Thermal Design Guide for Socket F (1207) Processors | 32800 Rev. 3.02 August 2006 |
Depending on the system features and layout, more space around the socket may be available for the thermal solution than is shown in Figure 2 on page 15. This space permits heat sink designs with better thermal performance.
Appendix A on page 37 shows a complete, detailed set of
3.2Thermal Solution Design Requirements
Table 2 provides the
Table 2. Thermal Solution Design Requirements for Platforms Using Socket F (1207) PIB processors
Symbol | Description | Maximum |
|
|
|
L | Length of heat sink | 68 mm |
|
|
|
W | Width of heat sink | 77 mm |
|
|
|
H | Height of heat sink | 60 mm |
|
|
|
θca | 0.26°C/W1 | |
| resistance |
|
MHS | Mass of heat sink | 450 g to 700 g2 |
Fclip | Clip force | 75 lbs ±15 lbs |
TA | Local ambient temperature near | 38°C |
| processor |
|
|
|
|
Notes:
1. This is the thermal resistance required for
2. Heat sinks weighing up to 450 g can be attached to the motherboard. Heat sinks weighing over 450 g should be tied directly to the chassis for reliable shock and vibration performance.
3.3Sample Heat Sinks and Attachment Methods
The heat sink, fan, mounting spring clip, and thermal interface material used for the AMD PIB thermal solution for socket F (1207) processors are the same as the heat sink, fan, mounting spring clip, and thermal interface material used for systems based on the socket 940 processor.
The backplate and retention frame are different from those used in the socket 940 processor. The EMC shield implemented in the socket
16 | Thermal Design of Platforms Using the AMD | Chapter 3 |
| Box (PIB) Thermal Solution |
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