Cypress CY7C1916JV18, CY7C1316JV18 Is Referenced with Respect to, TDO for Jtag, TCK Pin for Jtag

Page 7

 

 

 

 

 

 

 

 

 

 

 

CY7C1316JV18, CY7C1916JV18

 

 

 

 

 

 

 

 

 

 

 

CY7C1318JV18, CY7C1320JV18

 

 

 

 

 

 

 

 

 

 

Pin Definitions (continued)

 

 

 

 

 

 

 

 

 

 

 

Pin Name

IO

 

 

 

 

 

 

Pin Description

 

CQ

Output Clock

 

CQ is Referenced with Respect to C. This is a free running clock and is synchronized to the input clock

 

 

 

 

 

 

for output data (C) of the DDR-II. In single clock mode, CQ is generated with respect to K. The timing for

 

 

 

 

 

 

the echo clocks is shown in Switching Characteristics on page 22.

 

 

 

 

Output Clock

 

 

is Referenced with Respect to

 

. This is a free running clock and is synchronized to the input clock

 

CQ

 

 

 

CQ

C

 

 

 

 

 

 

for output data (C) of the DDR-II. In single clock mode, CQ is generated with respect to K. The timing for

 

 

 

 

 

 

the echo clocks is shown in Switching Characteristics on page 22.

 

ZQ

Input

 

Output Impedance Matching Input. This input is used to tune the device outputs to the system data bus

 

 

 

 

 

 

impedance. CQ, CQ, and Q[x:0] output impedance are set to 0.2 x RQ, where RQ is a resistor connected

 

 

 

 

 

 

between ZQ and ground. Alternatively, this pin can be connected directly to VDDQ, which enables the

 

 

 

 

 

 

minimum impedance mode. This pin cannot be connected directly to GND or left unconnected.

 

 

 

 

Input

 

DLL Turn Off Active LOW. Connecting this pin to ground turns off the DLL inside the device. The timing

 

DOFF

 

 

 

 

 

 

in the DLL turned off operation is different from that listed in this data sheet. For normal operation, this

 

 

 

 

 

 

pin can be connected to a pull up through a 10 Kohm or less pull up resistor. The device behaves in DDR-I

 

 

 

 

 

 

mode when the DLL is turned off. In this mode, the device can be operated at a frequency of up to 167

 

 

 

 

 

 

MHz with DDR-I timing.

 

TDO

Output

 

TDO for JTAG.

 

 

 

 

 

 

TCK

Input

 

TCK Pin for JTAG.

 

 

 

 

 

 

TDI

Input

 

TDI Pin for JTAG.

 

 

 

 

 

 

TMS

Input

 

TMS Pin for JTAG.

 

 

 

 

 

 

NC

N/A

 

Not Connected to the Die. Can be tied to any voltage level.

 

 

 

 

 

 

NC/36M

N/A

 

Not Connected to the Die. Can be tied to any voltage level.

 

 

 

 

 

 

NC/72M

N/A

 

Not Connected to the Die. Can be tied to any voltage level.

 

 

 

 

 

 

NC/144M

N/A

 

Not Connected to the Die. Can be tied to any voltage level.

 

 

 

 

 

 

NC/288M

N/A

 

Not Connected to the Die. Can be tied to any voltage level.

 

 

 

 

 

 

VREF

Input-

 

Reference Voltage Input. Static input used to set the reference level for HSTL inputs, outputs, and AC

 

 

 

 

Reference

 

measurement points.

 

VDD

Power Supply

 

Power Supply Inputs to the Core of the Device.

 

VSS

Ground

 

Ground for the Device.

 

VDDQ

Power Supply

 

Power Supply Inputs for the Outputs of the Device.

Document Number: 001-15271 Rev. *B

Page 7 of 26

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Contents Selection Guide FeaturesConfigurations Functional DescriptionCLK Logic Block Diagram CY7C1316JV18Logic Block Diagram CY7C1916JV18 DoffLogic Block Diagram CY7C1320JV18 Logic Block Diagram CY7C1318JV18BWS CY7C1916JV18 2M x Pin ConfigurationBall Fbga 13 x 15 x 1.4 mm Pinout CY7C1316JV18 2M xCY7C1320JV18 512K x CY7C1318JV18 1M xPin Name Pin Description Pin DefinitionsSynchronous Read/Write Input. When TDO for Jtag Power Supply Inputs to the Core of the DevicePower Supply Inputs for the Outputs of the Device Is Referenced with Respect toFunctional Overview SRAM#2 Application ExampleEcho Clocks SRAM#1 ZQBWS0 BWS1 Write Cycle DescriptionsNWS0 NWS1 BWS0 BWS1 BWS2 BWS3 BWS0Ieee 1149.1 Serial Boundary Scan Jtag Idcode State diagram for the TAP controller follows TAP Controller State DiagramTCK TAP Controller Block DiagramTAP Electrical Characteristics TDITAP Timing and Test Conditions TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsInstruction Codes Bit # Bump ID Boundary Scan OrderPower Up Sequence Power Up Sequence in DDR-II SramDLL Constraints Maximum Ratings Electrical CharacteristicsDC Electrical Characteristics AC Electrical CharacteristicsParameter Description Test Conditions Max Unit CapacitanceThermal Resistance AC Test Loads and WaveformsParameter Min Max Cypress Consortium Description 300 MHz UnitDLL Timing NOP Write Read Switching WaveformsNOP ReadOrdering Information Ball Fbga 13 x 15 x 1.40 mm Package DiagramVKN/KKVTMP REV ECN no Issue ORIG. Description of Change DateVKN/AESA