Compaq M-LVDS manual 2. EVM Layer Stack Up, Mils

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PCB Construction

Table 3−2 shows the layer stack up of the EVM with the defined trace widths for the controlled impedance etch runs using microstrip construction.

Table 3−2. EVM Layer Stack Up

Material						Differential Model			Single-Ended		Model
	Layer	Layer	Thickness	Copper
					Line				Line
Type:					Line		Spacing	Impedance	Line	Impedance
Type:	No.	Type	(mils)	Weight	Width		Spacing	Impedance	Width	Impedance
FR 406	No.	Type	(mils)	Weight	Width		(mils)	(Ω)	Width		(Ω)
FR 406					(mils)		(mils)	(Ω)	(mils)		(Ω)
					(mils)				(mils)

	1	Signal	0.0006	0.5 oz (start)	0.027		0.230	100	0.0420		50

PREPREG			0.025

	2	Plane	0.0012	1

CORE			0.004

	3	Plane	0.0012	1

PREPREG			0.025

	4	Signal	0.0006	0.5 oz (start)	0.027		0.230	100	0.0420		50

3-8	Bill of Materials, Board Layout, and PCB Construction

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Contents User’s Guide Important Notice EVM Important Notice EVM Warnings and Restrictions How to Use This Manual PrefacePage Contents Figures TablesM-LVDS Evaluation Module TopicOverview −1. M-LVDS Devices Supported by the EVMLvds Standard TIA/EIA−899 Lvds EVM Kit Contents Configurations Point-to-PointMultidrop MultipointEVM Operation With Separate Power Supplies −7. Two-Node Multipoint CircuitPS1 PS2 PS3 Recommended EquipmentTest Setup Typical Cable Test Configurations −1. EVM Configuration OptionsPoint-to-Point Simplex Transmission Point-to-Point Parallel Terminated Simplex Transmission Two-Node Multipoint Transmission−3. Two-Node Multipoint Transmission Test Results −4. Point-to-Point Parallel Simplex Typical Eye Pattern DataDriver Input Receiver #1 Output Receiver #2 Bill of Materials, Board Layout, and PCB Construction Bill of Materials −1. M-LVDS EVM Bill of Materials−1. Assembly Drawing Board LayoutÏïïïïïïïïïïïïï Ï Ìììììììììììììì Ì −5. Bottom Layer PCB Construction + 2 Z 374e * 2.9s hMicrostripstripline −2. EVM Layer Stack Up MilsSchematic This Appendix contains the EVM schematicVCC