Compaq M-LVDS manual Preface, How to Use This Manual

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Preface

How to Use This Manual

This document contains the following chapters:

-Chapter 1—The M-LVDS Evaluation Module

-Chapter 2—Test Setup

-Chapter 3—Bill of Materials, Board Layout, and PCB Construction

-Appendix A—Schematic

Related Documentation From Texas Instruments and Others

-Introduction to M-LVDS (SLLA108)

-LVDS Designer’s Notes (SLLA014A).

-Reducing EMI With Low Voltage Differential Signaling (SLLA030B).

-Interface Circuits for TIA/EIA−644 (LVDS) (SLLA038B).

-Transmission at 200 Mpbs in VME Card Cage Using LVDM (SLLA088).

-LVDS Multidrop Connections (literature number SLLA054).

-SN65MLVD20x data sheets, Multipoint-LVDS Line Drivers and Receivers, (SLLS573 and SLLS558)

-Electromagnetic Compatibility Printed Circuit Board and Electronic Module Design, VEC workshop, Violette Engineering Corporation.

FCC Warning

This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications. In which case the user, at his own expense, is required to take the necessary measures to correct this interference.

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Contents User’s Guide Important Notice EVM Important Notice EVM Warnings and Restrictions Preface How to Use This ManualPage Contents Tables FiguresTopic M-LVDS Evaluation Module−1. M-LVDS Devices Supported by the EVM OverviewLvds Standard TIA/EIA−899 Lvds EVM Kit Contents Point-to-Point ConfigurationsMultipoint Multidrop−7. Two-Node Multipoint Circuit EVM Operation With Separate Power SuppliesRecommended Equipment PS1 PS2 PS3Test Setup Point-to-Point Simplex Transmission Typical Cable Test Configurations−1. EVM Configuration Options Two-Node Multipoint Transmission Point-to-Point Parallel Terminated Simplex Transmission−3. Two-Node Multipoint Transmission −4. Point-to-Point Parallel Simplex Typical Eye Pattern Data Test ResultsDriver Input Receiver #1 Output Receiver #2 Bill of Materials, Board Layout, and PCB Construction −1. M-LVDS EVM Bill of Materials Bill of MaterialsBoard Layout −1. Assembly DrawingÏïïïïïïïïïïïïï Ï Ìììììììììììììì Ì −5. Bottom Layer + 2 Z 374e * 2.9s h PCB ConstructionMicrostripstripline Mils −2. EVM Layer Stack UpThis Appendix contains the EVM schematic SchematicVCC