Compaq M-LVDS manual Ïïïïïïïïïïïïïï Ï Ìììììììììììììì Ì

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Board Layout

The second layer of the EVM has the separate ground planes. These are the reference planes for the controlled impedance traces on the top layer.

Figure 3−3. Second Layer

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The third layer of the EVM has the power planes. These are matched to the ground planes to reduce radiated emission and crosstalk, while increasing distributed capacitance.

Figure 3−4. Third Layer

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3-4	Bill of Materials, Board Layout, and PCB Construction

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Contents User’s Guide Important Notice EVM Important Notice EVM Warnings and Restrictions How to Use This Manual PrefacePage Contents Figures TablesM-LVDS Evaluation Module TopicOverview −1. M-LVDS Devices Supported by the EVMLvds Standard TIA/EIA−899 Lvds EVM Kit Contents Configurations Point-to-PointMultidrop MultipointEVM Operation With Separate Power Supplies −7. Two-Node Multipoint CircuitPS1 PS2 PS3 Recommended EquipmentTest Setup Point-to-Point Simplex Transmission Typical Cable Test Configurations−1. EVM Configuration Options Point-to-Point Parallel Terminated Simplex Transmission Two-Node Multipoint Transmission−3. Two-Node Multipoint Transmission Test Results −4. Point-to-Point Parallel Simplex Typical Eye Pattern DataDriver Input Receiver #1 Output Receiver #2 Bill of Materials, Board Layout, and PCB Construction Bill of Materials −1. M-LVDS EVM Bill of Materials−1. Assembly Drawing Board LayoutÏïïïïïïïïïïïïï Ï Ìììììììììììììì Ì −5. Bottom Layer PCB Construction + 2 Z 374e * 2.9s hMicrostripstripline −2. EVM Layer Stack Up MilsSchematic This Appendix contains the EVM schematicVCC