CY7C6431x
CY7C64345, CY7C6435x
Thermal Impedances
Table 23. Thermal Impedances per Package
Package | Typical θJA (16) |
16 QFN | 32.69 oC/W |
32 QFN(17) | 19.51 oC/W |
48 QFN(17) | 17.68oC/W |
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 24.Solder Reflow Peak Temperature
Package | Minimum Peak Temperature(18) | Maximum Peak Temperature |
16 QFN | 240oC | 260oC |
32 QFN | 240oC | 260oC |
48 QFN | 240oC | 260oC |
Ordering Information
Ordering Code | Package | Flash | SRAM | No. of GPIOs | Target Applications | |
Information | ||||||
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16K | 1K | 11 | ||||
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| module | |
16K | 1K | 11 | ||||
| (3x3 mm) |
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| module | |
32K | 2K | 11 | ||||
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| module | |
32K | 2K | 11 | ||||
| (3x3 mm) |
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| module | |
8K | 1K | 25 | Full speed USB mouse | |||
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8K | 1K | 25 | Full speed USB mouse | |||
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16K | 1K | 25 | Full speed USB mouse | |||
| (5x5x0.55 mm) |
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16K | 1K | 25 | Full speed USB mouse | |||
| (5x5x0.55 mm) |
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16K | 1K | 36 | Full speed USB keyboard | |||
| (7x7x0.9 mm) |
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16K | 1K | 36 | Full speed USB keyboard | |||
| (7x7x0.9 mm) |
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32K | 2K | 36 | ||||
| (7x7x0.9 mm) |
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32K | 2K | 36 | ||||
| (7x7x0.9 mm) |
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Notes
16.TJ = TA + Power x θJA.
17.To achieve the thermal impedance specified for the package, solder the center thermal pad to the PCB ground plane.
18.Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with
Document Number: | Page 26 of 28 |
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