Cypress CY8C22213, CY8C22113 manual DC Programming Specifications

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CY8C22x13 Final Data Sheet

3. Electrical Specifications

 

 

3.3.8DC Programming Specifications

The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only or unless otherwise specified.

Table 3-14. DC Programming Specifications

 

Symbol

Description

Min

 

Typ

Max

Units

Notes

IDDP

Supply Current During Programming or Verify

–

5

 

25

mA

 

VILP

Input Low Voltage During Programming or Verify

–

–

 

0.8

V

 

VIHP

Input High Voltage During Programming or Verify

2.2

–

 

–

V

 

IILP

Input Current when Applying Vilp to P1[0] or P1[1] During

–

–

 

0.2

mA

Driving internal pull-down resistor.

 

 

Programming or Verify

 

 

 

 

 

 

IIHP

Input Current when Applying Vihp to P1[0] or P1[1] During

–

–

 

1.5

mA

Driving internal pull-down resistor.

 

 

Programming or Verify

 

 

 

 

 

 

VOLV

Output Low Voltage During Programming or Verify

–

–

 

Vss + 0.75

V

 

VOHV

Output High Voltage During Programming or Verify

Vdd - 1.0

–

 

Vdd

V

 

FlashENPB

Flash Endurance (per block)

50,000

–

 

–

–

Erase/write cycles per block.

FlashENT

Flash Endurance (total)a

1,800,000

–

 

–

–

Erase/write cycles.

FlashDR

Flash Data Retention

10

–

 

–

Years

 

 

 

 

 

 

 

 

 

 

 

a.A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each, 36x2 blocks of 25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (and so forth to limit the total number of cycles to 36x50,000 and that no single block ever sees more than 50,000 cycles).

For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing. Refer to the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.

June 3, 2004

Document No. 38-12009 Rev. *E

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Contents PSoC Functional Overview FeaturesPSoC Core June Cypress MicroSystems, Inc Document No -12009 Rev. *EDigital System Block Diagram CY8C22x13 Final Data Sheet PSoC OverviewDigital System Analog SystemAnalog System Block Diagram PSoC Device CharacteristicsPSoC Device Characteristics Additional System ResourcesGetting Started Development ToolsPSoC Designer Subsystems June 3 Document No -12009 Rev. *E PSoC Designer Software Subsystems Hardware ToolsPSoC Development Tool Kit June 3 Document No -12009 Rev. *E User Modules and the PSoC Development Process User Modules and Development Process Flow ChartDevice Editor Application EditorDocument Conventions Table of ContentsPinouts Pin Information1 8-Pin Part Pinout 2 20-Pin Part Pinout3 32-Pin Part Pinout CY8C22x13 Final Data Sheet Pin InformationPin Part Pinout MLF CY8C22213 PSoC DeviceRegister Conventions Register ReferenceRegister Mapping Tables Abbreviations UsedName Addr 0,Hex Access CY8C22x13 Final Data Sheet2. Register ReferenceBlank fields are Reserved and should not be accessed Register Map Bank 0 Table User SpaceName Addr 1,Hex Access Register Map Bank 1 Table Configuration SpaceSymbol Unit of Measure Electrical SpecificationsUnits of Measure Vdd VoltageCY8C22x13 Final Data Sheet Electrical Specifications Operating TemperatureOperating Temperature Absolute Maximum RatingsDC Chip-Level Specifications DC Electrical CharacteristicsDC General Purpose IO Specifications DC Chip-Level SpecificationsDC Operational Amplifier Specifications V DC Operational Amplifier SpecificationsPsrr OA Psrroa V DC Analog Output Buffer Specifications DC Analog Output Buffer Specifications3V DC Analog Output Buffer Specifications Psrr OBDC Analog PSoC Block Specifications DC Analog Reference Specifications10 V DC Analog Reference Specifications 11 .3V DC Analog Reference Specifications13. DC POR and LVD Specifications DC POR and LVD Specifications14. DC Programming Specifications DC Programming SpecificationsAC Electrical Characteristics AC Chip-Level Specifications15. AC Chip-Level Specifications TOS Tpllslewlow16. AC Gpio Specifications AC General Purpose IO SpecificationsAC Operational Amplifier Specifications 17 V AC Operational Amplifier SpecificationsBW OA Bwoa AC Digital Block Specifications 19. AC Digital Block SpecificationsFunction Description Min Typ Max Units 20 V AC Analog Output Buffer Specifications AC Analog Output Buffer Specifications21 .3V AC Analog Output Buffer Specifications BW OBAC Programming Specifications AC External Clock Specifications22 V AC External Clock Specifications 23 .3V AC External Clock Specifications25. AC Characteristics of the I2C SDA and SCL Pins AC I2C SpecificationsStandard Mode Fast Mode Symbol Description Min Max Units TLOWI2C TSUDATI2CPackaging Information Packaging DimensionsLead 300-Mil Molded DIP June 3 Document No -12009 Rev. *E Lead 150-Mil SoicLead 210-Mil Ssop Typical Package Capacitance on Crystal Pins Capacitance on Crystal PinsThermal Impedances Thermal Impedances per PackageOrdering Code Definitions Ordering InformationCY 8 C 22 xxx-SPxx RowsSales and Company Information CY8C22x13 Data Sheet Revision HistoryRevision History Copyrights
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