Cypress CY8C22213, CY8C22113 manual DC Electrical Characteristics, DC Chip-Level Specifications

Page 15

CY8C22x13 Final Data Sheet

3. Electrical Specifications

 

 

3.3DC Electrical Characteristics

3.3.1DC Chip-Level Specifications

The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only or unless otherwise specified.

Table 3-4. DC Chip-Level Specifications

Symbol

Description

Min

Typ

Max

Units

Notes

Vdd

Supply Voltage

3.00

5.25

V

 

 

 

 

 

 

 

 

 

 

IDD

Supply Current

5

8

mA

Conditions are Vdd = 5.0V, 25 oC, CPU = 3

 

 

 

 

 

 

 

 

MHz, 48 MHz disabled. VC1 = 1.5 MHz, VC2 =

 

 

 

 

 

 

 

 

93.75 kHz, VC3 = 93.75 kHz.

 

 

 

 

 

 

 

 

 

IDD3

Supply Current

3.3

6.0

mA

Conditions are Vdd = 3.3V, T = 25 oC, CPU = 3

 

 

 

 

 

 

 

 

A

 

 

 

 

 

 

 

 

MHz, 48 MHz = Disabled, VC1 = 1.5 MHz, VC2

 

 

 

 

 

 

 

 

= 93.75 kHz, VC3 = 93.75 kHz.

 

 

 

 

 

 

 

 

 

ISB

Sleep (Mode) Current with POR, LVD, Sleep Timer, and

3

6.5

A

Conditions are with internal slow speed oscilla-

 

 

WDT.a

 

 

 

 

tor, Vdd = 3.3V, -40 oC <= T <= 55 oC.

 

 

 

 

 

 

 

 

A

ISBH

Sleep (Mode) Current with POR, LVD, Sleep Timer, and

4

25

A

Conditions are with internal slow speed oscilla-

 

 

WDT at high temperature.a

 

 

 

 

tor, Vdd = 3.3V, 55 oC < TA <= 85 oC.

ISBXTL

Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT,

4

7.5

A

Conditions are with properly loaded, 1 W max,

 

 

and external crystal.a

 

 

 

 

32.768 kHz crystal. Vdd = 3.3V, -40 oC <= T <=

 

 

 

 

 

 

 

 

A

 

 

 

 

 

 

 

 

55 oC.

ISBXTLH

Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT,

5

26

A

Conditions are with properly loaded, 1 W max,

 

 

and external crystal at high temperature.a

 

 

 

 

32.768 kHz crystal. Vdd = 3.3V, 55 oC < T <=

 

 

 

 

 

 

 

 

A

 

 

 

 

 

 

 

 

85 oC.

VREF

Reference Voltage (Bandgap)

1.275

1.3

1.325

V

Trimmed for appropriate Vdd.

 

 

 

 

 

 

 

 

 

a.Standby current includes all functions (POR, LVD, WDT, Sleep Time) needed for reliable system operation. This should be compared with devices that have similar functions enabled.

3.3.2DC General Purpose IO Specifications

The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only or unless otherwise specified.

Table 3-5. DC GPIO Specifications

Symbol

Description

Min

Typ

Max

Units

Notes

RPU

Pull up Resistor

4

5.6

8

k

 

RPD

Pull down Resistor

4

5.6

8

k

 

VOH

High Output Level

Vdd - 1.0

V

IOH = 10 mA, Vdd = 4.75 to 5.25V (80 mA max-

 

 

 

 

 

 

imum combined IOH budget)

VOL

Low Output Level

0.75

V

IOL = 25 mA, Vdd = 4.75 to 5.25V (150 mA

 

 

 

 

 

 

maximum combined IOL budget)

VIL

Input Low Level

0.8

V

Vdd = 3.0 to 5.25

VIH

Input High Level

2.1

 

V

Vdd = 3.0 to 5.25

VH

Input Hysterisis

60

mV

 

IIL

Input Leakage (Absolute Value)

1

nA

Gross tested to 1 A.

CIN

Capacitive Load on Pins as Input

3.5

10

pF

Package and pin dependent. Temp = 25oC.

COUT

Capacitive Load on Pins as Output

3.5

10

pF

Package and pin dependent. Temp = 25oC.

June 3, 2004

Document No. 38-12009 Rev. *E

15

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Contents June Cypress MicroSystems, Inc Document No -12009 Rev. *E FeaturesPSoC Functional Overview PSoC CoreAnalog System CY8C22x13 Final Data Sheet PSoC OverviewDigital System Block Diagram Digital SystemAdditional System Resources PSoC Device CharacteristicsAnalog System Block Diagram PSoC Device CharacteristicsGetting Started Development ToolsPSoC Designer Subsystems June 3 Document No -12009 Rev. *E PSoC Designer Software Subsystems Hardware ToolsPSoC Development Tool Kit June 3 Document No -12009 Rev. *E Application Editor User Modules and Development Process Flow ChartUser Modules and the PSoC Development Process Device EditorDocument Conventions Table of Contents2 20-Pin Part Pinout Pin InformationPinouts 1 8-Pin Part PinoutCY8C22213 PSoC Device CY8C22x13 Final Data Sheet Pin Information3 32-Pin Part Pinout Pin Part Pinout MLFAbbreviations Used Register ReferenceRegister Conventions Register Mapping TablesRegister Map Bank 0 Table User Space CY8C22x13 Final Data Sheet2. Register ReferenceName Addr 0,Hex Access Blank fields are Reserved and should not be accessedName Addr 1,Hex Access Register Map Bank 1 Table Configuration SpaceVdd Voltage Electrical SpecificationsSymbol Unit of Measure Units of MeasureAbsolute Maximum Ratings Operating TemperatureCY8C22x13 Final Data Sheet Electrical Specifications Operating TemperatureDC Chip-Level Specifications DC Electrical CharacteristicsDC Chip-Level Specifications DC General Purpose IO SpecificationsDC Operational Amplifier Specifications V DC Operational Amplifier SpecificationsPsrr OA Psrroa Psrr OB DC Analog Output Buffer SpecificationsV DC Analog Output Buffer Specifications 3V DC Analog Output Buffer Specifications11 .3V DC Analog Reference Specifications DC Analog Reference SpecificationsDC Analog PSoC Block Specifications 10 V DC Analog Reference Specifications13. DC POR and LVD Specifications DC POR and LVD Specifications14. DC Programming Specifications DC Programming SpecificationsAC Electrical Characteristics AC Chip-Level Specifications15. AC Chip-Level Specifications TOS Tpllslewlow16. AC Gpio Specifications AC General Purpose IO SpecificationsAC Operational Amplifier Specifications 17 V AC Operational Amplifier SpecificationsBW OA Bwoa AC Digital Block Specifications 19. AC Digital Block SpecificationsFunction Description Min Typ Max Units BW OB AC Analog Output Buffer Specifications20 V AC Analog Output Buffer Specifications 21 .3V AC Analog Output Buffer Specifications23 .3V AC External Clock Specifications AC External Clock SpecificationsAC Programming Specifications 22 V AC External Clock SpecificationsTLOWI2C TSUDATI2C AC I2C Specifications25. AC Characteristics of the I2C SDA and SCL Pins Standard Mode Fast Mode Symbol Description Min Max UnitsPackaging Information Packaging DimensionsLead 300-Mil Molded DIP June 3 Document No -12009 Rev. *E Lead 150-Mil SoicLead 210-Mil Ssop Thermal Impedances per Package Capacitance on Crystal PinsTypical Package Capacitance on Crystal Pins Thermal ImpedancesRows Ordering InformationOrdering Code Definitions CY 8 C 22 xxx-SPxxCopyrights CY8C22x13 Data Sheet Revision HistorySales and Company Information Revision History