Cypress CY7C1354CV25, CY7C1356CV25 manual Ball Fbga 13 x 15 x 1.4 mm

Page 27

CY7C1354CV25

CY7C1356CV25

Package Diagrams (continued)

165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)

15.00±0.10

TOP VIEW

PIN 1 CORNER

1

2

3

4

5

6

7

8

9

10

11

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

15.00±0.10

14.00

BOTTOM VIEW

PIN 1 CORNER

Ø0.05 M C Ø0.25 M C A B

Ø0.50 -0.06(165X)

+0.14

11

10

9

8

7

6

5

4

3

2

1

1.00

7.00

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

A

B

0.25 C

0.53±0.05

 

0.36

13.00±0.10

SEATING PLANE

C

1.40MAX.

0.15C

 

 

 

 

0.35±0.06

A

1.00

5.00

10.00

B

13.00±0.10

0.15(4X)

NOTES :

SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)

PACKAGE WEIGHT : 0.475g

JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE CODE : BB0AC

51-85180-*A

NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device Technology, Inc. All product and company names mentioned in this document are the trademarks of their respective holders

Document #: 38-05537 Rev. *H

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© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

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Contents Cypress Semiconductor Corporation FeaturesLogic Block Diagram-CY7C1354CV25 256K x Functional Description1250 MHz 200 MHz 166 MHz Unit Logic Block Diagram-CY7C1356CV25 512K xMaximum Access Time Maximum Operating Current Selection GuideCY7C1354CV25 256K × Pin Configurations Pin Tqfp PinoutCY7C1354CV25 256K × Pin Configurations Ball BGA PinoutPin Configurations Ball Fbga Pinout Pin Definitions Functional Overview Single Read AccessesBurst Read Accesses Single Write AccessesInterleaved Burst Address Table Mode = Floating or VDD Linear Burst Address Table Mode = GNDZZ Mode Electrical Characteristics Function CY7C1356CV25 BW b BW a Sleep ModePartial Write Cycle Description2, 3, 4 Function CY7C1354CV25 BW d BW c BW b BW aTAP Controller Block Diagram TAP Controller State Diagram10Ieee 1149.1 Serial Boundary Scan Jtag TAP Instruction Set Bypass RegisterSet-up Times TAP TimingParameter Description Min Max Unit Clock Output TimesScan Register Sizes 5V TAP AC Test Conditions5V TAP AC Output Load Equivalent Identification Register DefinitionsBit # Ball ID Boundary Scan Exit Order 256K ×K10 Boundary Scan Exit Order 512K ×B10 J10Range Electrical Characteristics Over the Operating Range14Maximum Ratings Operating RangePackage Capacitance16Thermal Resistance16 AC Test Loads and Waveforms250 200 166 Parameter Description Unit Min Max Switching Characteristics Over the Operating Range 18DON’T Care Undefined Switching WaveformsRead/Write Timing23, 24 ADV/LD BWXNOP, Stall and Deselect CYCLES23, 24 CLK CEN ADV/LD BWXDON’T Care ZZ Mode Timing27CY7C1356CV25-166BZXI Document # 38-05537 Rev. *H Ordering InformationCY7C1356CV25-200BZXI Document # 38-05537 Rev. *H CY7C1356CV25-250BZXI Document # 38-05537 Rev. *H Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package Diagrams90±0.05 Ball BGA 14 x 22 x 2.4 mmBall Fbga 13 x 15 x 1.4 mm Document History ECN No Issue Date Orig. Description of Change

CY7C1356CV25, CY7C1354CV25 specifications

The Cypress CY7C1354CV25 and CY7C1356CV25 are high-performance, synchronous SRAM (Static Random Access Memory) devices designed for bandwidth-intensive applications. Both components are part of the Cypress family of low-power high-speed SRAMs, making them ideal for use in networking, telecommunications, and high-speed data processing systems.

One of the main features of the CY7C1354CV25 and CY7C1356CV25 is their wide data bus. The CY7C1354CV25 provides a 4 Megabit memory capacity with a 36-bit wide data interface, while the CY7C1356CV25 boosts this to 6 Megabits with a similarly wide data interface. This allows for high data throughput and efficiency in applications where quick access to large data sets is critical.

Both devices offer asynchronous write and synchronous read capabilities, enabling them to support pipelines and burst accesses effectively. The memory can be accessed in a single cycle, which considerably enhances performance in applications that require quick response times, such as high-speed packet processing in routers and switches.

The Cypress SRAMs are built using advanced CMOS technology, enabling low power consumption, which is essential for mobile and battery-operated devices. Their operating voltage range, typically between 2.7V and 3.6V, contributes to the low power profile while providing a high level of performance.

Moreover, both devices support a wide temperature range, making them suitable for industrial applications. They can operate in environments from -40°C to +125°C, ensuring reliability and performance under varying conditions. This makes the CY7C1354CV25 and CY7C1356CV25 particularly valuable for automotive and aerospace applications where temperature extremes can be encountered.

Cypress has enhanced the reliability of these SRAMs with features such as built-in error detection and correction capabilities. This ensures data integrity, which is crucial for mission-critical applications.

In summary, the Cypress CY7C1354CV25 and CY7C1356CV25 ensure tight integration of high capacity, speed, and reliability. With their advanced synchronous architecture, low power consumption, and broad temperature range, they represent an excellent choice for applications that demand high performance in challenging environments. These SRAM devices continue to meet the needs of modern electronic designs, making them a trusted solution in the industry.
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