Cypress CY7C1916JV18, CY7C1316JV18, CY7C1320JV18 Power Up Sequence in DDR-II Sram, DLL Constraints

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CY7C1316JV18, CY7C1916JV18 CY7C1318JV18, CY7C1320JV18

Power Up Sequence in DDR-II SRAM

DDR-II SRAMs must be powered up and initialized in a predefined manner to prevent undefined operations. During power up, when the DOFF is tied HIGH, the DLL is locked after 1024 cycles of stable clock.

Power Up Sequence

Apply power and drive DOFF LOW (all other inputs can be HIGH or LOW)

Apply VDD before VDDQ

Apply VDDQ before VREF or at the same time as VREF

After the power and clock (K, K) are stable take DOFF HIGH

The additional 1024 cycles of clocks are required for the DLL to lock.

DLL Constraints

DLL uses K clock as its synchronizing input. The input must have low phase jitter, which is specified as tKC Var.

The DLL functions at frequencies down to 120 MHz.

If the input clock is unstable and the DLL is enabled, then the DLL may lock onto an incorrect frequency, causing unstable SRAM behavior. To avoid this, provide 1024 cycles stable clock to relock to the desired clock frequency.

Power Up Waveforms

K

K

VDD/ VDDQ

DOFF

~ ~

 

~ ~

 

Unstable Clock

> 1024 Stable clock

Start Normal

 

 

Operation

Clock Start (Clock Starts after VDD/ V DDQ Stable)

VDD/ V DDQ Stable (< +/- 0.1V DC per 50ns )

Fix High (or tied to VDDQ)

Document Number: 001-15271 Rev. *B

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Contents Selection Guide FeaturesConfigurations Functional DescriptionCLK Logic Block Diagram CY7C1316JV18Logic Block Diagram CY7C1916JV18 DoffLogic Block Diagram CY7C1320JV18 Logic Block Diagram CY7C1318JV18BWS CY7C1916JV18 2M x Pin ConfigurationBall Fbga 13 x 15 x 1.4 mm Pinout CY7C1316JV18 2M xCY7C1320JV18 512K x CY7C1318JV18 1M xPin Name Pin Description Pin DefinitionsSynchronous Read/Write Input. When TDO for Jtag Power Supply Inputs to the Core of the DevicePower Supply Inputs for the Outputs of the Device Is Referenced with Respect toFunctional Overview SRAM#2 Application ExampleEcho Clocks SRAM#1 ZQBWS0 BWS1 Write Cycle DescriptionsNWS0 NWS1 BWS0 BWS1 BWS2 BWS3 BWS0Ieee 1149.1 Serial Boundary Scan Jtag Idcode State diagram for the TAP controller follows TAP Controller State DiagramTCK TAP Controller Block DiagramTAP Electrical Characteristics TDITAP Timing and Test Conditions TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsInstruction Codes Bit # Bump ID Boundary Scan OrderPower Up Sequence Power Up Sequence in DDR-II SramDLL Constraints Maximum Ratings Electrical CharacteristicsDC Electrical Characteristics AC Electrical CharacteristicsParameter Description Test Conditions Max Unit CapacitanceThermal Resistance AC Test Loads and WaveformsParameter Min Max Cypress Consortium Description 300 MHz UnitDLL Timing NOP Write Read Switching WaveformsNOP ReadOrdering Information Ball Fbga 13 x 15 x 1.40 mm Package DiagramVKN/KKVTMP REV ECN no Issue ORIG. Description of Change DateVKN/AESA