Compaq M-LVDS manual Bill of Materials, Board Layout, and PCB Construction

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Chapter 3

Bill of Materials, Board Layout, and PCB Construction

This chapter contains the bill of materials, board layout of the M-LVDS, and describes the printed-circuit board.

Topic		Page

2.1	Bill of Materials	. . 3-2
3.2	Board Layout	. . 3-3
3.3	PCB Construction	. . 3-6

3-1

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Contents User’s Guide Important Notice EVM Important Notice EVM Warnings and Restrictions Preface How to Use This ManualPage Contents Tables FiguresTopic M-LVDS Evaluation Module−1. M-LVDS Devices Supported by the EVM OverviewLvds Standard TIA/EIA−899 Lvds EVM Kit Contents Point-to-Point ConfigurationsMultipoint Multidrop−7. Two-Node Multipoint Circuit EVM Operation With Separate Power SuppliesRecommended Equipment PS1 PS2 PS3Test Setup Point-to-Point Simplex Transmission Typical Cable Test Configurations−1. EVM Configuration Options Two-Node Multipoint Transmission Point-to-Point Parallel Terminated Simplex Transmission −3. Two-Node Multipoint Transmission −4. Point-to-Point Parallel Simplex Typical Eye Pattern Data Test ResultsDriver Input Receiver #1 Output Receiver #2 Bill of Materials, Board Layout, and PCB Construction −1. M-LVDS EVM Bill of Materials Bill of MaterialsBoard Layout −1. Assembly DrawingÏïïïïïïïïïïïïï Ï Ìììììììììììììì Ì −5. Bottom Layer + 2 Z 374e * 2.9s h PCB ConstructionMicrostripstripline Mils −2. EVM Layer Stack UpThis Appendix contains the EVM schematic SchematicVCC