AMD 1207 manual Backplate Assembly

AMD 1207 manual Thermal Design of Platforms Using the AMD Processor-In-a AMD 1207 manual Chapter Thermal Design of Custom 1U-2P Systems AMD 1207 manual Symbol AMD 1207 manual Systems AMD 1207 manual Spring Screws, Exploded View of Thermal Solution for Custom 1U-2P Systems AMD 1207 manual Heat Sink, Fin Parameters AMD 1207 manual Fans AMD 1207 manual Thermal Interface Material AMD 1207 manual Thermal Design of Custom 1U-2P Systems AMD 1207 manual Chapter Thermal Design of Custom 2U-4P Systems AMD 1207 manual Thermal Solution Design Requirements AMD 1207 manual Heat sink Aluminum Fan Plastic Spring clip AMD 1207 manual Backplate Assembly AMD 1207 manual Spring Clip, Chemical Element of SK7 Spring Steel AMD 1207 manual High Performance Heat Sink for Custom 2U-4P Systems AMD 1207 manual Fans AMD 1207 manual Thermal Design of Custom 2U-4P Systems AMD manual Appendix a, Solution for Socket F 1207 Processors AMD manual Socket F 1207 PIB Board Component Height Restrictions AMD 1207 manual 787, 64.36 76.41 49.91 59.81 AMD manual Socket F 1207 PIB Socket Outline and Socket Window, 724 000 784 520 189 AMD 1207 manual PIB Heat Sink Height, Zone, 2x11.44 2x51.26 2x61.08, 36.59 32.13 27.59, 833 AMD manual 1207 PIB, Keep-Out, 318 000 885 AMD 1207 manual Thermal, 233, 10.09 33.91 49.91 AMD manual Solution for Socket F 1207 Processors AMD manual Appendix B, Socket F 1207 Processor AMD 1207 manual Drawings for, 2P Systems Processor, Height Restrictions AMD 1207 manual Based, Holes, Contact Pads, No-Routing Zone, 32.16 71.98 24.54 10.09 49.91 64.36 AMD 1207 manual Processor, Based on, Window AMD manual 1U-2P Systems 1207 Processor, Height Restriction Zone, 42.71 82.53 32.16 71.98 AMD 1207 manual Keep-Out, 2P Board No-Through-Hole Keep, 598 000 166 40.59 80.41 AMD manual 1207 1U, 233 335 965, 35.04, 22.04 10.09 33.9 49.91 61.86, 74.86 AMD manual Socket F 1207 Processor AMD 1207 manual Appendix C AMD manual Socket F 1207 2U-4P Board Component Height Restrictions AMD 1207 manual 4P Mounting Holes, Contact Pads, and No-Routing Zone, 47.40 87.22 35.65, 24.54 64.36, 75.47
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Thermal Design Guide for Socket F (1207) Processors

32800 Rev. 3.00 August 2006

Figure 9. Exploded View of Thermal Solution for Custom 2U-4P System Based on Socket F (1207) Processors

The following sections describe the mechanical requirements of the components shown in Figure 9.

5.3.1Backplate Assembly

For details on the backplate assembly, see section 3.3.1 on page 18.

Note: The backplate for this custom design has a mounting-hole pitch of 4.1 inches.

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Thermal Design of Custom 2U-4P Systems

Chapter 5

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Contents Thermal Design Guide for Socket F 1207 Processors Advanced Micro Devices, Inc. All rights reserved Contents Heat Sink Fans Thermal Interface Material List of Figures List of FiguresList of Figures List of Tables List of TablesList of Tables Revision History Revision HistoryRevision History Summary of Requirements Chapter IntroductionChapter Processor Specifications Chapter Processor Thermal SolutionsSocket Description 1207-Pin SocketMotherboard Component Height Restrictions Thermal Solution Design Requirements Sample Heat Sinks and Attachment MethodsPart Description Material Quantity Backplate Assembly Retention Frame Thermal Design of Platforms Using the AMD Processor-In-a Thermal Design of Custom 1U-2P Systems Chapter Thermal Design of Custom 1U-2P SystemsSymbol Systems Exploded View of Thermal Solution for Custom 1U-2P Systems Spring ScrewsHeat Sink Fin ParametersFans Thermal Interface Material Thermal Design of Custom 1U-2P Systems Thermal Design of Custom 2U-4P Systems Chapter Thermal Design of Custom 2U-4P SystemsThermal Solution Design Requirements Heat sink Aluminum Fan Plastic Spring clip Backplate Assembly Spring Clip Chemical Element of SK7 Spring SteelHigh Performance Heat Sink for Custom 2U-4P Systems Fans Thermal Design of Custom 2U-4P Systems Solution for Socket F 1207 Processors Appendix aSocket F 1207 PIB Board Component Height Restrictions 787 64.36 76.41 49.91 59.81Socket F 1207 PIB Socket Outline and Socket Window 724 000 784 520 1891207 PIB Heat Sink Height Zone2x11.44 2x51.26 2x61.08 36.59 32.13 27.59318 000 885 1207 PIBKeep-Out 10.09 33.91 49.91 Thermal233 Solution for Socket F 1207 Processors Appendix B Socket F 1207 ProcessorDrawings for 12072P Systems Processor Height RestrictionsBased Holes, Contact Pads,No-Routing Zone 32.16 71.98 24.54 10.09 49.91 64.36Window ProcessorBased on 42.71 82.53 32.16 71.98 1U-2P Systems 1207 ProcessorHeight Restriction Zone Keep-Out 2P Board No-Through-Hole KeepOut 598 000 166 40.59 80.411207 1U 233 335 96535.04 22.04 10.09 33.9 49.91 61.86Socket F 1207 Processor Appendix C Socket F 1207 2U-4P Board Component Height Restrictions 4P Mounting Holes, Contact Pads, and No-Routing Zone 47.40 87.22 35.6524.54 64.36 75.47Socket Window Custom 2U-4P1207 2U-4P Socket Outline 2U-4P Systems 1207 Processor 17.59260 681 266Socket F 1207 2U-4P Board No-Through-Hole Keep-Out 40.59 80.411207 166 80.41Socket F 1207 Processor Appendix D Socket F 1207 ProcessorsStreamline Plot of AMD Reference Custom 2U-4P System
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