Cypress CY7C1472BV25, CY7C1474BV25, CY7C1470BV25 manual 5V TAP AC Test Conditions, GND ≤ VI ≤ Vddq

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CY7C1470BV25 CY7C1472BV25, CY7C1474BV25

2.5V TAP AC Test Conditions

Input pulse levels

VSS to 2.5V

Input rise and fall time

1 ns

Input timing reference levels

1.25V

Output reference levels

1.25V

Test load termination supply voltage

1.25V

Figure 5. 2.5V TAP AC Output Load Equivalent

1.25V

50Ω

TDO

ZO= 50Ω

 

 

 

 

 

 

20pF

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TAP DC Electrical Characteristics And Operating Conditions

(0°C < TA < +70°C; VDD = 2.5V ±0.125V unless otherwise noted)[11]

Parameter

Description

Test Conditions

Min

Max

Unit

VOH1

Output HIGH Voltage

IOH = –1.0 mA, VDDQ = 2.5V

1.7

 

V

VOH2

Output HIGH Voltage

IOH = –100 μA, VDDQ = 2.5V

2.1

 

V

VOL1

Output LOW Voltage

IOL = 1.0 mA, VDDQ = 2.5V

 

0.4

V

VOL2

Output LOW Voltage

IOL = 100 μA, VDDQ = 2.5V

 

0.2

V

VIH

Input HIGH Voltage

VDDQ = 2.5V

1.7

VDD + 0.3

V

VIL

Input LOW Voltage

VDDQ = 2.5V

–0.3

0.7

V

IX

Input Load Current

GND VI VDDQ

–5

5

μA

Table 6. Identification Register Definitions

Instruction Field

CY7C1470BV25

CY7C1472BV25

CY7C1474BV25

Description

(2M x 36)

(4M x 18)

(1M x 72)

 

 

Revision Number (31:29)

000

000

000

Describes the version number

 

 

 

 

 

Device Depth (28:24)

01011

01011

01011

Reserved for internal use

 

 

 

 

 

Architecture/Memory Type(23:18)

001000

001000

001000

Defines memory type and archi-

 

 

 

 

tecture

Bus Width/Density(17:12)

100100

010100

110100

Defines width and density

 

 

 

 

 

Cypress JEDEC ID Code (11:1)

00000110100

00000110100

00000110100

Allows unique identification of

 

 

 

 

SRAM vendor

ID Register Presence Indicator (0)

1

1

1

Indicates the presence of an ID

 

 

 

 

register

Table 7. Scan Register Sizes

Register Name

Bit Size (x36)

Bit Size (x18)

Bit Size (x72)

Instruction

3

3

3

 

 

 

 

Bypass

1

1

1

 

 

 

 

ID

32

32

32

 

 

 

 

Boundary Scan Order–165FBGA

71

52

 

 

 

 

Boundary Scan Order–209BGA

110

 

 

 

 

Note

11. All voltages refer to VSS (GND).

Document #: 001-15032 Rev. *D

Page 16 of 29

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Contents Features Functional DescriptionSelection Guide Description 250 MHz 200 MHz 167 MHz UnitLogic Block Diagram CY7C1470BV25 2M x Logic Block Diagram CY7C1472BV25 4M xLogic Block Diagram CY7C1474BV25 1M x ADV/LDPin Configurations Pin Tqfp PinoutCEN NC/1G CE2 CLKTDI TDO ModeBall Fbga 14 x 22 x 1.76 mm Pinout CY7C1474BV25 1M × Pin Definitions Pin Name IO Type Pin Description ADV/LDDqpx TDIFunctional Overview Burst Write Accesses ZZ Mode Electrical CharacteristicsParameter Description Test Conditions Min Max Unit Address Operation Truth TableUsed Partial Write Cycle Description Function CY7C1470BV25Function CY7C1472BV25 Function CY7C1474BV25TAP Controller State Diagram Ieee 1149.1 Serial Boundary Scan JtagTAP Instruction Set TAP Timing Parameter Description Min Max Unit Clock TAP AC Switching CharacteristicsHold Times TAP DC Electrical Characteristics And Operating Conditions 5V TAP AC Test ConditionsGND ≤ VI ≤ Vddq Scan Register Sizes Register Name Bit SizeIdentification Codes Instruction Description Boundary Scan Exit Order 2M x Bit # Ball IDBoundary Scan Exit Order 4M x Boundary Scan Exit Order 1M xBit # Ball ID 10 R1 11 R2 12 R3 13 P2Electrical Characteristics Maximum RatingsOperating Range Range AmbientCapacitance Thermal ResistanceAC Test Loads and Waveforms Parameter Description Test Conditions Tqfp Fbga UnitSwitching Characteristics Setup TimesParameter Description 250 200 167 Unit Min Max Output TimesSwitching Waveforms ADV/LD AddressData A3 A4NOP, Stall and Deselect Cycles Ordering Information 250 Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm ECN No Issue Date Orig. of Change Description of Change Document History