Compaq M-LVDS manual 7. Two-Node Multipoint Circuit, EVM Operation With Separate Power Supplies

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Configurations

Figure 1−7. Two-Node Multipoint Circuit

T

U1

T

U2

1.4.4EVM Operation With Separate Power Supplies

The EVM has been designed with independent power planes for the two devices. The two devices can be powered with independent supplies or with a single supply. Sending and receiving data between backplanes, racks, or cabinets where separate power sources may exist can have offset ground potentials between nodes. Jumpers W7, 8, 9, and 10 tie the two separate power and ground planes together. If two separate supplies are used and jumpers W7, 8, 9, and 10 are removed, care should be taken to ensure the absolute maximum device ratings are not exceeded. Keep in mind that if jumpers W7, 8, 9, and 10 are not removed when using separate power supplies, a difference in potential between the supplies causes a current to flow between supplies and through the jumpers.

The EVM can be configured with three power supplies with isolated outputs in such a way as to input a fixed offset between the grounds (see Figure 1−8). This induces a ground potential difference voltage between U1 and U2. To demonstrate this capability, the following steps should be followed.

-Adjust PS1 and PS3 to the supply voltage (3.3 V) and current limit to 50 mA.

-Set PS2 to 0 V

-Induce a ground offset by varying the output of PS2.

PS2 Output

The PS2 output should not exceed ± 2 V to remain within the device ratings.

The M-LVDS Evaluation Module

1-7

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Contents User’s Guide Important Notice EVM Important Notice EVM Warnings and Restrictions Preface How to Use This ManualPage Contents Tables FiguresTopic M-LVDS Evaluation Module−1. M-LVDS Devices Supported by the EVM OverviewLvds Standard TIA/EIA−899 Lvds EVM Kit Contents Point-to-Point ConfigurationsMultipoint Multidrop−7. Two-Node Multipoint Circuit EVM Operation With Separate Power SuppliesRecommended Equipment PS1 PS2 PS3Test Setup Typical Cable Test Configurations −1. EVM Configuration OptionsPoint-to-Point Simplex Transmission Two-Node Multipoint Transmission Point-to-Point Parallel Terminated Simplex Transmission−3. Two-Node Multipoint Transmission −4. Point-to-Point Parallel Simplex Typical Eye Pattern Data Test ResultsDriver Input Receiver #1 Output Receiver #2 Bill of Materials, Board Layout, and PCB Construction −1. M-LVDS EVM Bill of Materials Bill of MaterialsBoard Layout −1. Assembly DrawingÏïïïïïïïïïïïïï Ï Ìììììììììììììì Ì −5. Bottom Layer + 2 Z 374e * 2.9s h PCB ConstructionMicrostripstripline Mils −2. EVM Layer Stack UpThis Appendix contains the EVM schematic SchematicVCC