AMD 1207 manual Retention Frame

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32800 Rev. 3.00 August 2006

Thermal Design Guide for Socket F (1207) Processors

Note: Do not cut entirely through the center rib. Doing so will compromise the stiffness of the backplate.

The plate uses two PennEngineering (PEM) standoffs that serve multiple purposes. The PEM standoffs serve as attachment points for the retention frame screws. They also align the backplate properly to the motherboard. Features in the retention frame slide over the standoffs and allow the installation of the screws with a minimum chance of cross threading. Additionally, four M3.5 PEM standoffs in the backplate serve as attachment points for the socket.

The insulator prevents the backplate from electrically shorting to the motherboard. A pressure- sensitive adhesive in the insulator keeps the backplate in place against the motherboard during assembly. The insulator also is thick enough to prevent any significant capacitive coupling between the motherboard and backplate.

3.3.2Retention Frame

The plastic retention frame, made of 20% glass-filled Lexan, is a two-piece implementation rather than the single-piece frame used for socket 940. This change accommodates the larger foot-print of socket F (1207) processors.

The retention frame serves multiple purposes. The retention frame aligns the heat sink and provides a stop for the heat sink in large shock-force events. The retention frame and backplate are attached to the motherboard by the motherboard vendor. Two screws securely hold the backplate and retention frame together. The two mounting tabs on the retention frame serve as attachment points for the heat sink spring clip.

Chapter 3	Thermal Design of Platforms Using the AMD Processor-In-a-	19
	Box (PIB) Thermal Solution

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Contents Thermal Design Guide for Socket F 1207 Processors Advanced Micro Devices, Inc. All rights reserved Contents Heat Sink Fans Thermal Interface Material List of Figures List of FiguresList of Figures List of Tables List of TablesList of Tables Revision History Revision HistoryRevision History Chapter Introduction Summary of RequirementsChapter Chapter Processor Thermal Solutions Processor Specifications1207-Pin Socket Socket DescriptionMotherboard Component Height Restrictions Sample Heat Sinks and Attachment Methods Thermal Solution Design RequirementsPart Description Material Quantity Backplate Assembly Retention Frame Thermal Design of Platforms Using the AMD Processor-In-a Chapter Thermal Design of Custom 1U-2P Systems Thermal Design of Custom 1U-2P SystemsSymbol Systems Spring Screws Exploded View of Thermal Solution for Custom 1U-2P SystemsFin Parameters Heat SinkFans Thermal Interface Material Thermal Design of Custom 1U-2P Systems Chapter Thermal Design of Custom 2U-4P Systems Thermal Design of Custom 2U-4P SystemsThermal Solution Design Requirements Heat sink Aluminum Fan Plastic Spring clip Backplate Assembly Chemical Element of SK7 Spring Steel Spring ClipHigh Performance Heat Sink for Custom 2U-4P Systems Fans Thermal Design of Custom 2U-4P Systems Appendix a Solution for Socket F 1207 ProcessorsSocket F 1207 PIB Board Component Height Restrictions 64.36 76.41 49.91 59.81 787724 000 784 520 189 Socket F 1207 PIB Socket Outline and Socket Window36.59 32.13 27.59 1207 PIB Heat Sink HeightZone 2x11.44 2x51.26 2x61.08Keep-Out 1207 PIB318 000 885 233 Thermal10.09 33.91 49.91 Solution for Socket F 1207 Processors Socket F 1207 Processor Appendix BHeight Restrictions Drawings for1207 2P Systems Processor32.16 71.98 24.54 10.09 49.91 64.36 BasedHoles, Contact Pads, No-Routing ZoneBased on ProcessorWindow Height Restriction Zone 1U-2P Systems 1207 Processor42.71 82.53 32.16 71.98 598 000 166 40.59 80.41 Keep-Out2P Board No-Through-Hole Keep Out22.04 10.09 33.9 49.91 61.86 1207 1U233 335 965 35.04Socket F 1207 Processor Appendix C Socket F 1207 2U-4P Board Component Height Restrictions 75.47 4P Mounting Holes, Contact Pads, and No-Routing Zone47.40 87.22 35.65 24.54 64.361207 2U-4P Socket Outline Custom 2U-4PSocket Window 681 266 2U-4P Systems 1207 Processor17.59 26040.59 80.41 Socket F 1207 2U-4P Board No-Through-Hole Keep-Out166 80.41 1207Socket F 1207 Processor Socket F 1207 Processors Appendix DStreamline Plot of AMD Reference Custom 2U-4P System