AMD 1207 manual Summary of Requirements, Chapter Introduction

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32800 Rev. 3.00 August 2006Thermal Design Guide for Socket F (1207) Processors

Chapter 1 Introduction

This document specifies performance requirements for the design of thermal and mechanical solutions for socket F (1207) processors, utilizing AMD 64-bit technology. Detailed drawings, descriptions, and design targets are provided to help manufacturers, vendors, and engineers meet the requirements for the socket F (1207) processors.

1.1Summary of Requirements

To allow optimal reliability of a processor, the thermal and cooling solution dissipates heat from that processor operating at the thermal design power. This document specifies the required values for the thermal and mechanical parameters of systems based on socket F (1207) processors.

Chapter 1

Introduction

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Contents Thermal Design Guide for Socket F 1207 Processors Advanced Micro Devices, Inc. All rights reserved Contents Heat Sink Fans Thermal Interface Material List of Figures List of FiguresList of Figures List of Tables List of TablesList of Tables Revision History Revision HistoryRevision History Chapter Introduction Summary of RequirementsChapter Chapter Processor Thermal Solutions Processor Specifications1207-Pin Socket Socket DescriptionMotherboard Component Height Restrictions Sample Heat Sinks and Attachment Methods Thermal Solution Design RequirementsPart Description Material Quantity Backplate Assembly Retention Frame Thermal Design of Platforms Using the AMD Processor-In-a Chapter Thermal Design of Custom 1U-2P Systems Thermal Design of Custom 1U-2P SystemsSymbol Systems Spring Screws Exploded View of Thermal Solution for Custom 1U-2P SystemsFin Parameters Heat SinkFans Thermal Interface Material Thermal Design of Custom 1U-2P Systems Chapter Thermal Design of Custom 2U-4P Systems Thermal Design of Custom 2U-4P SystemsThermal Solution Design Requirements Heat sink Aluminum Fan Plastic Spring clip Backplate Assembly Chemical Element of SK7 Spring Steel Spring ClipHigh Performance Heat Sink for Custom 2U-4P Systems Fans Thermal Design of Custom 2U-4P Systems Appendix a Solution for Socket F 1207 ProcessorsSocket F 1207 PIB Board Component Height Restrictions 64.36 76.41 49.91 59.81 787724 000 784 520 189 Socket F 1207 PIB Socket Outline and Socket Window36.59 32.13 27.59 1207 PIB Heat Sink HeightZone 2x11.44 2x51.26 2x61.08318 000 885 1207 PIBKeep-Out 10.09 33.91 49.91 Thermal233 Solution for Socket F 1207 Processors Socket F 1207 Processor Appendix BHeight Restrictions Drawings for1207 2P Systems Processor32.16 71.98 24.54 10.09 49.91 64.36 BasedHoles, Contact Pads, No-Routing ZoneWindow ProcessorBased on 42.71 82.53 32.16 71.98 1U-2P Systems 1207 ProcessorHeight Restriction Zone 598 000 166 40.59 80.41 Keep-Out2P Board No-Through-Hole Keep Out22.04 10.09 33.9 49.91 61.86 1207 1U233 335 965 35.04Socket F 1207 Processor Appendix C Socket F 1207 2U-4P Board Component Height Restrictions 75.47 4P Mounting Holes, Contact Pads, and No-Routing Zone47.40 87.22 35.65 24.54 64.36Socket Window Custom 2U-4P1207 2U-4P Socket Outline 681 266 2U-4P Systems 1207 Processor17.59 26040.59 80.41 Socket F 1207 2U-4P Board No-Through-Hole Keep-Out166 80.41 1207Socket F 1207 Processor Socket F 1207 Processors Appendix DStreamline Plot of AMD Reference Custom 2U-4P System