Cypress CY7C6435x, CY7C64345, CY7C6431x manual Package Diagram, Packaging Dimensions

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CY7C6431x

CY7C64345, CY7C6435x

Package Diagram

This section illustrates the packaging specifications for the enCoRe V USB device, along with the thermal impedances for each package.

Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of the enCoRe V emulation tools and their dimensions, refer to the development kit.

Packaging Dimensions

Figure 9. 16-Pin (3 x 3 mm) QFN

001-09116 *D

Document Number: 001-12394 Rev *G

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Contents Cypress Semiconductor Corporation 198 Champion Court FeaturesEnCoRe V Block Diagram Additional System Resources Functional OverviewGetting Started EnCoRe V CorePSoC Designer Software Subsystems Development ToolsGenerate, Verify, and Debug Configure ComponentsDesigning with PSoC Designer Select ComponentsNumeric Naming Document ConventionsAcronyms Used Units of MeasurePin Part Pinout QFN Pin No Type Name Description Pin ConfigurationPin Part Pinout QFN Pin Part Pinout QFN Pin No Type Pin Name Description CY7C64355/CY7C64356 48-Pin enCoRe V USB DeviceCY7C6431x Register Conventions Description Register ReferenceRegister Conventions Register Mapping TablesRegister Map Bank 0 Table User Space Name Addr 0,Hex AccessName Addr 1,Hex Access Register Map Bank 1 Table Configuration SpaceUnits of Measure Symbol Unit of Measure Electrical SpecificationsINL ADC Electrical SpecificationsAbsolute Maximum Ratings Electrical CharacteristicsDC Electrical Characteristics DC Chip Level SpecificationsDC General Purpose IO Specifications DC POR and LVD Specifications AC Chip Level Specifications AC Electrical CharacteristicsDC Programming Specifications 160 175 AC External Clock Specifications AC General Purpose I/O SpecificationsAC SPI Specifications Symbol Description Min Typ Max Units AC Programming SpecificationsAC SPI Specifications Definition of Timing for Fast/Standard Mode on the I2C Bus AC I2C SpecificationsPackaging Dimensions Package DiagramPin 5 x 5 x 0.55 mm QFN Pin 7 x 7 x 0.9 mm QFN Package HandlingOrdering Information Solder Reflow Peak TemperatureThermal Impedances TYJ/ARI Document HistoryWorldwide Sales and Design Support Products PSoC Solutions Sales, Solutions, and Legal Information