Compaq M-LVDS manual PCB Construction, + 2 Z 374e * 2.9s h

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PCB Construction

3.3 PCB Construction

Information in this section was obtained from the following source:

-Electromagnetic Compatibility Printed Circuit Board and Electronic Module Design, VEC workshop, Violette Engineering Corporation.

Characteristic impedance is the ratio of voltage to current in a transmission line wave traveling in one direction. This characteristic impedance is the value that is matched with our termination resistors so as to reduce reflections. This reduction in reflections improves signal to noise ratio on the line and reduces EMI caused by common mode voltages and spikes.

Two typical approaches are used for controlled impedance in printed-circuit board construction, microstrip and stripline. Microstrip construction is shown in Figure 3−6. The characteristic impedance of a microstrip trace on a printed-circuit board is approximated by:

ZO

+

60

 

ln

4h

 

 

 

 

0.67(0.8 W ) t)

(1)

￿0.475år ) 0.67

 

 

 

where εr is the permeability of the board material, h is the distance between the ground plane and the signal trace, W is the trace width, and t is the thickness of the trace. The differential impedance for a two microstrip traces can be approximated as follows with S being the distance between two microstrip traces:

Z

DIFF

+ 2 Z

O

￿1 * 0.48e*0.96s￿h￿

 

 

(2)

Stripline construction is also shown in Figure 3−6, the signal lines should be centered between the ground planes. The characteristic impedance of a stripline trace in a printed-circuit board is approximated by:

ZO +

60

ln

4h

(3)

￿

 

0.67p(0.8 W ) t)

 

år

where εr is the permeability of the board material, h is the distance between the ground plane and the signal trace, W is the trace width, and t is the thickness of the trace. The differential impedance for a two stripline traces can be approximated as follows with S being the distance between two stripline traces:

Z

DIFF

+ 2 Z

O

￿1 * 0.374e*2.9s￿h￿

 

 

(4)

Note:

For edge-coupled striplines, the term 0.374 may be replaced with 0.748 for lines which

 

 

are closely coupled (S < 12 mils, or 0,3 mm).

3-6

Bill of Materials, Board Layout, and PCB Construction

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Contents User’s Guide Important Notice EVM Important Notice EVM Warnings and Restrictions How to Use This Manual PrefacePage Contents Figures TablesM-LVDS Evaluation Module TopicOverview −1. M-LVDS Devices Supported by the EVMLvds Standard TIA/EIA−899 Lvds EVM Kit Contents Configurations Point-to-PointMultidrop MultipointEVM Operation With Separate Power Supplies −7. Two-Node Multipoint CircuitPS1 PS2 PS3 Recommended EquipmentTest Setup −1. EVM Configuration Options Typical Cable Test ConfigurationsPoint-to-Point Simplex Transmission Point-to-Point Parallel Terminated Simplex Transmission Two-Node Multipoint Transmission−3. Two-Node Multipoint Transmission Test Results −4. Point-to-Point Parallel Simplex Typical Eye Pattern DataDriver Input Receiver #1 Output Receiver #2 Bill of Materials, Board Layout, and PCB Construction Bill of Materials −1. M-LVDS EVM Bill of Materials−1. Assembly Drawing Board LayoutÏïïïïïïïïïïïïï Ï Ìììììììììììììì Ì −5. Bottom Layer PCB Construction + 2 Z 374e * 2.9s hMicrostripstripline −2. EVM Layer Stack Up MilsSchematic This Appendix contains the EVM schematicVCC