AMD 1207 manual High Performance Heat Sink for Custom 2U-4P Systems

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Thermal Design Guide for Socket F (1207) Processors

32800 Rev. 3.00 August 2006

the center to 2.5 mm at the edges. The heat sink also has three heat pipes soldered to the base and connected to the top of the fin stack to improve fin efficiency. This design provides optimum heat spreading performance from the processor to the heat sink. The fin geometry has been designed to provide optimized thermal performance in combination with the fans, as described in Section 5.3.5, on page 35, in a typical 2U-4P system.

Figure 10. High Performance Heat Sink for Custom 2U-4P Systems

Table 10 shows the parameters of the aluminum fins for the high-performance heat sink shown in Figure 10.

Table 10.

Fin Parameters

 

 

 

 

 

 

 

 

 

 

Length

 

Height (at Center)

Height (at Edges)

Thickness

Pitch

No of Fins

 

 

 

 

 

 

 

92 mm

 

32.5 mm

37 mm

0.2 mm

1.5 mm

39

 

 

 

 

 

 

 

Other fan and heat sink combinations may yield adequate thermal performance. The system designer must ensure that the thermal solution provides required cooling for the processor for the given system layout and flow characteristics.

Because the processor-mounting surface extends above the surface of the cam box on the socket, the heat sink bottom can be flat. The heat sink must have a flat surface of at least 40 mm x 40 mm, centered over the processor.

Figure 11 shows the measured thermal performance vs. flow rate for this heat sink. This data represents the expected performance of this heat sink on a dual-core socket F (1207) processor. Based

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Thermal Design of Custom 2U-4P Systems

Chapter 5

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Contents Thermal Design Guide for Socket F 1207 Processors Advanced Micro Devices, Inc. All rights reserved Contents Heat Sink Fans Thermal Interface Material List of Figures List of FiguresList of Figures List of Tables List of TablesList of Tables Revision History Revision HistoryRevision History Summary of Requirements Chapter IntroductionChapter Processor Specifications Chapter Processor Thermal SolutionsSocket Description 1207-Pin SocketMotherboard Component Height Restrictions Thermal Solution Design Requirements Sample Heat Sinks and Attachment MethodsPart Description Material Quantity Backplate Assembly Retention Frame Thermal Design of Platforms Using the AMD Processor-In-a Thermal Design of Custom 1U-2P Systems Chapter Thermal Design of Custom 1U-2P SystemsSymbol Systems Exploded View of Thermal Solution for Custom 1U-2P Systems Spring ScrewsHeat Sink Fin ParametersFans Thermal Interface Material Thermal Design of Custom 1U-2P Systems Thermal Design of Custom 2U-4P Systems Chapter Thermal Design of Custom 2U-4P SystemsThermal Solution Design Requirements Heat sink Aluminum Fan Plastic Spring clip Backplate Assembly Spring Clip Chemical Element of SK7 Spring SteelHigh Performance Heat Sink for Custom 2U-4P Systems Fans Thermal Design of Custom 2U-4P Systems Solution for Socket F 1207 Processors Appendix aSocket F 1207 PIB Board Component Height Restrictions 787 64.36 76.41 49.91 59.81Socket F 1207 PIB Socket Outline and Socket Window 724 000 784 520 1892x11.44 2x51.26 2x61.08 1207 PIB Heat Sink HeightZone 36.59 32.13 27.59Keep-Out 1207 PIB318 000 885 233 Thermal10.09 33.91 49.91 Solution for Socket F 1207 Processors Appendix B Socket F 1207 Processor2P Systems Processor Drawings for1207 Height RestrictionsNo-Routing Zone BasedHoles, Contact Pads, 32.16 71.98 24.54 10.09 49.91 64.36Based on ProcessorWindow Height Restriction Zone 1U-2P Systems 1207 Processor42.71 82.53 32.16 71.98 Out Keep-Out2P Board No-Through-Hole Keep 598 000 166 40.59 80.4135.04 1207 1U233 335 965 22.04 10.09 33.9 49.91 61.86Socket F 1207 Processor Appendix C Socket F 1207 2U-4P Board Component Height Restrictions 24.54 64.36 4P Mounting Holes, Contact Pads, and No-Routing Zone47.40 87.22 35.65 75.471207 2U-4P Socket Outline Custom 2U-4PSocket Window 260 2U-4P Systems 1207 Processor17.59 681 266Socket F 1207 2U-4P Board No-Through-Hole Keep-Out 40.59 80.411207 166 80.41Socket F 1207 Processor Appendix D Socket F 1207 ProcessorsStreamline Plot of AMD Reference Custom 2U-4P System