

 

 

 

 

200

SN75176

Type-1

SN65MLVD201D

Production

 

 

 

 

 

100

SN75ALS180

Type-1

SN65MLVD202AD

Production

 

 

 

 

 

200

SN75ALS180

Type-1

SN65MLVD203D

Production

 

 

 

 

 

100

SN75176

Type-2

SN65MLVD204AD

Production

 

 

 

 

 

100

SN75ALS180

Type-2

SN65MLVD205AD

Production

 

 

 

 

 

200

SN75176

Type-2

SN65MLVD206D

Production

 

 

 

 

 

200

SN75ALS180

Type-2

SN65MLVD207D

Production

1-2

The M-LVDS Evaluation Module

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Contents User’s Guide Important Notice EVM Important Notice EVM Warnings and Restrictions How to Use This Manual PrefacePage Contents Figures TablesM-LVDS Evaluation Module TopicOverview −1. M-LVDS Devices Supported by the EVMLvds Standard TIA/EIA−899 Lvds EVM Kit Contents Configurations Point-to-PointMultidrop MultipointEVM Operation With Separate Power Supplies −7. Two-Node Multipoint CircuitPS1 PS2 PS3 Recommended EquipmentTest Setup −1. EVM Configuration Options Typical Cable Test ConfigurationsPoint-to-Point Simplex Transmission Point-to-Point Parallel Terminated Simplex Transmission Two-Node Multipoint Transmission−3. Two-Node Multipoint Transmission Test Results −4. Point-to-Point Parallel Simplex Typical Eye Pattern DataDriver Input Receiver #1 Output Receiver #2 Bill of Materials, Board Layout, and PCB Construction Bill of Materials −1. M-LVDS EVM Bill of Materials−1. Assembly Drawing Board LayoutÏïïïïïïïïïïïïï Ï Ìììììììììììììì Ì −5. Bottom Layer PCB Construction + 2 Z 374e * 2.9s hMicrostripstripline −2. EVM Layer Stack Up MilsSchematic This Appendix contains the EVM schematicVCC