Compaq M-LVDS manual PS1 PS2 PS3, Recommended Equipment

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Recommended Equipment

Figure 1−8. EVM Configuration for Including a Ground Potential Difference Voltage Between Nodes

PS1

PS2

PS3

+

−

+

−

+

−

J13
J14
W9	W7	W8
J17
J18

W10

Jumpers removed from

W7, W8, W9, W10

1.5Recommended Equipment

-3.3 Vdc at 0.5-A power supply or multiple power supplies (with both devices powered and enabled the board draws about 35 mA).

-A 100-Ωtransmission medium from the driver to the receiver, (twisted-pair cable recommended, CAT5 cable for example).

-A function or pattern generator capable of supplying 3.3-V signals at the desired signaling rate.

-A multiple-channel high-bandwidth oscilloscope, preferably above the 1-GHz range

-Differential or single ended oscilloscope probes.

1-8	The M-LVDS Evaluation Module

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Contents User’s Guide Important Notice EVM Important Notice EVM Warnings and Restrictions How to Use This Manual PrefacePage Contents Figures TablesM-LVDS Evaluation Module TopicOverview −1. M-LVDS Devices Supported by the EVMLvds Standard TIA/EIA−899 Lvds EVM Kit Contents Configurations Point-to-PointMultidrop MultipointEVM Operation With Separate Power Supplies −7. Two-Node Multipoint CircuitPS1 PS2 PS3 Recommended EquipmentTest Setup −1. EVM Configuration Options Typical Cable Test ConfigurationsPoint-to-Point Simplex Transmission Point-to-Point Parallel Terminated Simplex Transmission Two-Node Multipoint Transmission−3. Two-Node Multipoint Transmission Test Results −4. Point-to-Point Parallel Simplex Typical Eye Pattern DataDriver Input Receiver #1 Output Receiver #2 Bill of Materials, Board Layout, and PCB Construction Bill of Materials −1. M-LVDS EVM Bill of Materials−1. Assembly Drawing Board LayoutÏïïïïïïïïïïïïï Ï Ìììììììììììììì Ì −5. Bottom Layer PCB Construction + 2 Z 374e * 2.9s hMicrostripstripline −2. EVM Layer Stack Up MilsSchematic This Appendix contains the EVM schematicVCC