Cypress CY7C1472BV25, CY7C1474BV25, CY7C1470BV25 manual TAP Instruction Set

Page 13

CY7C1470BV25 CY7C1472BV25, CY7C1474BV25

Instruction Register

Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO balls as shown in the “TAP Controller Block Diagram” on page 12. During power up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the IDCODE instruction if the controller is placed in a reset state as described in the previous section.

When the TAP controller is in the Capture-IR state, the two least significant bits are loaded with a binary ‘01’ pattern to enable fault isolation of the board-level serial test data path.

Bypass Register

To save time when serially shifting data through registers, it is sometimes advantageous to skip certain chips. The bypass register is a single-bit register that can be placed between the TDI and TDO balls. This shifts the data through the SRAM with minimal delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed.

Boundary Scan Register

The boundary scan register is connected to all the input and bidirectional balls on the SRAM.

The boundary scan register is loaded with the contents of the RAM IO ring when the TAP controller is in the Capture-DR state and is then placed between the TDI and TDO balls when the controller is moved to the Shift-DR state. The EXTEST, SAMPLE/PRELOAD and SAMPLE Z instructions can be used to capture the contents of the IO ring.

The Boundary Scan Order tables on page 17 show the order in which the bits are connected. Each bit corresponds to one of the bumps on the SRAM package. The MSB of the register is connected to TDI and the LSB is connected to TDO.

Identification (ID) Register

The ID register is loaded with a vendor-specific, 32-bit code during the Capture-DR state when the IDCODE command is loaded in the instruction register. The IDCODE is hardwired into the SRAM and can be shifted out when the TAP controller is in the Shift-DR state. The ID register has a vendor code and other information described in “Identification Register Definitions” on page 16.

TAP Instruction Set

Overview

Eight different instructions are possible with the three-bit instruction register. All combinations are listed in “Identification Codes” on page 17. Three of these instructions are listed as RESERVED and must not be used. The other five instructions are described in this section in detail.

The TAP controller used in this SRAM is not fully compliant to the 1149.1 convention because some of the mandatory 1149.1 instructions are not fully implemented.

The TAP controller cannot be used to load address data or control signals into the SRAM and cannot preload the IO buffers. The SRAM does not implement the 1149.1 commands EXTEST or INTEST or the PRELOAD portion of SAMPLE/PRELOAD; rather, it performs a capture of the IO ring when these instruc- tions are executed.

Instructions are loaded into the TAP controller during the Shift-IR state when the instruction register is placed between TDI and TDO. During this state, instructions are shifted through the instruction register through the TDI and TDO balls. To execute the instruction after it is shifted in, the TAP controller must be moved into the Update-IR state.

EXTEST

EXTEST is a mandatory 1149.1 instruction which is executed whenever the instruction register is loaded with all 0s. EXTEST is not implemented in this SRAM TAP controller, and therefore this device is not compliant to 1149.1. The TAP controller does recognize an all-0 instruction.

When an EXTEST instruction is loaded into the instruction register, the SRAM responds as if a SAMPLE/PRELOAD instruction has been loaded. There is one difference between the two instructions. Unlike the SAMPLE/PRELOAD instruction, EXTEST places the SRAM outputs in a High-Z state.

IDCODE

The IDCODE instruction loads a vendor-specific, 32-bit code into the instruction register. It also places the instruction register between the TDI and TDO balls and shifts the IDCODE out of the device when the TAP controller enters the Shift-DR state.

The IDCODE instruction is loaded into the instruction register during power up or whenever the TAP controller is in a test logic reset state.

SAMPLE Z

The SAMPLE Z instruction connects the boundary scan register between the TDI and TDO pins when the TAP controller is in a Shift-DR state. It also places all SRAM outputs into a High-Z state.

SAMPLE/PRELOAD

SAMPLE/PRELOAD is a 1149.1 mandatory instruction. The PRELOAD portion of this instruction is not implemented, so the device TAP controller is not fully 1149.1 compliant.

When the SAMPLE/PRELOAD instruction is loaded into the instruction register and the TAP controller is in the Capture-DR state, a snapshot of data on the inputs and bidirectional balls is captured in the boundary scan register.

The user must be aware that the TAP controller clock can only operate at a frequency up to 20 MHz, while the SRAM clock operates more than an order of magnitude faster. Because there is a large difference in the clock frequencies, it is possible that during the Capture-DR state, an input or output may undergo a transition. The TAP may then try to capture a signal while in transition (metastable state). This does not harm the device, but there is no guarantee as to the value that is captured. Repeatable results may not be possible.

To guarantee that the boundary scan register captures the correct value of a signal, the SRAM signal must be stabilized long enough to meet the TAP controller’s capture setup plus hold time (tCS plus tCH).

The SRAM clock input might not be captured correctly if there is no way in a design to stop (or slow) the clock during a SAMPLE/PRELOAD instruction. If this is an issue, it is still

Document #: 001-15032 Rev. *D

Page 13 of 29

[+] Feedback

Image 13
Contents Functional Description FeaturesSelection Guide Description 250 MHz 200 MHz 167 MHz UnitLogic Block Diagram CY7C1472BV25 4M x Logic Block Diagram CY7C1470BV25 2M xADV/LD Logic Block Diagram CY7C1474BV25 1M xPin Tqfp Pinout Pin ConfigurationsNC/1G CE2 CLK CENTDI TDO ModeBall Fbga 14 x 22 x 1.76 mm Pinout CY7C1474BV25 1M × ADV/LD Pin Definitions Pin Name IO Type Pin DescriptionDqpx TDIFunctional Overview Burst Write Accesses ZZ Mode Electrical CharacteristicsParameter Description Test Conditions Min Max Unit Address Operation Truth TableUsed Function CY7C1470BV25 Partial Write Cycle DescriptionFunction CY7C1472BV25 Function CY7C1474BV25Ieee 1149.1 Serial Boundary Scan Jtag TAP Controller State DiagramTAP Instruction Set TAP Timing Parameter Description Min Max Unit Clock TAP AC Switching CharacteristicsHold Times 5V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating ConditionsGND ≤ VI ≤ Vddq Scan Register Sizes Register Name Bit SizeBoundary Scan Exit Order 2M x Bit # Ball ID Identification Codes Instruction DescriptionBoundary Scan Exit Order 1M x Boundary Scan Exit Order 4M xBit # Ball ID 10 R1 11 R2 12 R3 13 P2Maximum Ratings Electrical CharacteristicsOperating Range Range AmbientThermal Resistance CapacitanceAC Test Loads and Waveforms Parameter Description Test Conditions Tqfp Fbga UnitSetup Times Switching CharacteristicsParameter Description 250 200 167 Unit Min Max Output TimesADV/LD Address Switching WaveformsData A3 A4NOP, Stall and Deselect Cycles Ordering Information 250 Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package DiagramsBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Document History ECN No Issue Date Orig. of Change Description of Change