Cypress CY7C1424BV18, CY7C1423BV18, CY7C1429BV18, CY7C1422BV18 manual Capacitance, Thermal Resistance

CY7C1422BV18, CY7C1429BV18

CY7C1423BV18, CY7C1424BV18

Capacitance

Tested initially and after any design or process change that may affect these parameters.

Parameter	Description	Test Conditions	Max	Unit
CIN	Input Capacitance	TA = 25°C, f = 1 MHz, VDD = 1.8V, VDDQ = 1.5V	5	pF
CCLK	Clock Input Capacitance		4	pF
CO	Output Capacitance		5	pF

Thermal Resistance

Tested initially and after any design or process change that may affect these parameters.

Parameter	Description		Test Conditions	165 FBGA	Unit
				Package
ΘJA	Thermal Resistance		Test conditions follow standard test methods and	17.2	°C/W
	(Junction to Ambient)		procedures for measuring thermal impedance, in
			accordance with EIA/JESD51.
ΘJC	Thermal Resistance			3.2	°C/W
	(Junction to Case)
		Figure 4. AC Test Loads and Waveforms

VREF = 0.75V

VREF	0.75V
OUTPUT	Z0 = 50Ω
Device
Under
Test

ZQ

RQ =

250Ω

(a)

RL = 50Ω

VREF = 0.75V

VREF		0.75V			R = 50Ω
OUTPUT							ALL INPUT PULSES[20]
						1.25V
Device					5 pF 0.25V			0.75V
Under	ZQ						Slew Rate = 2 V/ns
Test			RQ =
			250Ω
INCLUDING
JIG AND				(b)
SCOPE

Note

20.Unless otherwise noted, test conditions are based on signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250Ω, VDDQ = 1.5V, input pulse levels of 0.25V to 1.25V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of AC Test Loads and Waveforms.

Document #: 001-07035 Rev. *D Page 22 of 30

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