Cypress CY8C22113, CY8C22213 manual Capacitance on Crystal Pins, Thermal Impedances per Package

Page 34

CY8C22x13 Final Data Sheet

4. Packaging Information

X = 138 MIL

Y = 138 MIL

32

51-85188 - **

Figure 4-6. 32-Lead (5x5 mm) MLF

4.2Thermal Impedances

Table 4-1. Thermal Impedances per Package

Package

Typical θJA *

8 PDIP

123 oC/W

8 SOIC

185 oC/W

20 PDIP

109 oC/W

20 SSOP

117 oC/W

20 SOIC

81 oC/W

32 MLF

22 oC/W

* TJ = TA + POWER x θJA

 

4.3Capacitance on Crystal Pins

Table 4-2: Typical Package Capacitance on Crystal Pins

Package

Package Capacitance

 

 

8 PDIP

2.8 pF

 

 

8 SOIC

2.0 pF

 

 

20 PDIP

3.0 pF

 

 

20 SSOP

2.6 pF

 

 

20 SOIC

2.5 pF

 

 

32 MLF

2.0 pF

 

 

June 3, 2004

Document No. 38-12009 Rev. *E

34

[+] Feedback

Image 34
Contents PSoC Core FeaturesPSoC Functional Overview June Cypress MicroSystems, Inc Document No -12009 Rev. *EDigital System CY8C22x13 Final Data Sheet PSoC OverviewDigital System Block Diagram Analog SystemPSoC Device Characteristics PSoC Device CharacteristicsAnalog System Block Diagram Additional System ResourcesDevelopment Tools Getting StartedPSoC Designer Subsystems June 3 Document No -12009 Rev. *E Hardware Tools PSoC Designer Software SubsystemsPSoC Development Tool Kit June 3 Document No -12009 Rev. *E Device Editor User Modules and Development Process Flow ChartUser Modules and the PSoC Development Process Application EditorTable of Contents Document Conventions1 8-Pin Part Pinout Pin InformationPinouts 2 20-Pin Part PinoutPin Part Pinout MLF CY8C22x13 Final Data Sheet Pin Information3 32-Pin Part Pinout CY8C22213 PSoC DeviceRegister Mapping Tables Register ReferenceRegister Conventions Abbreviations UsedBlank fields are Reserved and should not be accessed CY8C22x13 Final Data Sheet2. Register ReferenceName Addr 0,Hex Access Register Map Bank 0 Table User SpaceRegister Map Bank 1 Table Configuration Space Name Addr 1,Hex AccessUnits of Measure Electrical SpecificationsSymbol Unit of Measure Vdd VoltageOperating Temperature Operating TemperatureCY8C22x13 Final Data Sheet Electrical Specifications Absolute Maximum RatingsDC General Purpose IO Specifications DC Electrical CharacteristicsDC Chip-Level Specifications DC Chip-Level SpecificationsV DC Operational Amplifier Specifications DC Operational Amplifier SpecificationsPsrr OA Psrroa 3V DC Analog Output Buffer Specifications DC Analog Output Buffer SpecificationsV DC Analog Output Buffer Specifications Psrr OB10 V DC Analog Reference Specifications DC Analog Reference SpecificationsDC Analog PSoC Block Specifications 11 .3V DC Analog Reference SpecificationsDC POR and LVD Specifications 13. DC POR and LVD SpecificationsDC Programming Specifications 14. DC Programming SpecificationsAC Chip-Level Specifications AC Electrical Characteristics15. AC Chip-Level Specifications Tpllslewlow TOSAC General Purpose IO Specifications 16. AC Gpio Specifications17 V AC Operational Amplifier Specifications AC Operational Amplifier SpecificationsBW OA Bwoa 19. AC Digital Block Specifications AC Digital Block SpecificationsFunction Description Min Typ Max Units 21 .3V AC Analog Output Buffer Specifications AC Analog Output Buffer Specifications20 V AC Analog Output Buffer Specifications BW OB22 V AC External Clock Specifications AC External Clock SpecificationsAC Programming Specifications 23 .3V AC External Clock SpecificationsStandard Mode Fast Mode Symbol Description Min Max Units AC I2C Specifications25. AC Characteristics of the I2C SDA and SCL Pins TLOWI2C TSUDATI2CPackaging Dimensions Packaging InformationLead 150-Mil Soic Lead 300-Mil Molded DIP June 3 Document No -12009 Rev. *ELead 210-Mil Ssop Thermal Impedances Capacitance on Crystal PinsTypical Package Capacitance on Crystal Pins Thermal Impedances per PackageCY 8 C 22 xxx-SPxx Ordering InformationOrdering Code Definitions RowsRevision History CY8C22x13 Data Sheet Revision HistorySales and Company Information Copyrights