Cypress CY8C22213, CY8C22113 manual Document Conventions, Table of Contents

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CY8C22x13 Final Data Sheet

PSoC™ Overview

 

 

Document Conventions

Acronyms Used

The following table lists the acronyms that are used in this doc- ument.

Acronym

Description

AC

alternating current

 

 

ADC

analog-to-digital converter

 

 

API

application programming interface

 

 

CPU

central processing unit

 

 

CT

continuous time

 

 

DAC

digital-to-analog converter

 

 

DC

direct current

 

 

EEPROM

electrically erasable programmable read-only memory

 

 

FSR

full scale range

 

 

GPIO

general purpose IO

 

 

IO

input/output

 

 

IPOR

imprecise power on reset

 

 

LSb

least-significant bit

 

 

LVD

low voltage detect

 

 

MSb

most-significant bit

 

 

PC

program counter

 

 

POR

power on reset

 

 

PPOR

precision power on reset

 

 

PSoC™

Programmable System-on-Chip

 

 

PWM

pulse width modulator

 

 

RAM

random access memory

 

 

ROM

read only memory

 

 

SC

switched capacitor

 

 

SMP

switch mode pump

 

 

Units of Measure

A units of measure table is located in the Electrical Specifica- tions section. Table 3-1 on page 13 lists all the abbreviations used to measure the PSoC devices.

Numeric Naming

Hexidecimal numbers are represented with all letters in upper- case with an appended lowercase ‘h’ (for example, ‘14h’ or ‘3Ah’). Hexidecimal numbers may also be represented by a ‘0x’ prefix, the C coding convention. Binary numbers have an appended lowercase ‘b’ (e.g., 01010100b’ or ‘01000011b’). Numbers not indicated by an ‘h’ or ‘b’ are decimal.

Table of Contents

For an in depth discussion and more information on your PSoC device, obtain the PSoC Mixed Signal Array Technical Refer- ence Manual. This document encompasses and is organized into the following chapters and sections.

1. Pin Information

8

1.1 Pinouts

8

1.1.1

8-Pin Part Pinout

8

1.1.2

20-Pin Part Pinout

8

1.1.3

32-Pin Part Pinout

9

2. Register Reference

10

2.1

Register Conventions

10

 

2.1.1 Abbreviations Used

10

2.2

Register Mapping Tables

10

3. Electrical Specifications

13

3.1

Absolute Maximum Ratings

14

3.2

Operating Temperature

14

3.3

DC Electrical Characteristics

15

 

3.3.1

DC Chip-Level Specifications

15

 

3.3.2 DC General Purpose IO Specifications ....

15

 

3.3.3 DC Operational Amplifier Specifications ...

16

 

3.3.4 DC Analog Output Buffer Specifications ...

18

 

3.3.5 DC Analog Reference Specifications

19

 

3.3.6 DC Analog PSoC Block Specifications

19

 

3.3.7 DC POR and LVD Specifications

20

 

3.3.8

DC Programming Specifications

21

3.4

AC Electrical Characteristics

22

 

3.4.1

AC Chip-Level Specifications

22

 

3.4.2 AC General Purpose IO Specifications ....

24

 

3.4.3 AC Operational Amplifier Specifications ...

25

 

3.4.4 AC Digital Block Specifications

27

 

3.4.5 AC Analog Output Buffer Specifications ...

28

 

3.4.6 AC External Clock Specifications

29

 

3.4.7

AC Programming Specifications

29

 

3.4.8

AC I2C Specifications

30

4. Packaging Information

31

4.1

Packaging Dimensions

31

4.2

Thermal Impedances

34

4.3

Capacitance on Crystal Pins

34

5.

Ordering Information

35

 

5.1

Ordering Code Definitions

35

6.

Sales and Company Information

36

 

6.1

Revision History

36

 

6.2

Copyrights

36

June 3, 2004

Document No. 38-12009 Rev. *E

7

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Contents June Cypress MicroSystems, Inc Document No -12009 Rev. *E FeaturesPSoC Functional Overview PSoC CoreAnalog System CY8C22x13 Final Data Sheet PSoC OverviewDigital System Block Diagram Digital SystemAdditional System Resources PSoC Device CharacteristicsAnalog System Block Diagram PSoC Device CharacteristicsDevelopment Tools Getting StartedPSoC Designer Subsystems June 3 Document No -12009 Rev. *E Hardware Tools PSoC Designer Software SubsystemsPSoC Development Tool Kit June 3 Document No -12009 Rev. *E Application Editor User Modules and Development Process Flow ChartUser Modules and the PSoC Development Process Device EditorDocument Conventions Table of Contents2 20-Pin Part Pinout Pin InformationPinouts 1 8-Pin Part PinoutCY8C22213 PSoC Device CY8C22x13 Final Data Sheet Pin Information3 32-Pin Part Pinout Pin Part Pinout MLFAbbreviations Used Register ReferenceRegister Conventions Register Mapping TablesRegister Map Bank 0 Table User Space CY8C22x13 Final Data Sheet2. Register ReferenceName Addr 0,Hex Access Blank fields are Reserved and should not be accessedName Addr 1,Hex Access Register Map Bank 1 Table Configuration SpaceVdd Voltage Electrical SpecificationsSymbol Unit of Measure Units of MeasureAbsolute Maximum Ratings Operating TemperatureCY8C22x13 Final Data Sheet Electrical Specifications Operating TemperatureDC Chip-Level Specifications DC Electrical CharacteristicsDC Chip-Level Specifications DC General Purpose IO SpecificationsV DC Operational Amplifier Specifications DC Operational Amplifier SpecificationsPsrr OA Psrroa Psrr OB DC Analog Output Buffer SpecificationsV DC Analog Output Buffer Specifications 3V DC Analog Output Buffer Specifications11 .3V DC Analog Reference Specifications DC Analog Reference SpecificationsDC Analog PSoC Block Specifications 10 V DC Analog Reference Specifications13. DC POR and LVD Specifications DC POR and LVD Specifications14. DC Programming Specifications DC Programming SpecificationsAC Chip-Level Specifications AC Electrical Characteristics15. AC Chip-Level Specifications TOS Tpllslewlow16. AC Gpio Specifications AC General Purpose IO Specifications17 V AC Operational Amplifier Specifications AC Operational Amplifier SpecificationsBW OA Bwoa 19. AC Digital Block Specifications AC Digital Block SpecificationsFunction Description Min Typ Max Units BW OB AC Analog Output Buffer Specifications20 V AC Analog Output Buffer Specifications 21 .3V AC Analog Output Buffer Specifications23 .3V AC External Clock Specifications AC External Clock SpecificationsAC Programming Specifications 22 V AC External Clock SpecificationsTLOWI2C TSUDATI2C AC I2C Specifications25. AC Characteristics of the I2C SDA and SCL Pins Standard Mode Fast Mode Symbol Description Min Max UnitsPackaging Information Packaging DimensionsLead 300-Mil Molded DIP June 3 Document No -12009 Rev. *E Lead 150-Mil SoicLead 210-Mil Ssop Thermal Impedances per Package Capacitance on Crystal PinsTypical Package Capacitance on Crystal Pins Thermal ImpedancesRows Ordering InformationOrdering Code Definitions CY 8 C 22 xxx-SPxxCopyrights CY8C22x13 Data Sheet Revision HistorySales and Company Information Revision History