Compaq M-LVDS manual Lvds Standard TIA/EIA−899

Page 11

M-LVDS Standard TIA/EIA−899

The EVM has been designed with the individual driver and receiver section (SN75ALS180 footprint, U1) on one half of the board and the transceiver section (SN75176 footprint, U2) on the other half (see Figure 3−1). The EVM as delivered incorporates two 100-termination resistors at each driver output, receiver input, and transceiver I/O. These allow the user to evaluate a single driver, receiver, or transceiver, while not having to deal with a transmission line or additional I/Os.

Jumpers are included to allow the two sections of the EVM to either share the same power and ground or be run off of independent supplies. Ground shifts or common-mode offsets can be introduced by the removal of these jumpers and using separate power supplies.

1.2 M-LVDS Standard TIA/EIA−899

The M-LVDS standard was created in response to a demand from the data communications community for a general-purpose high-speed balanced interface standard for multipoint applications. The TIA/EIA−644 standard defines the LVDS electrical-layer characteristics used for transmitting information in point-to-point and multidrop architectures. TIA/EIA−644 does not address data transmission for multipoint architectures, therefore the need for development of a new standard.

The standard, Electrical Characteristics of Multipoint-Low-Voltage Differential Signaling (M-LVDS) TIA/EIA−899, specifies low-voltage differential signaling drivers and receivers for data interchange across half-duplex or multipoint data bus structures. M-LVDS is capable of operating at signaling rates up to 500 Mbps. In other words, when the devices are used at the nominal signaling rate, the rise and fall times will be within the specified values in the standard. The M-LVDS standard defines the transition time (tr and tf) to be 1 ns or slower into a test load. Using this information combined with the requirement that the transition time not exceed 0.5 of the unit interval (UI), gives a minimum unit interval of 2 ns, leading to the 500 Mpbs maximum signaling rate.

The standard defines Type-1 and Type-2 receivers. Type-1 receivers include no provisions for failsafe and have their differential input voltage thresholds near zero volts. Type-2 receivers have their differential input voltage thresholds offset from zero volts to detect the absence of a voltage difference. Type-1 receivers maximize the differential noise margin and are intended for the maximum signaling rate. Type-2 receivers are intended for control signals, slower signaling rates, or where failsafe provisions are needed. The bus voltage logic state definition can be seen in Table 1−2 and Figure 1−2.

The M-LVDS Evaluation Module

1-3

Image 11
Contents User’s Guide Important Notice EVM Important Notice EVM Warnings and Restrictions Preface How to Use This ManualPage Contents Tables FiguresTopic M-LVDS Evaluation Module−1. M-LVDS Devices Supported by the EVM OverviewLvds Standard TIA/EIA−899 Lvds EVM Kit Contents Point-to-Point ConfigurationsMultipoint Multidrop−7. Two-Node Multipoint Circuit EVM Operation With Separate Power SuppliesRecommended Equipment PS1 PS2 PS3Test Setup Point-to-Point Simplex Transmission Typical Cable Test Configurations−1. EVM Configuration Options Two-Node Multipoint Transmission Point-to-Point Parallel Terminated Simplex Transmission−3. Two-Node Multipoint Transmission −4. Point-to-Point Parallel Simplex Typical Eye Pattern Data Test ResultsDriver Input Receiver #1 Output Receiver #2 Bill of Materials, Board Layout, and PCB Construction −1. M-LVDS EVM Bill of Materials Bill of MaterialsBoard Layout −1. Assembly DrawingÏïïïïïïïïïïïïï Ï Ìììììììììììììì Ì −5. Bottom Layer + 2 Z 374e * 2.9s h PCB ConstructionMicrostripstripline Mils −2. EVM Layer Stack UpThis Appendix contains the EVM schematic SchematicVCC