AMD 1207 manual List of Figures

Page 5

32800 Rev. 3.00 August 2006

Thermal Design Guide for Socket F (1207) Processors

List of Figures

Figure 1. The 1207-Pin Socket. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Figure 2. Motherboard Component Height Restrictions for Platforms Using the

AMD PIB Thermal Solution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

Figure 3. Exploded View of Thermal Solution AMD PIB Platforms based on

Socket F (1207) Processors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Figure 4. Motherboard Component Height Restrictions for Custom 1U-2P Systems . . . . . . . . . .21 Figure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems . . . . . . . . . . . . . . . . .24 Figure 6. High Performance Heat Sink for Custom 1U-2P Systems . . . . . . . . . . . . . . . . . . . . . . .25

Figure 7. Thermal Performance Chart of Heat Sink When Used with a Dual-Core Processor

in 90 nm Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 Figure 8. Motherboard Component-Height Restrictions for Custom 2U-4P Systems. . . . . . . . . .29

Figure 9. Exploded View of Thermal Solution for Custom 2U-4P System Based on Socket F (1207) Processors32

Figure 10. High Performance Heat Sink for Custom 2U-4P Systems . . . . . . . . . . . . . . . . . . . . . . .34

Figure 11. Thermal Performance Chart of Heat Sink When Used with a Dual-Core Processor

in 90 nm Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Figure 12. Socket F (1207) PIB Board Component Height Restrictions . . . . . . . . . . . . . . . . . . . . .38 Figure 13. Socket F (1207) PIB Mounting Holes, Contact Pads, and No-Routing Zone . . . . . . . .39 Figure 14. Socket F (1207) PIB Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . . . .40 Figure 15. Socket F (1207) PIB Heat Sink Height Restriction Zone . . . . . . . . . . . . . . . . . . . . . . . .41 Figure 16. Socket F (1207) PIB Board No-Through-HoleKeep-Out . . . . . . . . . . . . . . . . . . . . . . .42 Figure 17. Socket F (1207) PIB Board Bottom Side Keep-Out. . . . . . . . . . . . . . . . . . . . . . . . . . . .43 Figure 18. Socket F (1207) 1U-2P Board Component Height Restrictions. . . . . . . . . . . . . . . . . . .46 Figure 19. Socket F (1207) 1U-2P Mounting Holes, Contact Pads, and No-Routing Zone . . . . . .47 Figure 20. Socket F (1207) 1U-2P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .48 Figure 21. Socket F (1207) 1U-2P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .49 Figure 22. Socket F (1207) 1U-2P Board No-Through-HoleKeep-Out . . . . . . . . . . . . . . . . . . . . .50 Figure 23. Socket F (1207) 1U-2P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 Figure 24. Socket F (1207) 2U-4P Board Component Height Restrictions. . . . . . . . . . . . . . . . . . .54 Figure 25. Socket F (1207) 2U-4P Mounting Holes, Contact Pads, and No-Routing Zone . . . . . .55

List of Figures

5

Image 5

Contents Thermal Design Guide for Socket F 1207 Processors Advanced Micro Devices, Inc. All rights reserved Contents Heat Sink Fans Thermal Interface Material List of Figures List of FiguresList of Figures List of Tables List of TablesList of Tables Revision History Revision HistoryRevision History Chapter Introduction Summary of RequirementsChapter Chapter Processor Thermal Solutions Processor Specifications1207-Pin Socket Socket DescriptionMotherboard Component Height Restrictions Sample Heat Sinks and Attachment Methods Thermal Solution Design RequirementsPart Description Material Quantity Backplate Assembly Retention Frame Thermal Design of Platforms Using the AMD Processor-In-a Chapter Thermal Design of Custom 1U-2P Systems Thermal Design of Custom 1U-2P SystemsSymbol Systems Spring Screws Exploded View of Thermal Solution for Custom 1U-2P SystemsFin Parameters Heat SinkFans Thermal Interface Material Thermal Design of Custom 1U-2P Systems Chapter Thermal Design of Custom 2U-4P Systems Thermal Design of Custom 2U-4P SystemsThermal Solution Design Requirements Heat sink Aluminum Fan Plastic Spring clip Backplate Assembly Chemical Element of SK7 Spring Steel Spring ClipHigh Performance Heat Sink for Custom 2U-4P Systems Fans Thermal Design of Custom 2U-4P Systems Appendix a Solution for Socket F 1207 ProcessorsSocket F 1207 PIB Board Component Height Restrictions 64.36 76.41 49.91 59.81 787724 000 784 520 189 Socket F 1207 PIB Socket Outline and Socket WindowZone 1207 PIB Heat Sink Height2x11.44 2x51.26 2x61.08 36.59 32.13 27.59318 000 885 1207 PIBKeep-Out 10.09 33.91 49.91 Thermal233 Solution for Socket F 1207 Processors Socket F 1207 Processor Appendix B1207 Drawings for2P Systems Processor Height RestrictionsHoles, Contact Pads, BasedNo-Routing Zone 32.16 71.98 24.54 10.09 49.91 64.36Window ProcessorBased on 42.71 82.53 32.16 71.98 1U-2P Systems 1207 ProcessorHeight Restriction Zone 2P Board No-Through-Hole Keep Keep-OutOut 598 000 166 40.59 80.41233 335 965 1207 1U35.04 22.04 10.09 33.9 49.91 61.86Socket F 1207 Processor Appendix C Socket F 1207 2U-4P Board Component Height Restrictions 47.40 87.22 35.65 4P Mounting Holes, Contact Pads, and No-Routing Zone24.54 64.36 75.47Socket Window Custom 2U-4P1207 2U-4P Socket Outline 17.59 2U-4P Systems 1207 Processor260 681 26640.59 80.41 Socket F 1207 2U-4P Board No-Through-Hole Keep-Out166 80.41 1207Socket F 1207 Processor Socket F 1207 Processors Appendix DStreamline Plot of AMD Reference Custom 2U-4P System