AMD 1207 manual Heat Sink, Fin Parameters

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32800 Rev. 3.02 3.00 August 2006

Thermal Design Guide for Socket F (1207) Processors

Lifting the heat sink away from the processor can result in damage to the processor contact pads, the socket contacts, or the socket solder-ball joints. Maintaining the spring force is important for the life of the processor and the socket and for repeated installations and upgrades of the processor.

4.3.3Heat Sink

Figure 6 shows a picture of the reference design heat sink for 1U-2P systems. The footprint of the heat sink is 87 mm x 74 mm. The heat sink weighs 420 g and has aluminum fins soldered to a copper base. The copper base tapers from a thickness of 6 mm at the center to 1.5 mm at the edges. This tapering provides optimum heat-spreading performance from the processor to the heat sink while keeping the heat sink weight within specification. The fin geometry is designed to provide optimized thermal performance in combination with the fans, as described in Section 4.3.4, on page 26, in a typical 1U-2P system.

Figure 6. High Performance Heat Sink for Custom 1U-2P Systems

Table 6 shows the parameters of the aluminum fins for the high-performance heat sink shown in Figure 6.

Table 6.

Fin Parameters

 

 

 

 

 

 

 

 

 

 

 

Length

Height (at

Height (at Edges)

Thickness

Pitch

No. of Fins

 

Center)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

87 mm

22 mm

26.5 mm

0.4 mm

1.48

50

 

 

 

 

 

mm

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Chapter 4

Thermal Design of Custom 1U-2P Systems

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Contents Thermal Design Guide for Socket F 1207 Processors Advanced Micro Devices, Inc. All rights reserved Contents Heat Sink Fans Thermal Interface Material List of Figures List of FiguresList of Figures List of Tables List of TablesList of Tables Revision History Revision HistoryRevision History Chapter Introduction Summary of RequirementsChapter Chapter Processor Thermal Solutions Processor Specifications1207-Pin Socket Socket DescriptionMotherboard Component Height Restrictions Sample Heat Sinks and Attachment Methods Thermal Solution Design RequirementsPart Description Material Quantity Backplate Assembly Retention Frame Thermal Design of Platforms Using the AMD Processor-In-a Chapter Thermal Design of Custom 1U-2P Systems Thermal Design of Custom 1U-2P SystemsSymbol Systems Spring Screws Exploded View of Thermal Solution for Custom 1U-2P SystemsFin Parameters Heat SinkFans Thermal Interface Material Thermal Design of Custom 1U-2P Systems Chapter Thermal Design of Custom 2U-4P Systems Thermal Design of Custom 2U-4P SystemsThermal Solution Design Requirements Heat sink Aluminum Fan Plastic Spring clip Backplate Assembly Chemical Element of SK7 Spring Steel Spring ClipHigh Performance Heat Sink for Custom 2U-4P Systems Fans Thermal Design of Custom 2U-4P Systems Appendix a Solution for Socket F 1207 ProcessorsSocket F 1207 PIB Board Component Height Restrictions 64.36 76.41 49.91 59.81 787724 000 784 520 189 Socket F 1207 PIB Socket Outline and Socket WindowZone 1207 PIB Heat Sink Height2x11.44 2x51.26 2x61.08 36.59 32.13 27.59Keep-Out 1207 PIB318 000 885 233 Thermal10.09 33.91 49.91 Solution for Socket F 1207 Processors Socket F 1207 Processor Appendix B1207 Drawings for2P Systems Processor Height RestrictionsHoles, Contact Pads, BasedNo-Routing Zone 32.16 71.98 24.54 10.09 49.91 64.36Based on ProcessorWindow Height Restriction Zone 1U-2P Systems 1207 Processor42.71 82.53 32.16 71.98 2P Board No-Through-Hole Keep Keep-OutOut 598 000 166 40.59 80.41233 335 965 1207 1U35.04 22.04 10.09 33.9 49.91 61.86Socket F 1207 Processor Appendix C Socket F 1207 2U-4P Board Component Height Restrictions 47.40 87.22 35.65 4P Mounting Holes, Contact Pads, and No-Routing Zone24.54 64.36 75.471207 2U-4P Socket Outline Custom 2U-4PSocket Window 17.59 2U-4P Systems 1207 Processor260 681 26640.59 80.41 Socket F 1207 2U-4P Board No-Through-Hole Keep-Out166 80.41 1207Socket F 1207 Processor Socket F 1207 Processors Appendix DStreamline Plot of AMD Reference Custom 2U-4P System