Cypress CY7C1474BV25 Switching Characteristics, Parameter Description 250 200 167 Unit Min Max

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CY7C1470BV25

CY7C1472BV25, CY7C1474BV25

Switching Characteristics

Over the Operating Range. Timing reference is 1.25V when VDDQ = 2.5V. Test conditions shown in (a) of “AC Test Loads and Waveforms” on page 20 unless otherwise noted.

Parameter

 

 

 

 

 

 

 

 

Description

 

–250

 

–200

 

–167

Unit

 

 

 

 

 

 

 

 

Min

 

Max

Min

 

Max

Min

 

Max

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tPower[15]

 

VCC (typical) to the First Access Read or Write

1

 

 

1

 

 

1

 

 

ms

Clock

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCYC

 

Clock Cycle Time

4.0

 

 

5.0

 

 

6.0

 

 

ns

FMAX

 

Maximum Operating Frequency

 

 

250

 

 

200

 

 

167

MHz

tCH

 

Clock HIGH

2.0

 

 

2.0

 

 

2.2

 

 

ns

tCL

 

Clock LOW

2.0

 

 

2.0

 

 

2.2

 

 

ns

Output Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCO

 

Data Output Valid After CLK Rise

 

 

3.0

 

 

3.0

 

 

3.4

ns

tOEV

 

 

 

LOW to Output Valid

 

 

3.0

 

 

3.0

 

 

3.4

ns

OE

 

 

 

tDOH

 

Data Output Hold After CLK Rise

1.3

 

 

1.3

 

 

1.5

 

 

ns

tCHZ

 

Clock to High-Z[16, 17, 18]

 

 

3.0

 

 

3.0

 

 

3.4

ns

tCLZ

 

Clock to Low-Z[16, 17, 18]

1.3

 

 

1.3

 

 

1.5

 

 

ns

tEOHZ

 

 

 

HIGH to Output High-Z[16, 17, 18]

 

 

3.0

 

 

3.0

 

 

3.4

ns

OE

 

 

 

tEOLZ

 

 

 

LOW to Output Low-Z[16, 17, 18]

0

 

 

0

 

 

0

 

 

ns

OE

 

 

 

 

 

 

Setup Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAS

 

Address Setup Before CLK Rise

1.4

 

 

1.4

 

 

1.5

 

 

ns

tDS

 

Data Input Setup Before CLK Rise

1.4

 

 

1.4

 

 

1.5

 

 

ns

tCENS

 

 

 

 

 

 

Setup Before CLK Rise

1.4

 

 

1.4

 

 

1.5

 

 

ns

CEN

 

 

 

 

 

 

tWES

 

 

 

 

 

 

 

x Setup Before CLK Rise

1.4

 

 

1.4

 

 

1.5

 

 

ns

WE,

BW

 

 

 

 

 

 

tALS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADV/LD

Setup Before CLK Rise

1.4

 

 

1.4

 

 

1.5

 

 

ns

tCES

 

Chip Select Setup

1.4

 

 

1.4

 

 

1.5

 

 

ns

Hold Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAH

 

Address Hold After CLK Rise

0.4

 

 

0.4

 

 

0.5

 

 

ns

tDH

 

Data Input Hold After CLK Rise

0.4

 

 

0.4

 

 

0.5

 

 

ns

tCENH

 

 

 

 

Hold After CLK Rise

0.4

 

 

0.4

 

 

0.5

 

 

ns

CEN

 

 

 

 

 

 

tWEH

 

 

 

 

 

 

 

x Hold After CLK Rise

0.4

 

 

0.4

 

 

0.5

 

 

ns

WE,

BW

 

 

 

 

 

 

tALH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADV/LD

Hold after CLK Rise

0.4

 

 

0.4

 

 

0.5

 

 

ns

tCEH

 

Chip Select Hold After CLK Rise

0.4

 

 

0.4

 

 

0.5

 

 

ns

Notes

15.This part has a voltage regulator internally; tpower is the time power is supplied above VDD minimum initially, before a read or write operation can be initiated.

16.tCHZ, tCLZ, tEOLZ, and tEOHZ are specified with AC test conditions shown in (b) of “AC Test Loads and Waveforms” on page 20. Transition is measured ±200 mV from steady-state voltage.

17.At any supplied voltage and temperature, tEOHZ is less than tEOLZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High-Z before Low-Z under the same system conditions.

18.This parameter is sampled and not 100% tested.

Document #: 001-15032 Rev. *D

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Contents Functional Description FeaturesSelection Guide Description 250 MHz 200 MHz 167 MHz UnitLogic Block Diagram CY7C1472BV25 4M x Logic Block Diagram CY7C1470BV25 2M xADV/LD Logic Block Diagram CY7C1474BV25 1M xPin Tqfp Pinout Pin ConfigurationsNC/1G CE2 CLK CENTDI TDO ModeBall Fbga 14 x 22 x 1.76 mm Pinout CY7C1474BV25 1M × ADV/LD Pin Definitions Pin Name IO Type Pin DescriptionDqpx TDIFunctional Overview ZZ Mode Electrical Characteristics Burst Write AccessesParameter Description Test Conditions Min Max Unit Truth Table Address OperationUsed Function CY7C1470BV25 Partial Write Cycle DescriptionFunction CY7C1472BV25 Function CY7C1474BV25Ieee 1149.1 Serial Boundary Scan Jtag TAP Controller State DiagramTAP Instruction Set TAP Timing TAP AC Switching Characteristics Parameter Description Min Max Unit ClockHold Times 5V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating ConditionsGND ≤ VI ≤ Vddq Scan Register Sizes Register Name Bit SizeBoundary Scan Exit Order 2M x Bit # Ball ID Identification Codes Instruction DescriptionBoundary Scan Exit Order 1M x Boundary Scan Exit Order 4M xBit # Ball ID 10 R1 11 R2 12 R3 13 P2Maximum Ratings Electrical CharacteristicsOperating Range Range AmbientThermal Resistance CapacitanceAC Test Loads and Waveforms Parameter Description Test Conditions Tqfp Fbga UnitSetup Times Switching CharacteristicsParameter Description 250 200 167 Unit Min Max Output TimesADV/LD Address Switching WaveformsData A3 A4NOP, Stall and Deselect Cycles Ordering Information 250 Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package DiagramsBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Document History ECN No Issue Date Orig. of Change Description of Change