Cypress CY8C22213 manual Ordering Information, Ordering Code Definitions, CY 8 C 22 xxx-SPxx, Rows

Page 35

5.Ordering Information

The following table lists the CY8C22x13 PSoC Device family’s key package features and ordering codes.

Table 5-1. CY8C22x13 PSoC Device Family Key Features and Ordering Information

 

 

Package

Ordering Code

Flash (Kbytes)

RAM (Bytes)

Switch Mode Pump

Temperature Range

Digital Blocks

(Rows of 4)

Analog Blocks

(Columns of 3)

Digital IO Pins

Analog Inputs

Analog Outputs

XRES Pin

 

 

 

 

 

 

 

 

 

 

 

 

 

 

8 Pin (300 Mil) DIP

CY8C22113-24PI

2

256

No

-40C to +85C

 

4

 

3

6

4

1

No

 

 

 

 

 

 

 

 

 

 

 

 

 

 

8 Pin (150 Mil) SOIC

CY8C22113-24SI

2

256

No

-40C to +85C

 

4

 

3

6

4

1

No

 

 

 

 

 

 

 

 

 

 

 

 

 

 

8 Pin (150 Mil) SOIC

CY8C22113-24SIT

2

256

No

-40C to +85C

 

4

 

3

6

4

1

No

(Tape and Reel)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20

Pin (300 Mil) DIP

CY8C22213-24PI

2

256

No

-40C to +85C

 

4

 

3

16

8

1

Yes

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20 Pin (210

Mil) SSOP

CY8C22213-24PVI

2

256

No

-40C to +85C

 

4

 

3

16

8

1

Yes

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20

Pin (210

Mil) SSOP

CY8C22213-24PVIT

2

256

No

-40C to +85C

 

4

 

3

16

8

1

Yes

(Tape and Reel)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20

Pin (300

Mil) SOIC

CY8C22213-24SI

2

256

No

-40C to +85C

 

4

 

3

16

8

1

Yes

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20

Pin (300

Mil) SOIC

CY8C22213-24SIT

2

256

No

-40C to +85C

 

4

 

3

16

8

1

Yes

(Tape and Reel)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

32 Pin (5x5 mm) MLF

CY8C22213-24LFI

2

256

No

-40C to +85C

 

4

 

3

16

8

1

Yes

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5.1Ordering Code Definitions

CY 8 C 22 xxx-SPxx

Package Type:

Thermal Rating:

P = PDIP

C = Commercial

S = SOIC

I = Industrial

PV = SSOP

E = Extended

LF = MLF

 

A = TQFP

 

Speed: 24 MHz

 

Part Number

 

Family Code

 

Technology Code: C = CMOS

Marketing Code: 8 = Cypress MicroSystems

Company ID: CY = Cypress

June 3, 2004

Document No. 38-12009 Rev. *E

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Contents June Cypress MicroSystems, Inc Document No -12009 Rev. *E FeaturesPSoC Functional Overview PSoC CoreAnalog System CY8C22x13 Final Data Sheet PSoC OverviewDigital System Block Diagram Digital SystemAdditional System Resources PSoC Device CharacteristicsAnalog System Block Diagram PSoC Device CharacteristicsPSoC Designer Subsystems June 3 Document No -12009 Rev. *E Getting StartedDevelopment Tools PSoC Development Tool Kit June 3 Document No -12009 Rev. *E PSoC Designer Software SubsystemsHardware Tools Application Editor User Modules and Development Process Flow ChartUser Modules and the PSoC Development Process Device EditorDocument Conventions Table of Contents2 20-Pin Part Pinout Pin InformationPinouts 1 8-Pin Part PinoutCY8C22213 PSoC Device CY8C22x13 Final Data Sheet Pin Information3 32-Pin Part Pinout Pin Part Pinout MLFAbbreviations Used Register ReferenceRegister Conventions Register Mapping TablesRegister Map Bank 0 Table User Space CY8C22x13 Final Data Sheet2. Register ReferenceName Addr 0,Hex Access Blank fields are Reserved and should not be accessedName Addr 1,Hex Access Register Map Bank 1 Table Configuration SpaceVdd Voltage Electrical SpecificationsSymbol Unit of Measure Units of MeasureAbsolute Maximum Ratings Operating TemperatureCY8C22x13 Final Data Sheet Electrical Specifications Operating TemperatureDC Chip-Level Specifications DC Electrical CharacteristicsDC Chip-Level Specifications DC General Purpose IO SpecificationsPsrr OA DC Operational Amplifier SpecificationsV DC Operational Amplifier Specifications Psrroa Psrr OB DC Analog Output Buffer SpecificationsV DC Analog Output Buffer Specifications 3V DC Analog Output Buffer Specifications11 .3V DC Analog Reference Specifications DC Analog Reference SpecificationsDC Analog PSoC Block Specifications 10 V DC Analog Reference Specifications13. DC POR and LVD Specifications DC POR and LVD Specifications14. DC Programming Specifications DC Programming Specifications15. AC Chip-Level Specifications AC Electrical CharacteristicsAC Chip-Level Specifications TOS Tpllslewlow16. AC Gpio Specifications AC General Purpose IO SpecificationsBW OA AC Operational Amplifier Specifications17 V AC Operational Amplifier Specifications Bwoa Function Description Min Typ Max Units AC Digital Block Specifications19. AC Digital Block Specifications BW OB AC Analog Output Buffer Specifications20 V AC Analog Output Buffer Specifications 21 .3V AC Analog Output Buffer Specifications23 .3V AC External Clock Specifications AC External Clock SpecificationsAC Programming Specifications 22 V AC External Clock SpecificationsTLOWI2C TSUDATI2C AC I2C Specifications25. AC Characteristics of the I2C SDA and SCL Pins Standard Mode Fast Mode Symbol Description Min Max UnitsPackaging Information Packaging DimensionsLead 300-Mil Molded DIP June 3 Document No -12009 Rev. *E Lead 150-Mil SoicLead 210-Mil Ssop Thermal Impedances per Package Capacitance on Crystal PinsTypical Package Capacitance on Crystal Pins Thermal ImpedancesRows Ordering InformationOrdering Code Definitions CY 8 C 22 xxx-SPxxCopyrights CY8C22x13 Data Sheet Revision HistorySales and Company Information Revision History
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