AMD manual Socket F 1207 PIB Socket Outline and Socket Window, 724 000 784 520 189

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40

Figure 14.

8

7

6

5

4

3

2

1

Thermal Design

Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors

Socket F (1207) PIB Socket Outline and Socket Window

S o c k e t O u t l i n e a n d S o c k e t W i n d o w

D

C

B

	6 1	. 8	7	2	. 4 3	6
	5 3	. 3	3	2	. 1 0	0
	5 0	. 3	3	1	. 9 8	1
	1 8	. 3	7	0	. 7 2	3
P i n	A 1
	0 . 0 0			0 . 0 0 0
	1 1	. 6	3	0	. 4 5	8

0.724	0.000		0.784		1.520		2.189

	0.00		1		1
18.39			19.9		38.6		55.61

D

C

B

A D V A N C E D M I C R O D E V I C E S

A U S T I N , T E X A S

Guide for Socket F (1207) Processors

Appendix A

T I T L E :

A								S o c k e t F ( 1 2 0 7 ) P r o c e s s o r C o m p o n e n t			A
								K e e p o u t a n d H e i g h t R e s t r i c t i o n s C o m p l i a n t
		0 . 0 0	[ 0 . 0 0 0 ' ' ] M a x c o m p o n e n t h e i g h t ; T i e t o g r o u n d .					w i t h	A M	D P I B
		0 . 0 0
		0 . 0 0	[ 0 . 0 0 0 ' ' ] M a x c o m p o n e n t h e i g h t .					D W	G .	N O .	R E V
								D W	G .	N O .	R E V
								7 9 Z 0 0 0 0 1 2 4			2 . 1


										S H E E T 3	O F 6
8			7	6	5	4	3	2		1

32800 Rev. 3.02 August 2006

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Contents Thermal Design Guide for Socket F 1207 Processors Advanced Micro Devices, Inc. All rights reserved Contents Heat Sink Fans Thermal Interface Material List of Figures List of FiguresList of Figures List of Tables List of TablesList of Tables Revision History Revision HistoryRevision History Summary of Requirements Chapter IntroductionChapter Processor Specifications Chapter Processor Thermal SolutionsSocket Description 1207-Pin SocketMotherboard Component Height Restrictions Thermal Solution Design Requirements Sample Heat Sinks and Attachment MethodsPart Description Material Quantity Backplate Assembly Retention Frame Thermal Design of Platforms Using the AMD Processor-In-a Thermal Design of Custom 1U-2P Systems Chapter Thermal Design of Custom 1U-2P SystemsSymbol Systems Exploded View of Thermal Solution for Custom 1U-2P Systems Spring ScrewsHeat Sink Fin ParametersFans Thermal Interface Material Thermal Design of Custom 1U-2P Systems Thermal Design of Custom 2U-4P Systems Chapter Thermal Design of Custom 2U-4P SystemsThermal Solution Design Requirements Heat sink Aluminum Fan Plastic Spring clip Backplate Assembly Spring Clip Chemical Element of SK7 Spring SteelHigh Performance Heat Sink for Custom 2U-4P Systems Fans Thermal Design of Custom 2U-4P Systems Solution for Socket F 1207 Processors Appendix aSocket F 1207 PIB Board Component Height Restrictions 787 64.36 76.41 49.91 59.81Socket F 1207 PIB Socket Outline and Socket Window 724 000 784 520 1891207 PIB Heat Sink Height Zone2x11.44 2x51.26 2x61.08 36.59 32.13 27.59Keep-Out 1207 PIB318 000 885 233 Thermal10.09 33.91 49.91 Solution for Socket F 1207 Processors Appendix B Socket F 1207 ProcessorDrawings for 12072P Systems Processor Height RestrictionsBased Holes, Contact Pads,No-Routing Zone 32.16 71.98 24.54 10.09 49.91 64.36Based on ProcessorWindow Height Restriction Zone 1U-2P Systems 1207 Processor42.71 82.53 32.16 71.98 Keep-Out 2P Board No-Through-Hole KeepOut 598 000 166 40.59 80.411207 1U 233 335 96535.04 22.04 10.09 33.9 49.91 61.86Socket F 1207 Processor Appendix C Socket F 1207 2U-4P Board Component Height Restrictions 4P Mounting Holes, Contact Pads, and No-Routing Zone 47.40 87.22 35.6524.54 64.36 75.471207 2U-4P Socket Outline Custom 2U-4PSocket Window 2U-4P Systems 1207 Processor 17.59260 681 266Socket F 1207 2U-4P Board No-Through-Hole Keep-Out 40.59 80.411207 166 80.41Socket F 1207 Processor Appendix D Socket F 1207 ProcessorsStreamline Plot of AMD Reference Custom 2U-4P System