AMD 1207 manual Contents

Page 3

32800 Rev. 3.00 August 2006

Thermal Design Guide for Socket F (1207) Processors

Contents

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Chapter 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

1.1 Summary of Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Chapter 2 Processor Thermal Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

2.1 Processor Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 2.2 Socket Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Chapter 3 Thermal Design of Platforms Using the AMD Processor-In-a-Box (PIB) Thermal Solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

3.1 Motherboard Component Height Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

3.2 Thermal Solution Design Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

3.3 Sample Heat Sinks and Attachment Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

3.3.1 Backplate Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

3.3.2 Retention Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

Chapter 4 Thermal Design of Custom 1U-2P Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

4.1 Motherboard Component Height Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

4.2 Thermal Solution Design Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

4.3 Sample Heat Sinks and Attachment Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

4.3.1 Backplate Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

4.3.2 Spring Screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

4.3.3 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

4.3.4 Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

4.3.5 Thermal Interface Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

Chapter 5 Thermal Design of Custom 2U-4P Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29

5.1 Motherboard Component Height Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29

5.2 Thermal Solution Design Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30

5.3 Sample Heat Sinks and Attachment Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30

5.3.1 Backplate Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

5.3.2 Spring Clip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

5.3.3 Retention Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

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Contents Thermal Design Guide for Socket F 1207 Processors Advanced Micro Devices, Inc. All rights reserved Contents Heat Sink Fans Thermal Interface Material List of Figures List of FiguresList of Figures List of Tables List of TablesList of Tables Revision History Revision HistoryRevision History Chapter Introduction Summary of RequirementsChapter Chapter Processor Thermal Solutions Processor Specifications1207-Pin Socket Socket DescriptionMotherboard Component Height Restrictions Sample Heat Sinks and Attachment Methods Thermal Solution Design RequirementsPart Description Material Quantity Backplate Assembly Retention Frame Thermal Design of Platforms Using the AMD Processor-In-a Chapter Thermal Design of Custom 1U-2P Systems Thermal Design of Custom 1U-2P SystemsSymbol Systems Spring Screws Exploded View of Thermal Solution for Custom 1U-2P SystemsFin Parameters Heat SinkFans Thermal Interface Material Thermal Design of Custom 1U-2P Systems Chapter Thermal Design of Custom 2U-4P Systems Thermal Design of Custom 2U-4P SystemsThermal Solution Design Requirements Heat sink Aluminum Fan Plastic Spring clip Backplate Assembly Chemical Element of SK7 Spring Steel Spring ClipHigh Performance Heat Sink for Custom 2U-4P Systems Fans Thermal Design of Custom 2U-4P Systems Appendix a Solution for Socket F 1207 ProcessorsSocket F 1207 PIB Board Component Height Restrictions 64.36 76.41 49.91 59.81 787724 000 784 520 189 Socket F 1207 PIB Socket Outline and Socket Window36.59 32.13 27.59 1207 PIB Heat Sink HeightZone 2x11.44 2x51.26 2x61.081207 PIB Keep-Out318 000 885 Thermal 23310.09 33.91 49.91 Solution for Socket F 1207 Processors Socket F 1207 Processor Appendix BHeight Restrictions Drawings for1207 2P Systems Processor32.16 71.98 24.54 10.09 49.91 64.36 BasedHoles, Contact Pads, No-Routing ZoneProcessor Based onWindow 1U-2P Systems 1207 Processor Height Restriction Zone42.71 82.53 32.16 71.98 598 000 166 40.59 80.41 Keep-Out2P Board No-Through-Hole Keep Out22.04 10.09 33.9 49.91 61.86 1207 1U233 335 965 35.04Socket F 1207 Processor Appendix C Socket F 1207 2U-4P Board Component Height Restrictions 75.47 4P Mounting Holes, Contact Pads, and No-Routing Zone47.40 87.22 35.65 24.54 64.36Custom 2U-4P 1207 2U-4P Socket OutlineSocket Window 681 266 2U-4P Systems 1207 Processor17.59 26040.59 80.41 Socket F 1207 2U-4P Board No-Through-Hole Keep-Out166 80.41 1207Socket F 1207 Processor Socket F 1207 Processors Appendix DStreamline Plot of AMD Reference Custom 2U-4P System
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