Cypress CY8C22113 manual Digital System, Analog System, CY8C22x13 Final Data Sheet PSoC Overview

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CY8C22x13 Final Data Sheet

PSoC™ Overview

 

 

processor. The CPU utilizes an interrupt controller with 10 vec- tors, to simplify programming of real time embedded events. Program execution is timed and protected using the included Sleep and Watch Dog Timers (WDT).

Memory encompasses 2 KB of Flash for program storage, 256 bytes of SRAM for data storage, and up to 2 KB of EEPROM emulated using the Flash. Program Flash utilizes four protec- tion levels on blocks of 64 bytes, allowing customized software IP protection.

The PSoC device incorporates flexible internal clock genera- tors, including a 24 MHz IMO (internal main oscillator) accurate to 2.5% over temperature and voltage. The 24 MHz IMO can also be doubled to 48 MHz for use by the digital system. A low power 32 kHz ILO (internal low speed oscillator) is provided for the Sleep timer and WDT. If crystal accuracy is desired, the ECO (32.768 kHz external crystal oscillator) is available for use as a Real Time Clock (RTC) and can optionally generate a crys- tal-accurate 24 MHz system clock using a PLL. The clocks, together with programmable clock dividers (as a System Resource), provide the flexibility to integrate almost any timing requirement into the PSoC device.

PSoC GPIOs provide connection to the CPU, digital and analog resources of the device. Each pin’s drive mode may be selected from eight options, allowing great flexibility in external interfac- ing. Every pin also has the capability to generate a system inter- rupt on high level, low level, and change from last read.

The Digital System

The Digital System is composed of 4 digital PSoC blocks. Each block is an 8-bit resource that can be used alone or combined with other blocks to form 8, 16, 24, and 32-bit peripherals, which are called user module references.

Port 1

 

Port 0

 

 

 

Digital Clocks

To System Bus

To Analog

From Core

 

 

System

 

 

 

 

 

 

DIGITAL SYSTEM

 

 

 

 

Digital PSoC Block Array

 

 

8

Configuration

 

Row 0

4

Row Output Configuration

8

8

DBB00

DBB01

DCB02

DCB03

8

RowInput

 

 

 

 

4

 

 

 

GIE[7:0]

Global Digital

GOE[7:0]

 

 

 

 

GIO[7:0]

Interconnect

GOO[7:0]

 

 

 

 

 

 

 

 

Digital System Block Diagram

Digital peripheral configurations include those listed below.

PWMs (8 to 32 bit)

PWMs with Dead band (8 to 32 bit)

Counters (8 to 32 bit)

Timers (8 to 32 bit)

UART 8-bit with selectable parity (up to 1)

SPI master and slave (up to 1)

I2C slave and master (1 available as a System Resource)

Cyclical Redundancy Checker/Generator (8 to 32 bit)

IrDA (up to 1)

Pseudo Random Sequence Generators (8 to 32 bit)

The digital blocks can be connected to any GPIO through a series of global buses that can route any signal to any pin. The buses also allow for signal multiplexing and for performing logic operations. This configurability frees your designs from the con- straints of a fixed peripheral controller.

Digital blocks are provided in rows of four, where the number of blocks varies by PSoC device family. This allows you the opti- mum choice of system resources for your application. Family resources are shown in the table titled “PSoC Device Charac- teristics” on page 3.

The Analog System

The Analog System is composed of 3 configurable blocks, each comprised of an opamp circuit allowing the creation of complex analog signal flows. Analog peripherals are very flexible and can be customized to support specific application requirements. Some of the more common PSoC analog functions (most avail- able as user modules) are listed below.

Analog-to-digital converters (one with 6- to 14-bit resolution, selectable as Incremental, Delta Sigma, and SAR)

Filters (two pole band-pass, low-pass, and notch)

Amplifiers (one with selectable gain to 48x)

Comparators (one with 16 selectable thresholds)

DACs (one with 6- to 9-bit resolution)

Multiplying DACs (one with 6- to 9-bit resolution)

High current output drivers (one with 30 mA drive as a Core Resource)

1.3V reference (as a System Resource)

Many other topologies possible

June 3, 2004

Document No. 38-12009 Rev. *E

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Contents PSoC Core FeaturesPSoC Functional Overview June Cypress MicroSystems, Inc Document No -12009 Rev. *EDigital System CY8C22x13 Final Data Sheet PSoC OverviewDigital System Block Diagram Analog SystemPSoC Device Characteristics PSoC Device CharacteristicsAnalog System Block Diagram Additional System ResourcesPSoC Designer Subsystems June 3 Document No -12009 Rev. *E Getting StartedDevelopment Tools PSoC Development Tool Kit June 3 Document No -12009 Rev. *E PSoC Designer Software SubsystemsHardware Tools Device Editor User Modules and Development Process Flow ChartUser Modules and the PSoC Development Process Application EditorTable of Contents Document Conventions1 8-Pin Part Pinout Pin InformationPinouts 2 20-Pin Part PinoutPin Part Pinout MLF CY8C22x13 Final Data Sheet Pin Information3 32-Pin Part Pinout CY8C22213 PSoC DeviceRegister Mapping Tables Register ReferenceRegister Conventions Abbreviations UsedBlank fields are Reserved and should not be accessed CY8C22x13 Final Data Sheet2. Register ReferenceName Addr 0,Hex Access Register Map Bank 0 Table User SpaceRegister Map Bank 1 Table Configuration Space Name Addr 1,Hex AccessUnits of Measure Electrical SpecificationsSymbol Unit of Measure Vdd VoltageOperating Temperature Operating TemperatureCY8C22x13 Final Data Sheet Electrical Specifications Absolute Maximum RatingsDC General Purpose IO Specifications DC Electrical CharacteristicsDC Chip-Level Specifications DC Chip-Level SpecificationsPsrr OA DC Operational Amplifier SpecificationsV DC Operational Amplifier Specifications Psrroa 3V DC Analog Output Buffer Specifications DC Analog Output Buffer SpecificationsV DC Analog Output Buffer Specifications Psrr OB10 V DC Analog Reference Specifications DC Analog Reference SpecificationsDC Analog PSoC Block Specifications 11 .3V DC Analog Reference SpecificationsDC POR and LVD Specifications 13. DC POR and LVD SpecificationsDC Programming Specifications 14. DC Programming Specifications15. AC Chip-Level Specifications AC Electrical CharacteristicsAC Chip-Level Specifications Tpllslewlow TOSAC General Purpose IO Specifications 16. AC Gpio SpecificationsBW OA AC Operational Amplifier Specifications17 V AC Operational Amplifier Specifications Bwoa Function Description Min Typ Max Units AC Digital Block Specifications19. AC Digital Block Specifications 21 .3V AC Analog Output Buffer Specifications AC Analog Output Buffer Specifications20 V AC Analog Output Buffer Specifications BW OB22 V AC External Clock Specifications AC External Clock SpecificationsAC Programming Specifications 23 .3V AC External Clock SpecificationsStandard Mode Fast Mode Symbol Description Min Max Units AC I2C Specifications25. AC Characteristics of the I2C SDA and SCL Pins TLOWI2C TSUDATI2CPackaging Dimensions Packaging InformationLead 150-Mil Soic Lead 300-Mil Molded DIP June 3 Document No -12009 Rev. *ELead 210-Mil Ssop Thermal Impedances Capacitance on Crystal PinsTypical Package Capacitance on Crystal Pins Thermal Impedances per PackageCY 8 C 22 xxx-SPxx Ordering InformationOrdering Code Definitions RowsRevision History CY8C22x13 Data Sheet Revision HistorySales and Company Information Copyrights