Cypress CY7C1354CV25, CY7C1356CV25 Functional Overview, Single Read Accesses, Burst Read Accesses

Page 7

 

 

 

 

CY7C1354CV25

 

 

 

 

CY7C1356CV25

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Definitions (continued)

 

 

 

 

Pin Name

I/O Type

 

Pin Description

 

 

 

 

NC

 

No connects. This pin is not connected to the die.

 

 

 

 

NC (18,

 

These pins are not connected. They will be used for expansion to the 18M, 36M, 72M, 144M

36, 72,

 

 

 

288M, 576M, and 1G densities.

144, 288,

 

 

 

 

 

576, 1G

 

 

 

 

 

ZZ

Input-

 

ZZ “sleep” Input. This active HIGH input places the device in a non-time critical “sleep” condition

 

Asynchronous

 

with data integrity preserved. For normal operation, this pin has to be LOW or left floating.

 

 

 

 

ZZ pin has an internal pull-down.

Functional Overview

The CY7C1354CV25 and CY7C1356CV25 are synchronous-pipelined Burst NoBL SRAMs designed specifi- cally to eliminate wait states during Write/Read transitions. All synchronous inputs pass through input registers controlled by the rising edge of the clock. The clock signal is qualified with the Clock Enable input signal (CEN). If CEN is HIGH, the clock signal is not recognized and all internal states are maintained. All synchronous operations are qualified with CEN. All data outputs pass through output registers controlled by the rising edge of the clock. Maximum access delay from the clock rise (tCO) is 2.8 ns (250-MHz device).

Accesses can be initiated by asserting all three Chip Enables (CE1, CE2, CE3) active at the rising edge of the clock. If Clock Enable (CEN) is active LOW and ADV/LD is asserted LOW, the address presented to the device will be latched. The access can either be a Read or Write operation, depending on the status of the Write Enable (WE). BW[d:a] can be used to conduct Byte Write operations.

Write operations are qualified by the Write Enable (WE). All Writes are simplified with on-chip synchronous self-timed Write circuitry.

Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) simplify depth expansion. All operations (Reads, Writes, and Deselects) are pipelined. ADV/LD should be driven LOW once the device has been deselected in order to load a new address for the next operation.

Single Read Accesses

A read access is initiated when the following conditions are satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2, and CE3 are ALL asserted active, (3) the Write Enable input signal WE is deasserted HIGH, and (4) ADV/LD is asserted LOW. The address presented to the address inputs is latched into the address register and presented to the memory core and control logic. The control logic determines that a read access is in progress and allows the requested data to propagate to the input of the output register. At the rising edge of the next clock the requested data is allowed to propagate through the output register and onto the data bus within 2.8 ns (250-MHz device) provided OE is active LOW. After the first clock of the read access the output buffers are controlled by OE and the internal control logic. OE must be driven LOW in order for the device to drive out the requested data. During the second clock, a subsequent operation (Read/Write/Deselect) can be initiated. Deselecting the device is also pipelined. Therefore, when the SRAM is deselected at clock rise by one

of the chip enable signals, its output will tri-state following the next clock rise.

Burst Read Accesses

The CY7C1354CV25 and CY7C1356CV25 have an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four Reads without reasserting the address inputs. ADV/LD must be driven LOW in order to load a new address into the SRAM, as described in the Single Read Access section above. The sequence of the burst counter is determined by the MODE input signal. A LOW input on MODE selects a linear burst mode, a HIGH selects an interleaved burst sequence. Both burst counters use A0 and A1 in the burst sequence, and will wrap around when incremented suffi- ciently. A HIGH input on ADV/LD will increment the internal burst counter regardless of the state of chip enables inputs or WE. WE is latched at the beginning of a burst cycle. Therefore, the type of access (Read or Write) is maintained throughout the burst sequence.

Single Write Accesses

Write access are initiated when the following conditions are satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2, and CE3 are ALL asserted active, and (3) the Write signal WE is asserted LOW. The address presented to A0A16 is loaded into the Address Register. The write signals are latched into the Control Logic block.

On the subsequent clock rise the data lines are automatically tri-stated regardless of the state of the OE input signal. This allows the external logic to present the data on DQ and DQP (DQa,b,c,d/DQPa,b,c,d for CY7C1354CV25 and DQa,b/DQPa,b for CY7C1356CV25). In addition, the address for the subse- quent access (Read/Write/Deselect) is latched into the address register (provided the appropriate control signals are asserted).

On the next clock rise the data presented to DQ and DQP (DQa,b,c,d/DQPa,b,c,d for CY7C1354CV25 and DQa,b/DQPa,b for CY7C1356CV25) (or a subset for byte write operations, see Write Cycle Description table for details) inputs is latched into the device and the Write is complete.

The data written during the Write operation is controlled by BW (BWa,b,c,d for CY7C1354CV25 and BWa,b for CY7C1356CV25) signals. The CY7C1354CV25/56CV25 provides Byte Write capability that is described in the Write Cycle Description table. Asserting the Write Enable input (WE) with the selected Byte Write Select (BW) input will selectively write to only the desired bytes. Bytes not selected during a Byte Write operation will remain unaltered. A synchronous self-timed write mechanism has been provided to simplify the Write operations. Byte Write capability has been included in

Document #: 38-05537 Rev. *H

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Contents Cypress Semiconductor Corporation FeaturesLogic Block Diagram-CY7C1354CV25 256K x Functional Description1250 MHz 200 MHz 166 MHz Unit Logic Block Diagram-CY7C1356CV25 512K xMaximum Access Time Maximum Operating Current Selection GuideCY7C1354CV25 256K × Pin Configurations Pin Tqfp PinoutCY7C1354CV25 256K × Pin Configurations Ball BGA PinoutPin Configurations Ball Fbga Pinout Pin Definitions Functional Overview Single Read AccessesBurst Read Accesses Single Write AccessesLinear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics Function CY7C1356CV25 BW b BW a Sleep ModePartial Write Cycle Description2, 3, 4 Function CY7C1354CV25 BW d BW c BW b BW aTAP Controller State Diagram10 TAP Controller Block DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Instruction Set Bypass RegisterSet-up Times TAP TimingParameter Description Min Max Unit Clock Output TimesScan Register Sizes 5V TAP AC Test Conditions5V TAP AC Output Load Equivalent Identification Register DefinitionsBit # Ball ID Boundary Scan Exit Order 256K ×K10 Boundary Scan Exit Order 512K ×B10 J10Range Electrical Characteristics Over the Operating Range14Maximum Ratings Operating RangePackage Capacitance16Thermal Resistance16 AC Test Loads and Waveforms250 200 166 Parameter Description Unit Min Max Switching Characteristics Over the Operating Range 18DON’T Care Undefined Switching WaveformsRead/Write Timing23, 24 ADV/LD BWXNOP, Stall and Deselect CYCLES23, 24 CLK CEN ADV/LD BWXDON’T Care ZZ Mode Timing27CY7C1356CV25-166BZXI Document # 38-05537 Rev. *H Ordering InformationCY7C1356CV25-200BZXI Document # 38-05537 Rev. *H CY7C1356CV25-250BZXI Document # 38-05537 Rev. *H Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package Diagrams90±0.05 Ball BGA 14 x 22 x 2.4 mmBall Fbga 13 x 15 x 1.4 mm Document History ECN No Issue Date Orig. Description of Change

CY7C1356CV25, CY7C1354CV25 specifications

The Cypress CY7C1354CV25 and CY7C1356CV25 are high-performance, synchronous SRAM (Static Random Access Memory) devices designed for bandwidth-intensive applications. Both components are part of the Cypress family of low-power high-speed SRAMs, making them ideal for use in networking, telecommunications, and high-speed data processing systems.

One of the main features of the CY7C1354CV25 and CY7C1356CV25 is their wide data bus. The CY7C1354CV25 provides a 4 Megabit memory capacity with a 36-bit wide data interface, while the CY7C1356CV25 boosts this to 6 Megabits with a similarly wide data interface. This allows for high data throughput and efficiency in applications where quick access to large data sets is critical.

Both devices offer asynchronous write and synchronous read capabilities, enabling them to support pipelines and burst accesses effectively. The memory can be accessed in a single cycle, which considerably enhances performance in applications that require quick response times, such as high-speed packet processing in routers and switches.

The Cypress SRAMs are built using advanced CMOS technology, enabling low power consumption, which is essential for mobile and battery-operated devices. Their operating voltage range, typically between 2.7V and 3.6V, contributes to the low power profile while providing a high level of performance.

Moreover, both devices support a wide temperature range, making them suitable for industrial applications. They can operate in environments from -40°C to +125°C, ensuring reliability and performance under varying conditions. This makes the CY7C1354CV25 and CY7C1356CV25 particularly valuable for automotive and aerospace applications where temperature extremes can be encountered.

Cypress has enhanced the reliability of these SRAMs with features such as built-in error detection and correction capabilities. This ensures data integrity, which is crucial for mission-critical applications.

In summary, the Cypress CY7C1354CV25 and CY7C1356CV25 ensure tight integration of high capacity, speed, and reliability. With their advanced synchronous architecture, low power consumption, and broad temperature range, they represent an excellent choice for applications that demand high performance in challenging environments. These SRAM devices continue to meet the needs of modern electronic designs, making them a trusted solution in the industry.