Cypress CY8C22213, CY8C22113 manual Packaging Information, Packaging Dimensions

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4.Packaging Information

This chapter illustrates the packaging specifications for the CY8C22x13 PSoC device, along with the thermal impedances for each package and the typical package capacitance on crystal pins.

4.1Packaging Dimensions

51-85075 - *A

Figure 4-1. 8-Lead (300-Mil) PDIP

May 2004

© Cypress MicroSystems, Inc. 2003 — Document No. 38-12009 Rev. *E

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Contents June Cypress MicroSystems, Inc Document No -12009 Rev. *E FeaturesPSoC Functional Overview PSoC CoreAnalog System CY8C22x13 Final Data Sheet PSoC OverviewDigital System Block Diagram Digital SystemAdditional System Resources PSoC Device CharacteristicsAnalog System Block Diagram PSoC Device CharacteristicsDevelopment Tools Getting StartedPSoC Designer Subsystems June 3 Document No -12009 Rev. *E Hardware Tools PSoC Designer Software SubsystemsPSoC Development Tool Kit June 3 Document No -12009 Rev. *E Application Editor User Modules and Development Process Flow ChartUser Modules and the PSoC Development Process Device EditorDocument Conventions Table of Contents2 20-Pin Part Pinout Pin InformationPinouts 1 8-Pin Part PinoutCY8C22213 PSoC Device CY8C22x13 Final Data Sheet Pin Information3 32-Pin Part Pinout Pin Part Pinout MLFAbbreviations Used Register ReferenceRegister Conventions Register Mapping TablesRegister Map Bank 0 Table User Space CY8C22x13 Final Data Sheet2. Register ReferenceName Addr 0,Hex Access Blank fields are Reserved and should not be accessedName Addr 1,Hex Access Register Map Bank 1 Table Configuration SpaceVdd Voltage Electrical SpecificationsSymbol Unit of Measure Units of MeasureAbsolute Maximum Ratings Operating TemperatureCY8C22x13 Final Data Sheet Electrical Specifications Operating TemperatureDC Chip-Level Specifications DC Electrical CharacteristicsDC Chip-Level Specifications DC General Purpose IO SpecificationsV DC Operational Amplifier Specifications DC Operational Amplifier SpecificationsPsrr OA Psrroa Psrr OB DC Analog Output Buffer SpecificationsV DC Analog Output Buffer Specifications 3V DC Analog Output Buffer Specifications11 .3V DC Analog Reference Specifications DC Analog Reference SpecificationsDC Analog PSoC Block Specifications 10 V DC Analog Reference Specifications13. DC POR and LVD Specifications DC POR and LVD Specifications14. DC Programming Specifications DC Programming SpecificationsAC Chip-Level Specifications AC Electrical Characteristics15. AC Chip-Level Specifications TOS Tpllslewlow16. AC Gpio Specifications AC General Purpose IO Specifications17 V AC Operational Amplifier Specifications AC Operational Amplifier SpecificationsBW OA Bwoa 19. AC Digital Block Specifications AC Digital Block SpecificationsFunction Description Min Typ Max Units BW OB AC Analog Output Buffer Specifications20 V AC Analog Output Buffer Specifications 21 .3V AC Analog Output Buffer Specifications23 .3V AC External Clock Specifications AC External Clock SpecificationsAC Programming Specifications 22 V AC External Clock SpecificationsTLOWI2C TSUDATI2C AC I2C Specifications25. AC Characteristics of the I2C SDA and SCL Pins Standard Mode Fast Mode Symbol Description Min Max UnitsPackaging Information Packaging DimensionsLead 300-Mil Molded DIP June 3 Document No -12009 Rev. *E Lead 150-Mil SoicLead 210-Mil Ssop Thermal Impedances per Package Capacitance on Crystal PinsTypical Package Capacitance on Crystal Pins Thermal ImpedancesRows Ordering InformationOrdering Code Definitions CY 8 C 22 xxx-SPxxCopyrights CY8C22x13 Data Sheet Revision HistorySales and Company Information Revision History
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