AMD manual Appendix B, Socket F 1207 Processor

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32800 Rev. 3.00 August 2006

Thermal Design Guide for Socket F (1207) Processors

Appendix B Keep-Out Drawings for Custom 1U- 2P Systems Based on the Socket F (1207) Processor

Appendix B contains detailed recommended keep-out drawings for processor heat sink and mounting hardware for a custom 1U-2P system based on the socket F (1207) processors. Depending on the system features and layout, more space around the processor may be available for the thermal solution than is shown in these drawings. This space permits the design of heat sinks with better thermal performance.

Note: These keep-outs are defined for custom rack mount equipment to optimize thermal and acoustic performance in these systems. These keep-outs are not compliant with AMD Processor-In-a-Box (PIB) thermal solutions.

Appendix B	Keep-Out Drawings for Custom 1U-2P Systems Based on the	45
	Socket F (1207) Processor

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Contents Thermal Design Guide for Socket F 1207 Processors Advanced Micro Devices, Inc. All rights reserved Contents Heat Sink Fans Thermal Interface Material List of Figures List of FiguresList of Figures List of Tables List of TablesList of Tables Revision History Revision HistoryRevision History Chapter Introduction Summary of RequirementsChapter Chapter Processor Thermal Solutions Processor Specifications1207-Pin Socket Socket DescriptionMotherboard Component Height Restrictions Sample Heat Sinks and Attachment Methods Thermal Solution Design RequirementsPart Description Material Quantity Backplate Assembly Retention Frame Thermal Design of Platforms Using the AMD Processor-In-a Chapter Thermal Design of Custom 1U-2P Systems Thermal Design of Custom 1U-2P SystemsSymbol Systems Spring Screws Exploded View of Thermal Solution for Custom 1U-2P SystemsFin Parameters Heat SinkFans Thermal Interface Material Thermal Design of Custom 1U-2P Systems Chapter Thermal Design of Custom 2U-4P Systems Thermal Design of Custom 2U-4P SystemsThermal Solution Design Requirements Heat sink Aluminum Fan Plastic Spring clip Backplate Assembly Chemical Element of SK7 Spring Steel Spring ClipHigh Performance Heat Sink for Custom 2U-4P Systems Fans Thermal Design of Custom 2U-4P Systems Appendix a Solution for Socket F 1207 ProcessorsSocket F 1207 PIB Board Component Height Restrictions 64.36 76.41 49.91 59.81 787724 000 784 520 189 Socket F 1207 PIB Socket Outline and Socket WindowZone 1207 PIB Heat Sink Height2x11.44 2x51.26 2x61.08 36.59 32.13 27.591207 PIB Keep-Out318 000 885 Thermal 23310.09 33.91 49.91 Solution for Socket F 1207 Processors Socket F 1207 Processor Appendix B1207 Drawings for2P Systems Processor Height RestrictionsHoles, Contact Pads, BasedNo-Routing Zone 32.16 71.98 24.54 10.09 49.91 64.36Processor Based onWindow 1U-2P Systems 1207 Processor Height Restriction Zone42.71 82.53 32.16 71.98 2P Board No-Through-Hole Keep Keep-OutOut 598 000 166 40.59 80.41233 335 965 1207 1U35.04 22.04 10.09 33.9 49.91 61.86Socket F 1207 Processor Appendix C Socket F 1207 2U-4P Board Component Height Restrictions 47.40 87.22 35.65 4P Mounting Holes, Contact Pads, and No-Routing Zone24.54 64.36 75.47Custom 2U-4P 1207 2U-4P Socket OutlineSocket Window 17.59 2U-4P Systems 1207 Processor260 681 26640.59 80.41 Socket F 1207 2U-4P Board No-Through-Hole Keep-Out166 80.41 1207Socket F 1207 Processor Socket F 1207 Processors Appendix DStreamline Plot of AMD Reference Custom 2U-4P System