AMD 1207 manual Processor Specifications, Chapter Processor Thermal Solutions

Page 13

32800 Rev. 3.00 August 2006

Thermal Design Guide for Socket F (1207) Processors

Chapter 2 Processor Thermal Solutions

This chapter describes the thermal solutions for systems based on socket F (1207) processors.

2.1Processor Specifications

The objective of thermal solutions is to maintain the processor temperature within specified limits. Thermal performance, physical mounting, acoustic noise, mass, reliability, and cost must be considered during the design of a thermal solution.

Table 1 lists the pertinent processor specifications for a thermal solution design for systems based on socket F (1207) processors.

Table 1.	Mechanical and Thermal Specifications for Socket F (1207) Processors
Symbol	Description	Maximum	Notes
Symbol	Description	Value	Notes
		Value

TCase	Maximum case	67°C - 72°C	Consult the processor data sheet for the
	temperature		thermal requirements specific to the
			processor.

ACPU	Processor contact	32.5 mm x	Interfaces with heat sink
	area	32.5 mm
Form	Processor form	LGA	LGA form factor for socket F (1207)
Factor	factor		processors

Chapter 2

Processor Thermal Solutions

13

Image 13

Contents Thermal Design Guide for Socket F 1207 Processors Advanced Micro Devices, Inc. All rights reserved Contents Heat Sink Fans Thermal Interface Material List of Figures List of FiguresList of Figures List of Tables List of TablesList of Tables Revision History Revision HistoryRevision History Chapter Introduction Summary of RequirementsChapter Chapter Processor Thermal Solutions Processor Specifications1207-Pin Socket Socket DescriptionMotherboard Component Height Restrictions Sample Heat Sinks and Attachment Methods Thermal Solution Design RequirementsPart Description Material Quantity Backplate Assembly Retention Frame Thermal Design of Platforms Using the AMD Processor-In-a Chapter Thermal Design of Custom 1U-2P Systems Thermal Design of Custom 1U-2P SystemsSymbol Systems Spring Screws Exploded View of Thermal Solution for Custom 1U-2P SystemsFin Parameters Heat SinkFans Thermal Interface Material Thermal Design of Custom 1U-2P Systems Chapter Thermal Design of Custom 2U-4P Systems Thermal Design of Custom 2U-4P SystemsThermal Solution Design Requirements Heat sink Aluminum Fan Plastic Spring clip Backplate Assembly Chemical Element of SK7 Spring Steel Spring ClipHigh Performance Heat Sink for Custom 2U-4P Systems Fans Thermal Design of Custom 2U-4P Systems Appendix a Solution for Socket F 1207 ProcessorsSocket F 1207 PIB Board Component Height Restrictions 64.36 76.41 49.91 59.81 787724 000 784 520 189 Socket F 1207 PIB Socket Outline and Socket WindowZone 1207 PIB Heat Sink Height2x11.44 2x51.26 2x61.08 36.59 32.13 27.59Keep-Out 1207 PIB318 000 885 233 Thermal10.09 33.91 49.91 Solution for Socket F 1207 Processors Socket F 1207 Processor Appendix B1207 Drawings for2P Systems Processor Height RestrictionsHoles, Contact Pads, BasedNo-Routing Zone 32.16 71.98 24.54 10.09 49.91 64.36Based on ProcessorWindow Height Restriction Zone 1U-2P Systems 1207 Processor42.71 82.53 32.16 71.98 2P Board No-Through-Hole Keep Keep-OutOut 598 000 166 40.59 80.41233 335 965 1207 1U35.04 22.04 10.09 33.9 49.91 61.86Socket F 1207 Processor Appendix C Socket F 1207 2U-4P Board Component Height Restrictions 47.40 87.22 35.65 4P Mounting Holes, Contact Pads, and No-Routing Zone24.54 64.36 75.471207 2U-4P Socket Outline Custom 2U-4PSocket Window 17.59 2U-4P Systems 1207 Processor260 681 26640.59 80.41 Socket F 1207 2U-4P Board No-Through-Hole Keep-Out166 80.41 1207Socket F 1207 Processor Socket F 1207 Processors Appendix DStreamline Plot of AMD Reference Custom 2U-4P System