Cypress CY7C1474BV25, CY7C1472BV25 manual ZZ Mode Electrical Characteristics, Burst Write Accesses

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CY7C1470BV25 CY7C1472BV25, CY7C1474BV25

access (read, write, or deselect) is latched into the Address Register (provided the appropriate control signals are asserted).

On the next clock rise the data presented to DQ and DQP (DQa,b,c,d/DQPa,b,c,d for CY7C1470BV25, DQa,b/DQPa,b for

CY7C1472BV25, DQa,b,c,d,e,f,g,h/DQPa,b,c,d,e,f,g,h for CY7C1474BV25) (or a subset for Byte Write operations, see “Partial Write Cycle Description” on page 11 for details) inputs is latched into the device and the Write is complete.

The data written during the Write operation is controlled by BW (BWa,b,c,d for CY7C1470BV25, BWa,b for CY7C1472BV25, and BWa,b,c,d,e,f,g,h for CY7C1474BV25) signals. The CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25 provides Byte Write capability that is described in “Partial Write Cycle Description” on page 11. Asserting the WE input with the selected BW input selectively writes to only the desired bytes. Bytes not selected during a Byte Write operation remain unaltered. A synchronous self-timed write mechanism has been provided to simplify the write operations. Byte Write capability has been included to greatly simplify read, modify, or write sequences, which can be reduced to simple Byte Write opera- tions.

Because the CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25 are common IO devices, data must not be driven into the device while the outputs are active. OE can be deasserted HIGH before presenting data to the DQ and DQP (DQa,b,c,d/DQPa,b,c,d for CY7C1470BV25, DQa,b/DQPa,b for CY7C1472BV25, and DQa,b,c,d,e,f,g,h/DQPa,b,c,d,e,f,g,h for CY7C1474BV25) inputs. Doing so tri-states the output drivers. As a safety precaution, DQ and DQP (DQa,b,c,d/DQPa,b,c,d for CY7C1470BV25, DQa,b/DQPa,b for CY7C1472BV25, and DQa,b,c,d,e,f,g,h/DQPa,b,c,d,e,f,g,h for CY7C1474BV25) are automatically tri-stated during the data portion of a write cycle, regardless of the state of OE.

Burst Write Accesses

The CY7C1470BV25, CY7C1472BV25, and CY7C1474BV25 has an on-chip burst counter that enables the user to supply a single address and conduct up to four write operations without reasserting the address inputs. ADV/LD must be driven LOW to load the initial address, as described in “Single Write Accesses”

on page 8. When ADV/LD is driven HIGH on the subsequent clock rise, the Chip Enables (CE1, CE2, and CE3) and WE inputs are ignored and the burst counter is incremented. The correct BW (BWa,b,c,d for CY7C1470BV25, BWa,b for CY7C1472BV25, and BWa,b,c,d,e,f,g,h for CY7C1474BV25) inputs must be driven in each cycle of the burst write to write the correct bytes of data.

Sleep Mode

The ZZ input pin is an asynchronous input. Asserting ZZ places the SRAM in a power conservation “sleep” mode. Two clock cycles are required to enter into or exit from this “sleep” mode. While in this mode, data integrity is guaranteed. Accesses pending when entering the “sleep” mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected before entering the “sleep” mode. CE1, CE2, and CE3, must remain inactive for the duration of tZZREC after the ZZ input returns LOW.

Table 2. Linear Burst Address Table (MODE = GND)

First

Second

Third

Fourth

Address

Address

Address

Address

A1,A0

A1,A0

A1,A0

A1,A0

 

 

 

 

 

00

 

01

10

11

 

 

 

 

 

01

 

10

11

00

 

 

 

 

 

10

 

11

00

01

 

 

 

 

 

11

 

00

01

10

 

 

 

 

 

Table 3. Interleaved Burst Address Table

 

(MODE = Floating or VDD)

 

 

First

 

Second

Third

Fourth

Address

 

Address

Address

Address

A1,A0

 

A1,A0

A1,A0

A1,A0

00

 

01

10

11

01

 

00

11

10

10

 

11

00

01

11

 

10

01

00

ZZ Mode Electrical Characteristics

Parameter

Description

Test Conditions

Min

Max

Unit

IDDZZ

Sleep mode standby current

ZZ > VDD 0.2V

 

120

mA

tZZS

Device operation to ZZ

ZZ > VDD 0.2V

 

2tCYC

ns

tZZREC

ZZ recovery time

ZZ < 0.2V

2tCYC

 

ns

tZZI

ZZ active to sleep current

This parameter is sampled

 

2tCYC

ns

tRZZI

ZZ Inactive to exit sleep current

This parameter is sampled

0

 

ns

Document #: 001-15032 Rev. *D

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Contents Functional Description FeaturesSelection Guide Description 250 MHz 200 MHz 167 MHz UnitLogic Block Diagram CY7C1472BV25 4M x Logic Block Diagram CY7C1470BV25 2M xADV/LD Logic Block Diagram CY7C1474BV25 1M xPin Tqfp Pinout Pin ConfigurationsNC/1G CE2 CLK CENTDI TDO ModeBall Fbga 14 x 22 x 1.76 mm Pinout CY7C1474BV25 1M × ADV/LD Pin Definitions Pin Name IO Type Pin DescriptionDqpx TDIFunctional Overview ZZ Mode Electrical Characteristics Burst Write AccessesParameter Description Test Conditions Min Max Unit Truth Table Address OperationUsed Function CY7C1470BV25 Partial Write Cycle DescriptionFunction CY7C1472BV25 Function CY7C1474BV25Ieee 1149.1 Serial Boundary Scan Jtag TAP Controller State DiagramTAP Instruction Set TAP Timing TAP AC Switching Characteristics Parameter Description Min Max Unit ClockHold Times 5V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating ConditionsGND ≤ VI ≤ Vddq Scan Register Sizes Register Name Bit SizeBoundary Scan Exit Order 2M x Bit # Ball ID Identification Codes Instruction DescriptionBoundary Scan Exit Order 1M x Boundary Scan Exit Order 4M xBit # Ball ID 10 R1 11 R2 12 R3 13 P2Maximum Ratings Electrical CharacteristicsOperating Range Range AmbientThermal Resistance CapacitanceAC Test Loads and Waveforms Parameter Description Test Conditions Tqfp Fbga UnitSetup Times Switching CharacteristicsParameter Description 250 200 167 Unit Min Max Output TimesADV/LD Address Switching WaveformsData A3 A4NOP, Stall and Deselect Cycles Ordering Information 250 Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package DiagramsBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Document History ECN No Issue Date Orig. of Change Description of Change