Cypress CY7C1422BV18, CY7C1423BV18, CY7C1429BV18 Power Up Sequence in DDR-II Sram, DLL Constraints

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CY7C1422BV18, CY7C1429BV18 CY7C1423BV18, CY7C1424BV18

Power Up Sequence in DDR-II SRAM

DDR-II SRAMs must be powered up and initialized in a predefined manner to prevent undefined operations.

Power Up Sequence

Apply power and drive DOFF either HIGH or LOW (All other inputs can be HIGH or LOW).

Apply VDD before VDDQ.

Apply VDDQ before VREF or at the same time as VREF.

Drive DOFF HIGH.

DLL Constraints

DLL uses K clock as its synchronizing input. The input must have low phase jitter, which is specified as tKC Var.

The DLL functions at frequencies down to 120 MHz.

If the input clock is unstable and the DLL is enabled, then the DLL may lock onto an incorrect frequency, causing unstable SRAM behavior. To avoid this, provide1024 cycles stable clock to relock to the desired clock frequency.

Provide stable DOFF (HIGH), power and clock (K, K) for 1024 cycles to lock the DLL.

K

K

VDD/ VDDQ

DOFF

Figure 3. Power Up Waveforms

~ ~

 

~ ~

 

Unstable Clock

> 1024 Stable clock

Start Normal

 

 

Operation

Clock Start (Clock Starts after VDD/ V DDQ Stable)

VDD/ V DDQ Stable (< +/- 0.1V DC per 50ns )

Fix High (or tie to VDDQ)

Document #: 001-07035 Rev. *D

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Contents Selection Guide FeaturesConfigurations Functional DescriptionCLK Logic Block Diagram CY7C1422BV18Doff Logic Block Diagram CY7C1424BV18 Logic Block Diagram CY7C1423BV18CY7C1429BV18 4M x Pin ConfigurationBall Fbga 15 x 17 x 1.4 mm Pinout CY7C1422BV18 4M xCY7C1424BV18 1M x CY7C1423BV18 2M xPin Name Pin Description Pin DefinitionsSynchronous Read/Write Input. When TDO for Jtag Power Supply Inputs to the Core of the DevicePower Supply Inputs for the Outputs of the Device Referenced with Respect toFunctional Overview Echo Clocks Application ExampleBWS0/ BWS1 NWS0 NWS1 Truth TableWrite Cycle Descriptions LD R/WBWS0 BWS1 BWS2 BWS3 BWS0Ieee 1149.1 Serial Boundary Scan Jtag Idcode TAP Controller State Diagram TCK TAP Controller Block DiagramTAP Electrical Characteristics TDITAP Timing and Test Conditions TAP AC Switching CharacteristicsRegister Name Bit Size Identification Register DefinitionsScan Register Sizes Instruction CodesBit # Bump ID Boundary Scan OrderPower Up Sequence Power Up Sequence in DDR-II SramDLL Constraints DC Electrical Characteristics Electrical CharacteristicsMaximum Ratings AC Electrical Characteristics Parameter Description Test Conditions Fbga Unit CapacitanceThermal Resistance Parameter Description Test Conditions Max UnitHigh Switching CharacteristicsLOW DLL Timing Static to DLL ResetNOP Read Write Switching WaveformsBurst Ordering Information 250 167 Ball Fbga 15 x 17 x 1.4 mm Package DiagramREV ECN no Submission ORIG. Description of Change Date Sales, Solutions, and Legal InformationWorldwide Sales and Design Support Products PSoC Solutions Document History