Cypress CY8C22213, CY8C22113 manual Additional System Resources, PSoC Device Characteristics

Page 3

CY8C22x13 Final Data Sheet

PSoC™ Overview

 

 

Analog blocks are provided in columns of three, which includes one CT (Continuous Time) and two SC (Switched Capacitor) blocks. The number of blocks is dependant on the device family which is detailed in the table titled “PSoC Device Characteris- tics” on page 3.

P0[7]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P0[6]

P0[5]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P0[4]

P0[3]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P0[2]

P0[1]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P0[0]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Array Input Configuration

ACI0[1:0]

ACI1[1:0]

Block Array

 

 

ACB01

 

ASD11

 

ASC21

Analog Reference

Interface to

RefHi

Reference

AGNDIn

Digital System

Generators

RefLo

RefIn

 

AGND

 

Bandgap

M8C Interface (Address Bus, Data Bus, Etc.)

Analog System Block Diagram

Additional System Resources

System Resources, some of which have been previously listed, provide additional capability useful to complete systems. Addi- tional resources include a decimator, low voltage detection, and power on reset. Brief statements describing the merits of each system resource are presented below.

Digital clock dividers provide three customizable clock fre- quencies for use in applications. The clocks can be routed to both the digital and analog systems. Additional clocks can be generated using digital PSoC blocks as clock dividers.

The decimator provides a custom hardware filter for digital signal processing applications including the creation of Delta Sigma ADCs.

The I2C module provides 100 and 400 kHz communication over two wires. Slave, master, and multi-master modes are all supported.

Low Voltage Detection (LVD) interrupts can signal the appli- cation of falling voltage levels, while the advanced POR (Power On Reset) circuit eliminates the need for a system supervisor.

An internal 1.3 voltage reference provides an absolute refer- ence for the analog system, including ADCs and DACs.

PSoC Device Characteristics

Depending on your PSoC device characteristics, the digital and analog systems can have 16, 8, or 4 digital blocks and 12, 6, or 3 analog blocks. The following table lists the resources available for specific PSoC device groups.

PSoC Device Characteristics

PSoC Part

Digital IO

Digital Rows

Digital Blocks

Analog Inputs

Analog Outputs

Analog Columns

Analog Blocks

Number

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY8C29x66

up to

4

16

12

4

4

12

64

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY8C27x66

up to

2

8

12

4

4

12

44

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY8C27x43

up to

2

8

12

4

4

12

44

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY8C24x23

up to

1

4

12

2

2

6

24

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY8C22x13

up to

1

4

8

1

1

3

16

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

June 3, 2004

Document No. 38-12009 Rev. *E

3

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Contents June Cypress MicroSystems, Inc Document No -12009 Rev. *E FeaturesPSoC Functional Overview PSoC CoreAnalog System CY8C22x13 Final Data Sheet PSoC OverviewDigital System Block Diagram Digital SystemAdditional System Resources PSoC Device CharacteristicsAnalog System Block Diagram PSoC Device CharacteristicsGetting Started Development ToolsPSoC Designer Subsystems June 3 Document No -12009 Rev. *E PSoC Designer Software Subsystems Hardware ToolsPSoC Development Tool Kit June 3 Document No -12009 Rev. *E Application Editor User Modules and Development Process Flow ChartUser Modules and the PSoC Development Process Device EditorDocument Conventions Table of Contents2 20-Pin Part Pinout Pin InformationPinouts 1 8-Pin Part PinoutCY8C22213 PSoC Device CY8C22x13 Final Data Sheet Pin Information3 32-Pin Part Pinout Pin Part Pinout MLFAbbreviations Used Register ReferenceRegister Conventions Register Mapping TablesRegister Map Bank 0 Table User Space CY8C22x13 Final Data Sheet2. Register ReferenceName Addr 0,Hex Access Blank fields are Reserved and should not be accessedName Addr 1,Hex Access Register Map Bank 1 Table Configuration SpaceVdd Voltage Electrical SpecificationsSymbol Unit of Measure Units of MeasureAbsolute Maximum Ratings Operating TemperatureCY8C22x13 Final Data Sheet Electrical Specifications Operating TemperatureDC Chip-Level Specifications DC Electrical CharacteristicsDC Chip-Level Specifications DC General Purpose IO SpecificationsDC Operational Amplifier Specifications V DC Operational Amplifier SpecificationsPsrr OA Psrroa Psrr OB DC Analog Output Buffer SpecificationsV DC Analog Output Buffer Specifications 3V DC Analog Output Buffer Specifications11 .3V DC Analog Reference Specifications DC Analog Reference SpecificationsDC Analog PSoC Block Specifications 10 V DC Analog Reference Specifications13. DC POR and LVD Specifications DC POR and LVD Specifications14. DC Programming Specifications DC Programming SpecificationsAC Electrical Characteristics AC Chip-Level Specifications15. AC Chip-Level Specifications TOS Tpllslewlow16. AC Gpio Specifications AC General Purpose IO SpecificationsAC Operational Amplifier Specifications 17 V AC Operational Amplifier SpecificationsBW OA Bwoa AC Digital Block Specifications 19. AC Digital Block SpecificationsFunction Description Min Typ Max Units BW OB AC Analog Output Buffer Specifications20 V AC Analog Output Buffer Specifications 21 .3V AC Analog Output Buffer Specifications23 .3V AC External Clock Specifications AC External Clock SpecificationsAC Programming Specifications 22 V AC External Clock SpecificationsTLOWI2C TSUDATI2C AC I2C Specifications25. AC Characteristics of the I2C SDA and SCL Pins Standard Mode Fast Mode Symbol Description Min Max UnitsPackaging Information Packaging DimensionsLead 300-Mil Molded DIP June 3 Document No -12009 Rev. *E Lead 150-Mil SoicLead 210-Mil Ssop Thermal Impedances per Package Capacitance on Crystal PinsTypical Package Capacitance on Crystal Pins Thermal ImpedancesRows Ordering InformationOrdering Code Definitions CY 8 C 22 xxx-SPxxCopyrights CY8C22x13 Data Sheet Revision HistorySales and Company Information Revision History