Cypress CY8C22113, CY8C22213 manual Absolute Maximum Ratings, Operating Temperature

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CY8C22x13 Final Data Sheet

3. Electrical Specifications

 

 

3.1Absolute Maximum Ratings

Table 3-2. Absolute Maximum Ratings

Symbol

Description

Min

Typ

Max

Units

Notes

TSTG

Storage Temperature

-55

+100

oC

Higher storage temperatures will reduce data

 

 

 

 

 

 

retention time.

TA

Ambient Temperature with Power Applied

-40

+85

oC

 

Vdd

Supply Voltage on Vdd Relative to Vss

-0.5

+6.0

V

 

 

 

 

 

 

 

 

VIO

DC Input Voltage

Vss - 0.5

Vdd + 0.5

V

 

DC Voltage Applied to Tri-state

Vss - 0.5

Vdd + 0.5

V

 

 

 

 

 

 

 

 

IMIO

Maximum Current into any Port Pin

-25

+50

mA

 

IMAIO

Maximum Current into any Port Pin Configured as Analog

-50

+50

mA

 

 

Driver

 

 

 

 

 

Static Discharge Voltage

2000

V

 

 

 

 

 

 

 

 

Latch-up Current

200

mA

 

 

 

 

 

 

 

 

3.2Operating Temperature

Table 3-3. Operating Temperature

Symbol

Description

Min

Typ

Max

Units

Notes

TA

Ambient Temperature

-40

+85

oC

 

TJ

Junction Temperature

-40

+100

oC

The temperature rise from ambient to junction is

 

 

 

 

 

 

package specific. See “Thermal Impedances”

 

 

 

 

 

 

on page 34. The user must limit the power con-

 

 

 

 

 

 

sumption to comply with this requirement.

 

 

 

 

 

 

 

June 3, 2004

Document No. 38-12009 Rev. *E

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Contents PSoC Core FeaturesPSoC Functional Overview June Cypress MicroSystems, Inc Document No -12009 Rev. *EDigital System CY8C22x13 Final Data Sheet PSoC OverviewDigital System Block Diagram Analog SystemPSoC Device Characteristics PSoC Device CharacteristicsAnalog System Block Diagram Additional System ResourcesPSoC Designer Subsystems June 3 Document No -12009 Rev. *E Getting StartedDevelopment Tools PSoC Development Tool Kit June 3 Document No -12009 Rev. *E PSoC Designer Software SubsystemsHardware Tools Device Editor User Modules and Development Process Flow ChartUser Modules and the PSoC Development Process Application EditorTable of Contents Document Conventions1 8-Pin Part Pinout Pin InformationPinouts 2 20-Pin Part PinoutPin Part Pinout MLF CY8C22x13 Final Data Sheet Pin Information3 32-Pin Part Pinout CY8C22213 PSoC DeviceRegister Mapping Tables Register ReferenceRegister Conventions Abbreviations UsedBlank fields are Reserved and should not be accessed CY8C22x13 Final Data Sheet2. Register ReferenceName Addr 0,Hex Access Register Map Bank 0 Table User SpaceRegister Map Bank 1 Table Configuration Space Name Addr 1,Hex AccessUnits of Measure Electrical SpecificationsSymbol Unit of Measure Vdd VoltageOperating Temperature Operating TemperatureCY8C22x13 Final Data Sheet Electrical Specifications Absolute Maximum RatingsDC General Purpose IO Specifications DC Electrical CharacteristicsDC Chip-Level Specifications DC Chip-Level SpecificationsPsrr OA DC Operational Amplifier SpecificationsV DC Operational Amplifier Specifications Psrroa 3V DC Analog Output Buffer Specifications DC Analog Output Buffer SpecificationsV DC Analog Output Buffer Specifications Psrr OB10 V DC Analog Reference Specifications DC Analog Reference SpecificationsDC Analog PSoC Block Specifications 11 .3V DC Analog Reference SpecificationsDC POR and LVD Specifications 13. DC POR and LVD SpecificationsDC Programming Specifications 14. DC Programming Specifications15. AC Chip-Level Specifications AC Electrical CharacteristicsAC Chip-Level Specifications Tpllslewlow TOSAC General Purpose IO Specifications 16. AC Gpio SpecificationsBW OA AC Operational Amplifier Specifications17 V AC Operational Amplifier Specifications Bwoa Function Description Min Typ Max Units AC Digital Block Specifications19. AC Digital Block Specifications 21 .3V AC Analog Output Buffer Specifications AC Analog Output Buffer Specifications20 V AC Analog Output Buffer Specifications BW OB22 V AC External Clock Specifications AC External Clock SpecificationsAC Programming Specifications 23 .3V AC External Clock SpecificationsStandard Mode Fast Mode Symbol Description Min Max Units AC I2C Specifications25. AC Characteristics of the I2C SDA and SCL Pins TLOWI2C TSUDATI2CPackaging Dimensions Packaging InformationLead 150-Mil Soic Lead 300-Mil Molded DIP June 3 Document No -12009 Rev. *ELead 210-Mil Ssop Thermal Impedances Capacitance on Crystal PinsTypical Package Capacitance on Crystal Pins Thermal Impedances per PackageCY 8 C 22 xxx-SPxx Ordering InformationOrdering Code Definitions RowsRevision History CY8C22x13 Data Sheet Revision HistorySales and Company Information Copyrights