Cypress CY8C22213, CY8C22113 manual AC External Clock Specifications, AC Programming Specifications

Page 29

CY8C22x13 Final Data Sheet

3. Electrical Specifications

 

 

3.4.6AC External Clock Specifications

The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only or unless otherwise specified.

Table 3-22. 5V AC External Clock Specifications

Symbol

Description

Min

 

Typ

Max

Units

Notes

FOSCEXT

Frequency

0

 

24.24

MHz

 

High Period

20.6

 

ns

 

 

 

 

 

 

 

 

 

Low Period

20.6

 

ns

 

 

 

 

 

 

 

 

 

Power Up IMO to Switch

150

 

s

 

 

 

 

 

 

 

 

 

Table 3-23. 3.3V AC External Clock Specifications

 

Symbol

Description

Min

 

Typ

Max

Units

Notes

FOSCEXT

Frequency with CPU Clock divide by 1a

0

 

12.12

MHz

 

FOSCEXT

Frequency with CPU Clock divide by 2 or greaterb

0

 

24.24

MHz

 

High Period with CPU Clock divide by 1

41.7

 

ns

 

 

 

 

 

 

 

 

 

 

 

Low Period with CPU Clock divide by 1

41.7

 

ns

 

 

 

 

 

 

 

 

 

 

 

Power Up IMO to Switch

150

 

s

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

a.Maximum CPU frequency is 12 MHz at 3.3V. With the CPU clock divider set to 1, the external clock must adhere to the maximum frequency and duty cycle requirements.

b.If the frequency of the external clock is greater than 12 MHz, the CPU clock divider must be set to 2 or greater. In this case, the CPU clock divider will ensure that the fifty per- cent duty cycle requirement is met.

3.4.7AC Programming Specifications

The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only or unless otherwise specified.

Table 3-24. AC Programming Specifications

Symbol

Description

Min

Typ

Max

Units

Notes

TRSCLK

Rise Time of SCLK

1

20

ns

 

TFSCLK

Fall Time of SCLK

1

20

ns

 

TSSCLK

Data Set up Time to Falling Edge of SCLK

40

ns

 

THSCLK

Data Hold Time from Falling Edge of SCLK

40

ns

 

FSCLK

Frequency of SCLK

0

8

MHz

 

TERASEB

Flash Erase Time (Block)

15

ms

 

TWRITE

Flash Block Write Time

30

ms

 

TDSCLK

Data Out Delay from Falling Edge of SCLK

45

ns

 

June 3, 2004

Document No. 38-12009 Rev. *E

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Contents PSoC Functional Overview FeaturesPSoC Core June Cypress MicroSystems, Inc Document No -12009 Rev. *EDigital System Block Diagram CY8C22x13 Final Data Sheet PSoC OverviewDigital System Analog SystemAnalog System Block Diagram PSoC Device CharacteristicsPSoC Device Characteristics Additional System ResourcesPSoC Designer Subsystems June 3 Document No -12009 Rev. *E Getting StartedDevelopment Tools PSoC Development Tool Kit June 3 Document No -12009 Rev. *E PSoC Designer Software SubsystemsHardware Tools User Modules and the PSoC Development Process User Modules and Development Process Flow ChartDevice Editor Application EditorDocument Conventions Table of ContentsPinouts Pin Information1 8-Pin Part Pinout 2 20-Pin Part Pinout3 32-Pin Part Pinout CY8C22x13 Final Data Sheet Pin InformationPin Part Pinout MLF CY8C22213 PSoC DeviceRegister Conventions Register ReferenceRegister Mapping Tables Abbreviations UsedName Addr 0,Hex Access CY8C22x13 Final Data Sheet2. Register ReferenceBlank fields are Reserved and should not be accessed Register Map Bank 0 Table User SpaceName Addr 1,Hex Access Register Map Bank 1 Table Configuration SpaceSymbol Unit of Measure Electrical SpecificationsUnits of Measure Vdd VoltageCY8C22x13 Final Data Sheet Electrical Specifications Operating TemperatureOperating Temperature Absolute Maximum RatingsDC Chip-Level Specifications DC Electrical CharacteristicsDC General Purpose IO Specifications DC Chip-Level SpecificationsPsrr OA DC Operational Amplifier SpecificationsV DC Operational Amplifier Specifications Psrroa V DC Analog Output Buffer Specifications DC Analog Output Buffer Specifications3V DC Analog Output Buffer Specifications Psrr OBDC Analog PSoC Block Specifications DC Analog Reference Specifications10 V DC Analog Reference Specifications 11 .3V DC Analog Reference Specifications13. DC POR and LVD Specifications DC POR and LVD Specifications14. DC Programming Specifications DC Programming Specifications15. AC Chip-Level Specifications AC Electrical CharacteristicsAC Chip-Level Specifications TOS Tpllslewlow16. AC Gpio Specifications AC General Purpose IO SpecificationsBW OA AC Operational Amplifier Specifications17 V AC Operational Amplifier Specifications Bwoa Function Description Min Typ Max Units AC Digital Block Specifications19. AC Digital Block Specifications 20 V AC Analog Output Buffer Specifications AC Analog Output Buffer Specifications21 .3V AC Analog Output Buffer Specifications BW OBAC Programming Specifications AC External Clock Specifications22 V AC External Clock Specifications 23 .3V AC External Clock Specifications25. AC Characteristics of the I2C SDA and SCL Pins AC I2C SpecificationsStandard Mode Fast Mode Symbol Description Min Max Units TLOWI2C TSUDATI2CPackaging Information Packaging DimensionsLead 300-Mil Molded DIP June 3 Document No -12009 Rev. *E Lead 150-Mil SoicLead 210-Mil Ssop Typical Package Capacitance on Crystal Pins Capacitance on Crystal PinsThermal Impedances Thermal Impedances per PackageOrdering Code Definitions Ordering InformationCY 8 C 22 xxx-SPxx RowsSales and Company Information CY8C22x13 Data Sheet Revision HistoryRevision History Copyrights