Compaq M-LVDS manual 3. Two-Node Multipoint Transmission

Page 20

Typical Cable Test Configurations

Figure 2−3. Two-Node Multipoint Transmission

VCC

Signal Source

with 50-Ω

Output

50-Ω

Cable

J2

TP2

W2

Jumper

Input Signal

	4	9
5
	U1	R7
		100
R3
		10
49.9

Twisted Pair Cable

P2

R6

100

	50-Ω		R2
50-Ωcable or	Cable	J1	R2		12
50-Ωcable or		J1	453	2 U1	12	R4
Active Voltage				2 U1		R4	P1
Probe into one				3	11	100	P1
			TP1			100
			TP1
Channel of Scope				VCC
Terminated in						VCC
High Impedance					W1		W4
		Output Signal				Jumper	W4
	Active Voltage	Output Signal				Jumper	Jumper
	Active Voltage						Jumper
	Probe		Input Signal
			Input Signal
				U2		3
						6

R5

100

		J8	4
			4
			R14
		TP4	49.9
	50-Ω		R13
50-Ωcable or	Cable	J7	R13
50-Ωcable or		J7	453
Active Voltage			1
Probe into one			1
Probe into one			TP3
Channel of Scope			TP3
Channel of Scope			2
Terminated in			2
Terminated in
High Impedance
	Active Voltage	Output Signal
	Active Voltage
	Probe

	R15	P3
7	100
7

VCC

W3

Jumper

R16

100

2-4	Test Setup

Image 20

Contents User’s Guide Important Notice EVM Important Notice EVM Warnings and Restrictions How to Use This Manual PrefacePage Contents Figures TablesM-LVDS Evaluation Module TopicOverview −1. M-LVDS Devices Supported by the EVMLvds Standard TIA/EIA−899 Lvds EVM Kit Contents Configurations Point-to-PointMultidrop MultipointEVM Operation With Separate Power Supplies −7. Two-Node Multipoint CircuitPS1 PS2 PS3 Recommended EquipmentTest Setup Point-to-Point Simplex Transmission Typical Cable Test Configurations−1. EVM Configuration Options Point-to-Point Parallel Terminated Simplex Transmission Two-Node Multipoint Transmission−3. Two-Node Multipoint Transmission Test Results −4. Point-to-Point Parallel Simplex Typical Eye Pattern DataDriver Input Receiver #1 Output Receiver #2 Bill of Materials, Board Layout, and PCB Construction Bill of Materials −1. M-LVDS EVM Bill of Materials−1. Assembly Drawing Board LayoutÏïïïïïïïïïïïïï Ï Ìììììììììììììì Ì −5. Bottom Layer PCB Construction + 2 Z 374e * 2.9s hMicrostripstripline −2. EVM Layer Stack Up MilsSchematic This Appendix contains the EVM schematicVCC