Cypress CY7C6435x manual Thermal Impedances, Solder Reflow Peak Temperature, Ordering Information

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CY7C6431x

CY7C64345, CY7C6435x

Thermal Impedances

Table 23. Thermal Impedances per Package

Package

Typical θJA (16)

16 QFN

32.69 oC/W

32 QFN(17)

19.51 oC/W

48 QFN(17)

17.68oC/W

Solder Reflow Peak Temperature

Following is the minimum solder reflow peak temperature to achieve good solderability.

Table 24.Solder Reflow Peak Temperature

Package

Minimum Peak Temperature(18)

Maximum Peak Temperature

16 QFN

240oC

260oC

32 QFN

240oC

260oC

48 QFN

240oC

260oC

Ordering Information

Ordering Code

Package

Flash

SRAM

No. of GPIOs

Target Applications

Information

 

 

 

 

 

CY7C64315-16LKXC

16-Pin QFN (3x3 mm)

16K

1K

11

Mid-tier FS USB dongle, RC-host

 

 

 

 

 

module

CY7C64315-16LKXCT

16-Pin QFN (Tape and Reel)

16K

1K

11

Mid-tier FS USB dongle, RC-host

 

(3x3 mm)

 

 

 

module

CY7C64316-16LKXC

16-Pin QFN (3x3 mm)

32K

2K

11

Hi-end FS USB dongle, RC-host

 

 

 

 

 

module

CY7C64316-16LKXCT

16-Pin QFN (Tape and Reel)

32K

2K

11

Hi-end FS USB dongle, RC-host

 

(3x3 mm)

 

 

 

module

CY7C64343-32LQXC

32-Pin QFN (3x3 mm)

8K

1K

25

Full speed USB mouse

 

 

 

 

 

 

CY7C64343-32LQXCT

32-Pin QFN (3X3 mm)

8K

1K

25

Full speed USB mouse

 

 

 

 

 

 

CY7C64345-32LQXC

32-Pin QFN

16K

1K

25

Full speed USB mouse

 

(5x5x0.55 mm)

 

 

 

 

CY7C64345-32LQXCT

32-Pin QFN (Tape and Reel)

16K

1K

25

Full speed USB mouse

 

(5x5x0.55 mm)

 

 

 

 

CY7C64355-48LTXC

48-Pin QFN

16K

1K

36

Full speed USB keyboard

 

(7x7x0.9 mm)

 

 

 

 

CY7C64355-48LTXCT

48-Pin QFN (Tape and Reel)

16K

1K

36

Full speed USB keyboard

 

(7x7x0.9 mm)

 

 

 

 

CY7C64356-48LTXC

48-Pin QFN

32K

2K

36

Hi-end FS USB keyboard

 

(7x7x0.9 mm)

 

 

 

 

CY7C64356-48LTXCT

48-Pin QFN (Tape and Reel)

32K

2K

36

Hi-end FS USB keyboard

 

(7x7x0.9 mm)

 

 

 

 

Notes

16.TJ = TA + Power x θJA.

17.To achieve the thermal impedance specified for the package, solder the center thermal pad to the PCB ground plane.

18.Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.

Document Number: 001-12394 Rev *G

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