AMD 1207 manual Symbol

Page 22

Thermal Design Guide for Socket F (1207) Processors

32800 Rev. 3.02 August 2006

Depending on the system features and layout, more space around the socket may be available for the thermal solution than is shown in Figure 4 on page 21. This space permits heat sink designs with better thermal performance.

Appendix B on page 45 shows a complete, detailed set of keep-out drawings for custom 1U-2P systems based on socket F (1207) processors.

4.2Thermal Solution Design Requirements

To maintain the case temperature of the processor below the maximum specification, certain heat sink design parameters must be considered. Table 4 provides the design-target specifications that must be met for socket F (1207) processors to operate reliably.

Table 4.

Thermal Solution Design Requirements for Custom 1U-2P Systems

 

 

 

 

 

Symbol

Description

Maximum

 

 

 

 

 

L

Length of heat sink

87 mm

 

 

 

 

 

W

Width of heat sink

74 mm

 

 

 

 

 

H

Height of heat sink

28 mm

 

 

 

 

 

θca

Case-to-ambient thermal

0.26°C/W1, 2, 3

 

 

resistance

 

 

MHS

Mass of heat sink

450 g to 700 g

 

Fclip

Clip force

75 lbs ±15 lbs

 

TA

Local air temperature entering

38°C

 

 

processor heat sink

 

 

 

 

 

Notes:

 

 

 

1. This is the thermal resistance required for dual core, 90-nm socket F (1207) processors. The thermal resistance

requirement may vary depending on the product OPN. The user should consult the processor data sheet for the

thermal requirements specific to the part.

 

2. Heat sinks weighing up to 450 g can be attached to the motherboard. Heat sinks weighing over 450 g should be tied

directly to the chassis for more reliable shock and vibration performance.

 

3. This chapter describes a heat sink weighing less than or equal to 450 g.

 

 

 

 

 

4.3Sample Heat Sinks and Attachment Methods

The following sections provide one possible thermal design solution and the specifics on attaching that solution to the motherboard.

Table 5 on page 23 lists the parts used in the thermal reference design solution for 1U-2P systems based on socket F (1207) processors.

22

Thermal Design of Custom 1U-2P Systems

Chapter 4

Image 22
Contents Thermal Design Guide for Socket F 1207 Processors Advanced Micro Devices, Inc. All rights reserved Contents Heat Sink Fans Thermal Interface Material List of Figures List of FiguresList of Figures List of Tables List of TablesList of Tables Revision History Revision HistoryRevision History Summary of Requirements Chapter IntroductionChapter Processor Specifications Chapter Processor Thermal SolutionsSocket Description 1207-Pin SocketMotherboard Component Height Restrictions Thermal Solution Design Requirements Sample Heat Sinks and Attachment MethodsPart Description Material Quantity Backplate Assembly Retention Frame Thermal Design of Platforms Using the AMD Processor-In-a Thermal Design of Custom 1U-2P Systems Chapter Thermal Design of Custom 1U-2P SystemsSymbol Systems Exploded View of Thermal Solution for Custom 1U-2P Systems Spring ScrewsHeat Sink Fin ParametersFans Thermal Interface Material Thermal Design of Custom 1U-2P Systems Thermal Design of Custom 2U-4P Systems Chapter Thermal Design of Custom 2U-4P SystemsThermal Solution Design Requirements Heat sink Aluminum Fan Plastic Spring clip Backplate Assembly Spring Clip Chemical Element of SK7 Spring SteelHigh Performance Heat Sink for Custom 2U-4P Systems Fans Thermal Design of Custom 2U-4P Systems Solution for Socket F 1207 Processors Appendix aSocket F 1207 PIB Board Component Height Restrictions 787 64.36 76.41 49.91 59.81Socket F 1207 PIB Socket Outline and Socket Window 724 000 784 520 1892x11.44 2x51.26 2x61.08 1207 PIB Heat Sink HeightZone 36.59 32.13 27.59Keep-Out 1207 PIB318 000 885 233 Thermal10.09 33.91 49.91 Solution for Socket F 1207 Processors Appendix B Socket F 1207 Processor2P Systems Processor Drawings for1207 Height RestrictionsNo-Routing Zone BasedHoles, Contact Pads, 32.16 71.98 24.54 10.09 49.91 64.36Based on ProcessorWindow Height Restriction Zone 1U-2P Systems 1207 Processor42.71 82.53 32.16 71.98 Out Keep-Out2P Board No-Through-Hole Keep 598 000 166 40.59 80.4135.04 1207 1U233 335 965 22.04 10.09 33.9 49.91 61.86Socket F 1207 Processor Appendix C Socket F 1207 2U-4P Board Component Height Restrictions 24.54 64.36 4P Mounting Holes, Contact Pads, and No-Routing Zone47.40 87.22 35.65 75.471207 2U-4P Socket Outline Custom 2U-4PSocket Window 260 2U-4P Systems 1207 Processor17.59 681 266Socket F 1207 2U-4P Board No-Through-Hole Keep-Out 40.59 80.411207 166 80.41Socket F 1207 Processor Appendix D Socket F 1207 ProcessorsStreamline Plot of AMD Reference Custom 2U-4P System