CY7C6431x CY7C64345, CY7C6435x
Electrical Characteristics
Absolute Maximum Ratings
Storage Temperature (TSTG)
Supply Voltage Relative to Vss (Vdd) | ||
DC Input Voltage (VIO) | Vss - 0.5V to Vdd + 0.5V |
DC Voltage Applied to
Electrostatic Discharge Voltage (ESD) (4) | .................... 2000V |
200 mA |
Operating Conditions
Ambient Temperature (TA) | 0oC to 70oC |
Operational Die Temperature (TJ)(6) | 0oC to 85oC |
DC Electrical Characteristics
DC Chip Level Specifications
Table 9 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.
Table 9. DC Chip Level Specifications
Parameter | Description | Conditions | Min | Typ | Max | Units |
Vdd | Supply Voltage | See table titled DC POR and LVD | 3.0 | – | 5.5 | V |
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| Specifications on page 17. |
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IDD24,3 | Supply Current, IMO = 24 MHz | Conditions are Vdd = 3.0V, TA = 25oC, | – | – | 3.1 | mA |
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| CPU = 24 MHz, |
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| No USB/I2C/SPI. |
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IDD12,3 | Supply Current, IMO = 12 MHz | Conditions are Vdd = 3.0V, TA = 25oC, | – | – | 2.0 | mA |
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| CPU = 12 MHz, |
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| No USB/I2C/SPI. |
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IDD6,3 | Supply Current, IMO = 6 MHz | Conditions are Vdd = 3.0V, TA = 25oC, | – | – | 1.5 | mA |
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| CPU = 6 MHz, |
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| No USB/I2C/SPI. |
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ISB1,3 | Standby Current with POR, LVD, and | Vdd = 3.0V, TA = 25oC, I/O regulator | – | – | 1.5 | μA |
| Sleep Timer | turned off. |
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ISB0,3 | Deep Sleep Current | Vdd = 3.0V, TA = 25oC, I/O regulator | – | 0.1 | – | μA |
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| turned off. |
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IDD24,5 | Supply Current, IMO = 24 MHz | Conditions are Vdd = 5.0V, TA = 25oC, | – |
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| mA |
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| CPU = 24 MHz, |
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| No USB/I2C/SPI. |
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IDD12,5 | Supply Current, IMO = 12 MHz | Conditions are Vdd = 5.0V, TA = 25oC, | – |
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| mA |
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| CPU = 12 MHz, |
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| No USB/I2C/SPI. |
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IDD6,5 | Supply Current, IMO = 6 MHz | Conditions are Vdd = 5.0V, TA = 25oC, | – |
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| mA |
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| CPU = 6 MHz, |
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| No USB/I2C/SPI. |
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ISB1,5 | Standby Current with POR, LVD, and | Vdd = 5.0V, TA = 25oC, I/O regulator | – |
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| μA |
| Sleep Timer | turned off. |
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ISB0,5 | Deep Sleep Current | Vdd = 5.0V, TA = 25oC, I/O regulator | – |
| – | μA |
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| turned off. |
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Notes
3.Higher storage temperatures reduce data retention time. Recommended storage temperature is +25°C ± 25°C. Extended duration storage temperatures above 85oC degrade reliability.
4.Human Body Model ESD.
5.According to JESD78 standard.
6.The temperature rise from ambient to junction is package specific. See Package Handling on page 25. The user must limit the power consumption to comply with this requirement.
Document Number: | Page 15 of 28 |
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