Cypress CY7C1354CV25 Capacitance16, Thermal Resistance16, AC Test Loads and Waveforms, Package

Page 17

CY7C1354CV25

CY7C1356CV25

Capacitance[16]

Parameter

Description

Test Conditions

100 TQFP

119 BGA

165 FBGA

Unit

Max.

Max.

Max.

 

 

 

 

 

 

 

CIN

Input Capacitance

TA = 25°C, f = 1 MHz,

5

5

5

pF

 

 

VDD = 2.5V, VDDQ = 2.5V

 

 

 

 

CCLK

Clock Input Capacitance

5

5

5

pF

CI/O

Input/Output Capacitance

 

5

7

7

pF

Thermal Resistance[16]

Parameters

Description

Test Conditions

100 TQFP

119 BGA

165 FBGA

Unit

Package

Package

Package

ΘJA

Thermal Resistance

Test conditions follow standard

29.41

34.1

16.8

°C/W

 

(Junction to

test methods and procedures

 

 

 

 

 

Ambient)

for measuring thermal

 

 

 

 

 

 

impedance, per EIA/JESD51.

 

 

 

 

Θ

Thermal Resistance

6.13

14

3.0

°C/W

JC

(Junction to Case)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AC Test Loads and Waveforms

2.5V I/O Test Load

OUTPUT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.5V

 

 

 

 

 

 

 

R = 1667

 

 

 

 

 

ALL INPUT PULSES

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VDDQ

 

 

 

 

 

 

 

 

 

 

 

Z0 = 50

 

 

 

 

 

OUTPUT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RL = 50

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

10%

 

 

 

 

 

 

90%

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5 pF

 

 

 

 

 

 

 

 

 

 

 

 

 

R = 1538

GND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

INCLUDING

 

 

 

 

 

 

 

 

 

 

 

 

 

1 ns

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VT

= 1.25V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JIG AND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SCOPE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(a)

 

 

 

 

 

 

 

(b)

 

 

 

 

 

 

 

 

 

 

(c)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Note:

16. Tested initially and after any design or process change that may affect these parameters.

90%

10%

1 ns

Document #: 38-05537 Rev. *H

Page 17 of 28

[+] Feedback

Image 17
Contents Logic Block Diagram-CY7C1354CV25 256K x FeaturesFunctional Description1 Cypress Semiconductor CorporationMaximum Access Time Maximum Operating Current Logic Block Diagram-CY7C1356CV25 512K xSelection Guide 250 MHz 200 MHz 166 MHz UnitCY7C1354CV25 256K × Pin Configurations Pin Tqfp PinoutCY7C1354CV25 256K × Pin Configurations Ball BGA PinoutPin Configurations Ball Fbga Pinout Pin Definitions Burst Read Accesses Single Read AccessesSingle Write Accesses Functional OverviewZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Mode = GND Partial Write Cycle Description2, 3, 4 Sleep ModeFunction CY7C1354CV25 BW d BW c BW b BW a Function CY7C1356CV25 BW b BW aIeee 1149.1 Serial Boundary Scan Jtag TAP Controller Block DiagramTAP Controller State Diagram10 TAP Instruction Set Bypass RegisterParameter Description Min Max Unit Clock TAP TimingOutput Times Set-up Times5V TAP AC Output Load Equivalent 5V TAP AC Test ConditionsIdentification Register Definitions Scan Register SizesBit # Ball ID Boundary Scan Exit Order 256K ×B10 Boundary Scan Exit Order 512K ×J10 K10Maximum Ratings Electrical Characteristics Over the Operating Range14Operating Range RangeThermal Resistance16 Capacitance16AC Test Loads and Waveforms Package250 200 166 Parameter Description Unit Min Max Switching Characteristics Over the Operating Range 18Read/Write Timing23, 24 Switching WaveformsADV/LD BWX DON’T Care UndefinedNOP, Stall and Deselect CYCLES23, 24 CLK CEN ADV/LD BWXDON’T Care ZZ Mode Timing27CY7C1356CV25-166BZXI Document # 38-05537 Rev. *H Ordering InformationCY7C1356CV25-200BZXI Document # 38-05537 Rev. *H CY7C1356CV25-250BZXI Document # 38-05537 Rev. *H Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package Diagrams90±0.05 Ball BGA 14 x 22 x 2.4 mmBall Fbga 13 x 15 x 1.4 mm Document History ECN No Issue Date Orig. Description of Change

CY7C1356CV25, CY7C1354CV25 specifications

The Cypress CY7C1354CV25 and CY7C1356CV25 are high-performance, synchronous SRAM (Static Random Access Memory) devices designed for bandwidth-intensive applications. Both components are part of the Cypress family of low-power high-speed SRAMs, making them ideal for use in networking, telecommunications, and high-speed data processing systems.

One of the main features of the CY7C1354CV25 and CY7C1356CV25 is their wide data bus. The CY7C1354CV25 provides a 4 Megabit memory capacity with a 36-bit wide data interface, while the CY7C1356CV25 boosts this to 6 Megabits with a similarly wide data interface. This allows for high data throughput and efficiency in applications where quick access to large data sets is critical.

Both devices offer asynchronous write and synchronous read capabilities, enabling them to support pipelines and burst accesses effectively. The memory can be accessed in a single cycle, which considerably enhances performance in applications that require quick response times, such as high-speed packet processing in routers and switches.

The Cypress SRAMs are built using advanced CMOS technology, enabling low power consumption, which is essential for mobile and battery-operated devices. Their operating voltage range, typically between 2.7V and 3.6V, contributes to the low power profile while providing a high level of performance.

Moreover, both devices support a wide temperature range, making them suitable for industrial applications. They can operate in environments from -40°C to +125°C, ensuring reliability and performance under varying conditions. This makes the CY7C1354CV25 and CY7C1356CV25 particularly valuable for automotive and aerospace applications where temperature extremes can be encountered.

Cypress has enhanced the reliability of these SRAMs with features such as built-in error detection and correction capabilities. This ensures data integrity, which is crucial for mission-critical applications.

In summary, the Cypress CY7C1354CV25 and CY7C1356CV25 ensure tight integration of high capacity, speed, and reliability. With their advanced synchronous architecture, low power consumption, and broad temperature range, they represent an excellent choice for applications that demand high performance in challenging environments. These SRAM devices continue to meet the needs of modern electronic designs, making them a trusted solution in the industry.