Cypress CY7C1472BV25, CY7C1474BV25 manual Features, Functional Description, Selection Guide

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CY7C1470BV25

CY7C1472BV25, CY7C1474BV25

72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL™ Architecture

Features

Pin-compatible and functionally equivalent to ZBT™

Supports 250 MHz bus operations with zero wait states

Available speed grades are 250, 200, and 167 MHz

Internally self-timed output buffer control to eliminate the need to use asynchronous OE

Fully registered (inputs and outputs) for pipelined operation

Byte Write capability

Single 2.5V power supply

2.5V IO supply (VDDQ)

Fast clock-to-output times

3.0 ns (for 250-MHz device)

Clock Enable (CEN) pin to suspend operation

Synchronous self-timed writes

CY7C1470BV25, CY7C1472BV25 available in JEDEC-standard Pb-free 100-pin TQFP, Pb-free and non-Pb-free 165-ball FBGA package. CY7C1474BV25 available in Pb-free and non-Pb-free 209-ball FBGA package

IEEE 1149.1 JTAG Boundary Scan compatible

Burst capability—linear or interleaved burst order

“ZZ” Sleep Mode option and Stop Clock option

Functional Description

The CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25 are 2.5V, 2M x 36/4M x 18/1M x 72 synchronous pipelined burst SRAMs with No Bus Latency™ (NoBL™) logic, respectively. They are designed to support unlimited true back-to-back read or write operations with no wait states. The CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25 are equipped with the advanced (NoBL) logic required to enable consecutive read or write operations with data being transferred on every clock cycle. This feature dramatically improves the throughput of data in systems that require frequent read or write transitions. The CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25 are pin-compatible and functionally equivalent to ZBT devices.

All synchronous inputs pass through input registers controlled by the rising edge of the clock. All data outputs pass through output registers controlled by the rising edge of the clock. The clock input is qualified by the Clock Enable (CEN) signal, which when deasserted suspends operation and extends the previous clock cycle. Write operations are controlled by the Byte Write Selects

(BWa–BWdfor CY7C1470BV25, BWa–BWbfor CY7C1472BV25, and BWa–BWhfor CY7C1474BV25) and a Write Enable (WE) input. All writes are conducted with on-chip synchronous self-timed write circuitry.

Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) provide for easy bank selection and output tri-state control. To avoid bus contention, the output drivers are synchronously tri-stated during the data portion of a write sequence.

Selection Guide

Description

250 MHz

200 MHz

167 MHz

Unit

Maximum Access Time

3.0

3.0

3.4

ns

Maximum Operating Current

450

450

400

mA

Maximum CMOS Standby Current

120

120

120

mA

Cypress Semiconductor Corporation • 198 Champion Court

San Jose, CA 95134-1709

408-943-2600

Document #: 001-15032 Rev. *D

 

Revised February 29, 2008

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Contents Functional Description FeaturesSelection Guide Description 250 MHz 200 MHz 167 MHz UnitLogic Block Diagram CY7C1472BV25 4M x Logic Block Diagram CY7C1470BV25 2M xADV/LD Logic Block Diagram CY7C1474BV25 1M xPin Tqfp Pinout Pin ConfigurationsNC/1G CE2 CLK CENTDI TDO ModeBall Fbga 14 x 22 x 1.76 mm Pinout CY7C1474BV25 1M × ADV/LD Pin Definitions Pin Name IO Type Pin DescriptionDqpx TDIFunctional Overview Burst Write Accesses ZZ Mode Electrical CharacteristicsParameter Description Test Conditions Min Max Unit Address Operation Truth TableUsed Function CY7C1470BV25 Partial Write Cycle DescriptionFunction CY7C1472BV25 Function CY7C1474BV25Ieee 1149.1 Serial Boundary Scan Jtag TAP Controller State DiagramTAP Instruction Set TAP Timing Parameter Description Min Max Unit Clock TAP AC Switching CharacteristicsHold Times 5V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating ConditionsGND ≤ VI ≤ Vddq Scan Register Sizes Register Name Bit SizeBoundary Scan Exit Order 2M x Bit # Ball ID Identification Codes Instruction DescriptionBoundary Scan Exit Order 1M x Boundary Scan Exit Order 4M xBit # Ball ID 10 R1 11 R2 12 R3 13 P2Maximum Ratings Electrical CharacteristicsOperating Range Range AmbientThermal Resistance CapacitanceAC Test Loads and Waveforms Parameter Description Test Conditions Tqfp Fbga UnitSetup Times Switching CharacteristicsParameter Description 250 200 167 Unit Min Max Output TimesADV/LD Address Switching WaveformsData A3 A4NOP, Stall and Deselect Cycles Ordering Information 250 Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package DiagramsBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Document History ECN No Issue Date Orig. of Change Description of Change