Cypress CY8C22113 manual AC I2C Specifications, AC Characteristics of the I2C SDA and SCL Pins

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CY8C22x13 Final Data Sheet

3. Electrical Specifications

 

 

3.4.8AC I2C Specifications

The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only or unless otherwise specified.

Table 3-25. AC Characteristics of the I2C SDA and SCL Pins

 

 

 

 

Standard Mode

Fast Mode

 

 

 

Symbol

Description

Min

Max

Min

Max

Units

Notes

FSCLI2C

SCL Clock Frequency

0

100

0

400

kHz

 

THDSTAI2C

Hold Time (repeated) START Condition. After this

4.0

0.6

s

 

 

 

period, the first clock pulse is generated.

 

 

 

 

 

 

TLOWI2C

LOW Period of the SCL Clock

4.7

1.3

s

 

THIGHI2C

HIGH Period of the SCL Clock

4.0

0.6

s

 

TSUSTAI2C

Set-up Time for a Repeated START Condition

4.7

0.6

s

 

THDDATI2C

Data Hold Time

0

0

s

 

TSUDATI2C

Data Set-up Time

250

100a

ns

 

TSUSTOI2C

Set-up Time for STOP Condition

4.0

0.6

s

 

TBUFI2C

Bus Free Time Between a STOP and START Condition

4.7

1.3

s

 

TSPI2C

Pulse Width of spikes are suppressed by the input fil-

0

50

ns

 

 

 

ter.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

a.A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.

SDA

TLOWI2C

 

 

 

TSUDATI2C

 

 

 

 

SCL

 

 

 

S

THDSTAI2C THDDATI2C

THIGHI2C

TSUSTAI2C

THDSTAI2C

Sr

TSPI2C

TSUSTOI2C

TBUFI2C

P S

Figure 3-8. Definition for Timing for Fast/Standard Mode on the I2C Bus

June 3, 2004

Document No. 38-12009 Rev. *E

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Contents PSoC Core FeaturesPSoC Functional Overview June Cypress MicroSystems, Inc Document No -12009 Rev. *EDigital System CY8C22x13 Final Data Sheet PSoC OverviewDigital System Block Diagram Analog SystemPSoC Device Characteristics PSoC Device CharacteristicsAnalog System Block Diagram Additional System ResourcesGetting Started Development ToolsPSoC Designer Subsystems June 3 Document No -12009 Rev. *E PSoC Designer Software Subsystems Hardware ToolsPSoC Development Tool Kit June 3 Document No -12009 Rev. *E Device Editor User Modules and Development Process Flow ChartUser Modules and the PSoC Development Process Application EditorTable of Contents Document Conventions1 8-Pin Part Pinout Pin InformationPinouts 2 20-Pin Part PinoutPin Part Pinout MLF CY8C22x13 Final Data Sheet Pin Information3 32-Pin Part Pinout CY8C22213 PSoC DeviceRegister Mapping Tables Register ReferenceRegister Conventions Abbreviations UsedBlank fields are Reserved and should not be accessed CY8C22x13 Final Data Sheet2. Register ReferenceName Addr 0,Hex Access Register Map Bank 0 Table User SpaceRegister Map Bank 1 Table Configuration Space Name Addr 1,Hex AccessUnits of Measure Electrical SpecificationsSymbol Unit of Measure Vdd VoltageOperating Temperature Operating TemperatureCY8C22x13 Final Data Sheet Electrical Specifications Absolute Maximum RatingsDC General Purpose IO Specifications DC Electrical CharacteristicsDC Chip-Level Specifications DC Chip-Level SpecificationsDC Operational Amplifier Specifications V DC Operational Amplifier SpecificationsPsrr OA Psrroa 3V DC Analog Output Buffer Specifications DC Analog Output Buffer SpecificationsV DC Analog Output Buffer Specifications Psrr OB10 V DC Analog Reference Specifications DC Analog Reference SpecificationsDC Analog PSoC Block Specifications 11 .3V DC Analog Reference SpecificationsDC POR and LVD Specifications 13. DC POR and LVD SpecificationsDC Programming Specifications 14. DC Programming SpecificationsAC Electrical Characteristics AC Chip-Level Specifications15. AC Chip-Level Specifications Tpllslewlow TOSAC General Purpose IO Specifications 16. AC Gpio SpecificationsAC Operational Amplifier Specifications 17 V AC Operational Amplifier SpecificationsBW OA Bwoa AC Digital Block Specifications 19. AC Digital Block SpecificationsFunction Description Min Typ Max Units 21 .3V AC Analog Output Buffer Specifications AC Analog Output Buffer Specifications20 V AC Analog Output Buffer Specifications BW OB22 V AC External Clock Specifications AC External Clock SpecificationsAC Programming Specifications 23 .3V AC External Clock SpecificationsStandard Mode Fast Mode Symbol Description Min Max Units AC I2C Specifications25. AC Characteristics of the I2C SDA and SCL Pins TLOWI2C TSUDATI2CPackaging Dimensions Packaging InformationLead 150-Mil Soic Lead 300-Mil Molded DIP June 3 Document No -12009 Rev. *ELead 210-Mil Ssop Thermal Impedances Capacitance on Crystal PinsTypical Package Capacitance on Crystal Pins Thermal Impedances per PackageCY 8 C 22 xxx-SPxx Ordering InformationOrdering Code Definitions RowsRevision History CY8C22x13 Data Sheet Revision HistorySales and Company Information Copyrights